I used to purchase wafers from you in grad school and I purchased some sapphire substrates my first year here for a project. I was wondering if you knew much about the silicon wafer fabrication process. More specifically the kerf waste recovery methods silicon wafer manufactures implement. I have a project and we are trying to estimate the waste generated (around 40% for solar cell fabrication) but also account for waste recovery. There are a lot of waste recovery methods, but I don’t know what is commonly done in industry. Would you know or have any contracts who would know?
我在研究生院时曾向您购买过硅片，我在这里工作的第一年还为一个项目购买了一些蓝宝石衬底。我想知道你是否了解硅晶圆制造工艺。更具体地说，硅晶片制造商采用的切口废料回收方法。我有一个项目，我们正试图估算产生的废料（太阳能电池制造过程中产生的废料约占 40%），同时还要考虑废料回收。有很多废料回收方法，但我不知道工业界通常采用什么方法。您是否知道或有任何合同上的人知道？
Silicon Wafer Fabrication Techniques
硅晶圆制造技术
Silicon Wafer Fabrication and Kerf Waste Recovery
硅晶片制造和切口废料回收
A Power Systems Researcher requested help with the following wafer fabrication question.
一位电力系统研究人员请求帮助解决以下晶圆制造问题。
Reference #277031 for specs and pricing.
规格和价格请参考 #277031。
Wafer Fabrication Service
晶圆制造服务
A wafer fabrication consultant requested the following:
一位晶圆制造顾问提出以下要求：
I'm looking to find a company that can offer wafer fabrication as well as supplying the wafers. I've designed some optical SOI and SI3N4 ring resonator sensors and I need to get the wafers and the fabrication process done. Does your company provide the etching /fab process as well as supplying the wafers?
我想找一家既能提供晶圆制造又能提供晶圆的公司。我设计了一些光学 SOI 和 SI3N4 环形谐振器传感器，我需要获得晶圆并完成制造工艺。贵公司是否在提供晶圆的同时还提供蚀刻/制造工艺？
Si+sio2+si bonding process.
Si+sio2+si 键合过程。
We perform mask production/etching/pattern production/deposition/polishing/CMP/dicing processes. We have entered into business agreements with our company/researchers at national and public research institutes industrialization support centers at universities around the world.
我们从事掩膜生产/蚀刻/图案生产/沉积/抛光/CMP/切割工艺。我们已与本公司/研究人员在世界各地的国家和公共研究机构产业化支持中心签订了业务协议。
Please provide information about the required process, drawings, materials, etc.
请提供所需的工艺、图纸、材料等信息。
Referenc #134946 for specs and pricing.
规格和价格请参考 #134946。
Get Your Quote FAST! Or, Buy Online and Start Researching Today!
快速获取报价！或者，在线购买，今天就开始研究！
UniversityWafer, Inc. along with our partners provide a vast number of fabrication processes to deposit metals, grow thermal oxide, thin and dice wafer etc.
UniversityWafer, Inc. 与我们的合作伙伴一起提供了大量的制造工艺，用于沉积金属、生长热氧化物、薄化和切割晶圆等。
Please let send us your wafer specifications along with quantity for an immediate quote.
请将您的晶片规格和数量发送给我们，以便我们立即报价。
Optical Ring Resonator Sensor Fabrication
光环谐振器传感器制造
A Postgrad (PhD) requested help with the following:
一名研究生（博士）请求在以下方面提供帮助：
I'm a postgrad (Phd) and I'm looking to find a company that can 
offer wafer fabrication as well as supplying the wafers. I've designed some optical SOI and SI3N4 ring resonator sensors and I need to get the wafers and the fabrication process done. Does your company provide the etching /fab process as well as supplying the wafers?
我是一名研究生（博士），想找一家能提供晶圆制造和晶圆供应的公司。我设计了一些光学 SOI 和 SI3N4 环谐振器传感器，我需要获得晶圆并完成制造工艺。贵公司是否在提供晶圆的同时还提供蚀刻/制造工艺？
Reference #134946 for specs and pricing.
规格和价格请参考 #134946。
What is a Wafer Foundry?
什么是晶圆代工厂？
A semiconductor wafer foundry is a facility that makes chips. The process is extremely complex, requiring hundreds of processes to make a chip. The final chip may have many layers and can take weeks to create. In Taiwan, the first "pure-play" semiconductor foundry was created, Microchip Technology, which also provides foundry services to other companies. The cost of establishing a new semiconductor plant can run into billions of dollars.
半导体晶圆代工厂是制造芯片的设施。这个过程极其复杂，需要数百道工序才能制造出一个芯片。最终的芯片可能有很多层，需要数周时间才能制作完成。在台湾，第一家 "纯粹的 "半导体晶圆代工厂 Microchip Technology 诞生了，它还为其他公司提供晶圆代工服务。建立一家新的半导体工厂的成本可能高达数十亿美元。
The process of building a semiconductor wafer starts with the formation of a silicon oxide film. Once the silicon oxide film has been formed, contact holes are drilled into it. Tungsten is then deposited in the contact holes and polished to remove excess tungsten. This is known as plug-tungsten filling. The next step is photo resist patterning, where a resist pattern is formed on the wafer. Copper metal is deposited in the trenches. This process is called a single damascene.
半导体晶片的制造过程始于氧化硅薄膜的形成。氧化硅薄膜形成后，在上面钻出接触孔。然后在接触孔中沉积钨，并进行抛光以去除多余的钨。这就是所谓的塞钨填充。下一步是光阻图案化，即在晶片上形成光阻图案。金属铜沉积在沟槽中。这一过程称为单大马士革。
Another process is called Czochralski process. In this process, a solid silicon piece is placed in a bath of polycrystalline or molten silicon. As the liquid grows, it slowly pulls the silicon piece through rotation until it forms a cylindrical ingot. A finished wafer will look round. There are many different types of semiconductor foundries. Each of these types has their own unique capabilities and advantages.
另一种工艺称为 Czochralski 工艺。在这种工艺中，固体硅片被置于多晶硅或熔融硅的熔池中。随着液体的增长，它通过旋转缓慢地拉动硅片，直至形成圆柱形硅锭。成品硅片看起来是圆形的。半导体代工厂有许多不同类型。每种类型都有自己独特的能力和优势。
The automotive industry has a high demand for semiconductor devices. For example, advanced driver assistance systems, autonomous self-driving vehicles, and power electronics for electric vehicles all require a significant number of electronic devices. While the automotive industry is a very competitive market, it is still a very lucrative sector for foundries. While many of these devices do not require cutting-edge processes, there are many vendors that are interested in entering this sector.
汽车行业对半导体器件的需求量很大。例如，先进的驾驶员辅助系统、自动驾驶汽车和电动汽车的电力电子设备都需要大量的电子器件。虽然汽车行业是一个竞争非常激烈的市场，但对于代工厂来说，它仍然是一个利润丰厚的行业。虽然其中许多设备并不需要尖端工艺，但仍有许多供应商有意进入这一领域。
A semiconductor wafer foundry is a type of semiconductor foundry. The fabs are typically owned by the company that sells semiconductor chips. They manufacture these chips for third-party customers. A few examples of semiconductor chip manufacturing companies include Taiwan Semiconductor Manufacturing Company and GlobalFoundries. However, there are a number of different types of foundries. The process of creating the semiconductor chip is very complicated.
半导体晶圆代工厂是半导体代工厂的一种。晶圆厂通常归销售半导体芯片的公司所有。它们为第三方客户制造这些芯片。半导体芯片制造公司的几个例子包括台湾积体电路制造股份有限公司（Taiwan Semiconductor Manufacturing Company）和 GlobalFoundries。不过，代工厂也有许多不同类型。半导体芯片的制造过程非常复杂。
A semiconductor wafer is a predefined size. Its major sizes are 300mm and 200mm diameters. To create a semiconductor chip, you must first select the appropriate size for your project. For example, you can choose to produce a smaller or larger chip. A large-scale semiconductor wafer foundry can produce both small-scale and high-volume chips. Its size is the most important consideration for semiconductor manufacturing.
半导体晶片是一种预定尺寸。其主要尺寸为直径 300 毫米和 200 毫米。要制作半导体芯片，首先必须为项目选择合适的尺寸。例如，您可以选择生产较小或较大的芯片。大型半导体晶圆代工厂既能生产小型芯片，也能生产大批量芯片。它的尺寸是半导体制造最重要的考虑因素。
Today, there are many different types of semiconductor wafer foundries. These factories are usually located in Asia, with some of the largest ones being located in Taiwan. A semiconductor factory can be classified as a pure-play or non-pure-play wafer foundry. The former produces semiconductor ICs for other companies while a pure-play foundry mainly manufactures wafers for its own use.
如今，半导体晶圆代工厂种类繁多。这些工厂通常位于亚洲，其中最大的几家位于台湾。半导体工厂可分为纯晶圆代工厂和非纯晶圆代工厂。前者为其他公司生产半导体集成电路，而纯晶圆代工厂主要生产自用晶圆。
There are several different types of semiconductor foundries. A semiconductor wafer foundry can be a pure-play or a non-pure-play one. A pure-play semiconductor foundry is a company that produces its own ICs. A non-pure-play semiconductor foundry produces wafers that are sold to other companies. A pure-play semiconductor manufacturer will typically provide a complete set of semiconductor products.
半导体代工厂有几种不同类型。半导体晶圆代工厂可以是纯粹的代工厂，也可以是非纯粹的代工厂。纯粹的半导体晶圆代工厂是自己生产集成电路的公司。非纯半导体代工厂生产的晶圆出售给其他公司。纯半导体制造商通常会提供一整套半导体产品。
The first type is called a pure-play foundry. It is a semiconductor foundry that provides all of the necessary manufacturing services for a single product. These facilities are called a semiconductor foundry. They can produce chips using the same process as their customers. A pure-play semiconductor foundry can be either a non-pure-play or a pure-play company. The latter is a hybrid.
第一种类型被称为纯代工厂。它是为单一产品提供所有必要制造服务的半导体代工厂。这些设施被称为半导体代工厂。它们可以使用与客户相同的工艺生产芯片。纯粹的半导体代工厂可以是非纯粹的公司，也可以是纯粹的公司。后者是一种混合型企业。
The process begins with a blank silicon wafer. Then, circuits are built in layers in a clean room. The first step is to cut a semiconductor ingot. A diamond saw is used to cut a semiconductor ingot into thin wafers. The size of the chip depends on the diameter of the semiconductor ingot. Then, a CMOS ingot is cut into a single, circular, or square piece.
该工艺从空白硅晶圆开始。然后，在无尘室中分层构建电路。第一步是切割半导体锭。使用金刚石锯将半导体锭切割成薄晶片。芯片的大小取决于半导体锭的直径。然后，将 CMOS 晶棒切割成单片、圆形或方形。
The Silicon Wafer Fabrication Process
硅晶圆制造工艺
Silicon wafer fabrication involves transforming raw silicon into highly pure, defect-free wafers that serve as substrates for electronic and photonic devices. Here is an overview of the process:
硅晶片制造包括将原始硅转化为高纯度、无缺陷的晶片，作为电子和光子设备的基板。以下是该工艺的概述：
1. Raw Material Preparation
1.原材料制备
- Silicon Source: Quartzite (SiO₂) is the primary source of silicon.
硅源：石英岩（SiO₂）是硅的主要来源。 - Reduction: Silicon is extracted by heating quartzite with carbon in an electric arc furnace at ~2000°C to form metallurgical-grade silicon (MG-Si).
还原：硅的提取方法是在约 2000°C 的电弧炉中将石英岩与碳一起加热，形成冶金级硅 (MG-Si)。
SiO2+C→Si+CO2
2. Purification 2.净化
- Chemical Purification: Metallurgical-grade silicon is purified into electronic-grade silicon (EG-Si) or solar-grade silicon using the Siemens process:
化学提纯：采用西门子工艺将冶金级硅提纯为电子级硅 (EG-Si) 或太阳能级硅：- Silicon reacts with hydrogen chloride gas at ~300°C to form trichlorosilane (SiHCl₃).
硅在约 300°C 的温度下与氯化氢气体反应生成三氯硅烷（SiHCl₃）。 - Trichlorosilane is purified through distillation.
三氯硅烷是通过蒸馏提纯的。 - SiHCl3 is decomposed at ~1100°C to deposit pure silicon.
SiHCl3 在约 1100°C 的温度下分解，沉积出纯硅。
- Silicon reacts with hydrogen chloride gas at ~300°C to form trichlorosilane (SiHCl₃).
SiHCl3→Si+HCl
3. Crystal Growth (Ingot Formation)
3.晶体生长（铸锭形成）
- Czochralski (CZ) Method:
Czochralski (CZ) 方法：- A seed crystal is dipped into molten silicon and slowly pulled up while rotating.
将籽晶浸入熔融硅中，边旋转边慢慢拉起。 - Produces large, cylindrical single-crystal silicon ingots.
生产大型圆柱形单晶硅锭。
- A seed crystal is dipped into molten silicon and slowly pulled up while rotating.
- Float Zone (FZ) Method:
浮动区 (FZ) 法：- A high-purity silicon rod is passed through a localized heating zone.
高纯度硅棒通过局部加热区。 - Produces extremely pure single crystals, ideal for high-resistivity applications.
可产生纯度极高的单晶体，是高电阻率应用的理想之选。
- A high-purity silicon rod is passed through a localized heating zone.
- Orientation: The crystal's orientation ([100], [111], etc.) is determined during this step.
定向：在此步骤中确定晶体的方向（[100]、[111]等）。
4. Ingot Shaping 4.铸锭成型
- Trimming: Ingot ends are removed, and the ingot is ground into a cylindrical shape.
修整：去掉钢锭两端，将钢锭磨成圆柱形。 - Flat/Notch Marking: Orientation flats or notches are added to indicate crystal orientation and doping type.
平面/凹槽标记：添加定向平面或凹槽，以指示晶体定向和掺杂类型。
5. Wafer Slicing 5.晶片切片
- Wire Sawing: Thin diamond-coated wires slice the ingot into wafers of uniform thickness.
线切割：涂有金刚石的细线将铸锭切割成厚度均匀的晶片。 - Loss Minimization: Efforts are made to reduce kerf loss (wasted material during sawing).
损耗最小化：努力减少切口损失（锯切过程中浪费的材料）。
6. Wafer Surface Preparation
6.晶片表面处理
- Edge Rounding: Wafer edges are rounded to reduce the risk of chipping and cracking.
边缘倒圆角：晶片边缘滚圆，以降低崩裂和开裂的风险。 - Lapping/Grinding: Removes surface damage from slicing.
研磨：消除切片造成的表面损伤。 - Chemical Etching: Further removes surface defects and damage.
化学蚀刻：进一步去除表面缺陷和损伤。
7. Polishing 7.抛光
- Surface Planarization: Wafers are polished using a chemical-mechanical planarization (CMP) process to achieve a mirror-like finish.
表面平面化：采用化学机械平坦化 (CMP) 工艺对晶片进行抛光，使其达到镜面效果。 - DSP vs. SSP:
DSP 与 SSPSSP：
- Double-side polished (DSP): Both sides are polished, typically for SOI or MEMS applications.
双面抛光（DSP）：双面抛光，通常用于 SOI 或 MEMS 应用。 - Single-side polished (SSP): Only one side is polished, common for most applications.
单面抛光（SSP）：只抛光一面，常见于大多数应用中。
- Double-side polished (DSP): Both sides are polished, typically for SOI or MEMS applications.
8. Cleaning 8.清洁
- Ultrasonic and Chemical Cleaning: Removes contaminants, particles, and residues.
超声波和化学清洗：去除污染物、颗粒和残留物。 - RCA Cleaning:
RCA 清洁：
- Removes organic contaminants.
去除有机污染物 - Oxidizes the surface and removes ionic impurities.
氧化表面，去除离子杂质。
- Removes organic contaminants.
9. Inspection and Quality Control
9.检查和质量控制
- Dimensional Accuracy: Diameter, thickness, and flatness are measured.
尺寸精度：测量直径、厚度和平面度。 - Surface Quality: Checked for defects like scratches, pits, or particles.
表面质量：检查是否有划痕、凹坑或颗粒等缺陷。 - Crystallographic Properties: Orientation, resistivity, and doping levels are verified.
晶体学特性：验证定向、电阻率和掺杂水平。
10. Packaging 10.包装
- Cleanroom Packaging: Wafers are placed in cassettes and sealed in clean, anti-static packaging to prevent contamination during transport.
无尘室包装：晶圆装入盒中，密封在洁净的防静电包装中，以防止在运输过程中受到污染。
This highly controlled process ensures the wafers meet the stringent requirements of semiconductor device manufacturing.
这种高度受控的工艺可确保晶片符合半导体设备制造的严格要求。
What is the Most Common Silicon Wafer Fabrication Process?
最常见的硅晶圆制造工艺是什么？
The most common silicon wafer fabrication process in the semiconductor industry is the Czochralski (CZ) 
process. This process is widely used for producing single-crystal silicon wafers, which are the foundational material for most semiconductor devices, including integrated circuits and solar cells.
半导体行业最常见的硅晶片制造工艺是 Czochralski（CZ）工艺。这种工艺广泛用于生产单晶硅片，而单晶硅片是大多数半导体器件（包括集成电路和太阳能电池）的基础材料。
Here's a brief overview of the Czochralski process:
以下是 Czochralski 流程的简要概述：
-
Silicon Melting: Pure silicon is melted in a quartz crucible at high temperatures (over 1400°C).
熔硅：纯硅在石英坩埚中高温熔化（超过 1400°C）。 -
Seed Crystal Introduction: A small single-crystal silicon seed is dipped into the molten silicon. The seed crystal's crystallographic orientation determines the orientation of the grown crystal.
籽晶介绍：将一颗小的单晶硅籽晶浸入熔融硅中。籽晶的晶体学取向决定了生长出的晶体的取向。 -
Crystal Growth: The seed is slowly pulled upwards and rotated simultaneously. As it is pulled, silicon from the melt attaches to the seed and crystallizes.
晶体生长：种子被缓慢地向上拉起并同时旋转。在拉动过程中，熔体中的硅会附着在种子上并结晶。 -
Diameter Control: By carefully controlling the temperature, the pull rate, and the rotation speed, the diameter of the crystal can be managed.
直径控制：通过仔细控制温度、拉力和转速，可以控制晶体的直径。 -
Crystal Shaping: The grown cylindrical single crystal, known as a boule, is then ground and shaped to have a perfect circular cross-section.
晶体成型：生长出来的圆柱形单晶体被称为 "球"（boule），然后经过研磨和塑形，使其具有完美的圆形横截面。 -
Wafer Slicing: The boule is sliced into thin wafers using a diamond saw or a wire saw.
切片：用金刚石锯或线锯将面包切成薄片。 -
Surface Finishing: The wafers are polished to achieve a smooth and defect-free surface, which is crucial for subsequent semiconductor device fabrication.
表面抛光：对晶片进行抛光，以获得光滑、无缺陷的表面，这对后续半导体器件的制造至关重要。
While the Czochralski process is the most common, there are other methods as well, such as the Float Zone (FZ) process, which is used in specific applications where higher purity and defect-free silicon is required. However, due to its scalability and cost-effectiveness, the CZ process remains the dominant method for silicon wafer fabrication in the industry.
虽然 Czochralski 工艺是最常见的方法，但也有其他方法，如浮动区（FZ）工艺，该工艺用于需要更高纯度和无缺陷硅的特定应用中。然而，由于其可扩展性和成本效益，CZ 工艺仍然是业内硅晶片制造的主要方法。
What are Some Silicon Wafer Fabrication Techniques
有哪些硅晶圆制造技术
The process of producing semiconductor chips includes thousands of steps and can take as long as three 
months from conception to production. The first step involves cutting a thin piece of silicon wafer using a diamond saw. The silicon wafer is then cut into 'dies,' which can contain hundreds or thousands of chips. After cutting the wafer into the desired size, it must be annealed. This process is called sputtering.
半导体芯片的生产过程包括数千个步骤，从构思到生产可能需要长达三个月的时间。第一步是用金刚石锯切割一片薄薄的硅晶片。然后将硅片切割成 "芯片"，"芯片 "可包含数百或数千个芯片。将硅片切割成所需尺寸后，必须对其进行退火处理。这一过程称为溅射。
After annealing, the silicon ingot is sliced into blocks with a diameter specified in the process. The peripheral is then ground to a specified diameter. The orientation of the crystal is indicated by a flat or notch on the surface of the wafer. Large and small diameter wafers are sliced using a laser-grinding process. Both of these processes are critical to the final Si material. Several processes are then used to polish the silicon crystals and make them as smooth as possible.
退火后，硅锭被切成工艺中指定直径的块。然后将外围研磨成指定直径。晶体的方向通过晶片表面的平面或凹槽来表示。大直径和小直径晶片均采用激光研磨工艺切片。这两种工艺对最终的硅材料至关重要。然后要经过几道工序对硅晶体进行抛光，使其尽可能光滑。
Deposition is the process of growing or coating materials onto the silicon wafer. Some of the deposition techniques used to achieve this include chemical vapor deposition, physical vapor deposition, electrochemical deposition, molecular beam epitaxy, and thermal oxidation. The next step in the process is to remove the materials. Chemical etching, atomic layer deposition, and mechanical planarization are all effective against specific types of elements.
沉积是在硅晶片上生长或涂覆材料的过程。用于实现这一目的的一些沉积技术包括化学气相沉积、物理气相沉积、电化学沉积、分子束外延和热氧化。工艺的下一步是去除材料。化学蚀刻、原子层沉积和机械平面化对特定类型的元素都很有效。
The next step in silicon wafer fabrication is slicing. The slicing process creates a surface defect known as a saw mark. Lapping removes the saw marks and makes the wafer thinner. This also relieves the stress associated with slicing. After the lapping process, silicon wafers undergo an etching and cleaning process. The acetic and nitric acids are used to remove microscopic cracks and surface damage. The resulting material is then sliced and subsequently subjected to a series of manufacturing processes to ensure accuracy and smoothness.
硅晶片制造的下一步是切片。切片过程中会产生被称为锯痕的表面缺陷。研磨可以去除锯痕，使硅片更薄。这也减轻了与切片相关的应力。在研磨过程之后，硅晶片还要经过蚀刻和清洗过程。醋酸和硝酸用于去除微小裂缝和表面损伤。然后将得到的材料切片，再经过一系列制造工序，以确保精度和光滑度。
The Czochralski method uses a small piece of solid silicon. It is placed in a polycrystalline silicon bath and slowly pulled into a cylindrical ingot. The finished wafer is a round disc. However, the Czochralski technique is more expensive than the other two. It is a relatively complex process. After sputtering, the crystal is ground. Once the surface has been cleaned, the silicon wafer is placed in the polishing bath.
Czochralski 法使用一小块固体硅。将其放入多晶硅槽中，慢慢拉成圆柱形硅锭。成品硅片是一个圆形圆盘。不过，Czochralski 技术比其他两种技术更昂贵。这是一种相对复杂的工艺。溅射后，晶体要进行研磨。表面清洁后，将硅晶片放入抛光浴中。
The sputtering process involves the removal of rough spots and making the surface smoother. The sputtering process is an efficient and cost-effective way to polish silicon wafers. Depending on the size of the wafer, the final product may have a varying p-well or a single channel of the same type of hole. The final sputtering step is important because it makes it easier to see the shape of the in-plane structures that are used in IC production.
溅射工艺包括去除粗糙点，使表面更加光滑。溅射工艺是一种高效、经济的硅片抛光方法。根据硅片的大小，最终产品可能会有不同的 p 孔或同类型孔的单通道。最后的溅射步骤非常重要，因为它使集成电路生产中使用的平面内结构的形状更容易看清。
The Czochralski method begins by exposing a small piece of solid silicon to a bath of molten polycrystalline silicon. Once the silicon sputtering solution reaches the desired temperature, it is shaped into a cylindrical ingot. The sputtering process is an excellent way to make thin, round silicon wafers that are ideal for use in electronics. After the process is complete, the silicon wafer is polished to produce the finished product.
Czochralski 方法首先将一小块固体硅暴露在熔融多晶硅浴中。一旦硅溅射溶液达到所需的温度，它就会被塑造成一个圆柱形硅锭。溅射工艺是制造薄而圆的硅晶片的绝佳方法，非常适合用于电子产品。工艺完成后，对硅晶片进行抛光，生产出成品。
Once the silicon wafer is fully grown, it is sliced again. After slicing, the silicon wafers are examined under high intensity lights. This process is vital because it prevents the silicon from developing defects. After the lapping procedure, the silicon wafers are packaged and shipped in an airtight plastic bag to avoid contamination. There are several other steps in the fabrication process. The first step is slicing.
硅晶片完全长成后，再次进行切片。切片后，在高亮度灯光下对硅片进行检查。这一过程至关重要，因为它可以防止硅产生缺陷。研磨过程结束后，硅片被装在密闭的塑料袋中进行包装和运输，以避免污染。制造过程中还有其他几个步骤。第一步是切片。
The next step in the process of silicon wafer fabrication involves adding dopants. These are elements from Groups 3 and 4 of the periodic table that affect the properties of the molten silicon. The range of dopants is extensive, but some common elements include Boron, Antimony, and Arsenic. A high concentration of dopants is essential for the production of semiconductors. The final step is the lithography stage.
硅晶片制造工艺的下一步是添加掺杂剂。这些元素来自元素周期表的第 3 和第 4 族，会影响熔融硅的特性。掺杂剂的范围很广，但一些常见的元素包括硼、锑和砷。高浓度的掺杂剂对半导体的生产至关重要。最后一步是光刻阶段。
The Czochralski method is the most popular of the silicon wafer fabrication techniques. The Czochralski method involves using a polycrystalline silicon ingot and adding dopants that give the desired electrical properties. A typical N-type ingot contains phosphorus and boron. Its high purity allows it to be used for a variety of applications, including semiconductor devices. The thickness of the silicon wafer is crucial for the semiconductors.
Czochralski 法是最流行的硅晶片制造技术。Czochralski 法包括使用多晶硅锭并添加掺杂剂，以获得所需的电气性能。典型的 N 型硅锭含有磷和硼。它的高纯度使其可用于各种应用，包括半导体器件。硅片的厚度对半导体至关重要。
Silicon Wafer Fabrication Production Process
硅晶片制造生产流程
In this article, we will look closely at what makes silicon wafer production process different from other silicon manufacturing processes. [Video]
在本文中，我们将仔细研究硅晶片生产工艺与其他硅生产工艺的不同之处。视频
How Do You Fabricate Integrated Circuits?
如何制造集成电路？
The design of an integrated circuit requires a series of manufacturing steps, in which 
precise amounts of chemicals are injected into selected areas of a silicon wafer to form microscopic devices and compounds. A single silicone wafer goes through hundreds of process steps before the finished wafers are ready, leading to the production of ingots that are fed into electronic products. This gradually reduces the ASP of the ingot, which in turn lowers production costs. The lower ASP for silicon The reason for this is the pressure from the solar and PV cell industry. [Sources: 3, 4, 9, 11]
集成电路的设计需要一系列制造步骤，在硅晶片的选定区域注入精确量的化学物质，以形成微观器件和化合物。一块硅晶片要经过数百个工艺步骤才能制成成品，最终生产出的硅锭被输送到电子产品中。这就逐渐降低了硅锭的平均售价，从而降低了生产成本。硅的平均售价降低的原因是来自太阳能和光伏电池行业的压力。[资料来源：3、4、9、11］
The huge capital investment of the G450C consortium participants has become sustainable, as the consortium also ensures the ability to generate a steady demand for newly produced silicon. However, it will take several years for new suppliers to meet the demand for the next generation of high-end electronics from new silicon wafers. [Sources: 1, 9]
G450C 联合企业参与者的巨额资本投资已成为可持续的投资，因为该联合企业还确保了对新生产的硅片产生稳定需求的能力。然而，新的供应商还需要几年时间才能用新硅片满足下一代高端电子产品的需求。[资料来源：1、9］
This would help us to analyse the market for semiconductor wafer factories in the future. This would help us to analyze the silicon wafers, fabs, devices and the market for the next generation of high-end electronics and other semiconductors in our market. [Sources: 2]
这将有助于我们分析未来的半导体晶圆厂市场。这将有助于我们分析硅晶圆、晶圆厂、设备以及下一代高端电子产品和其他半导体的市场。[资料来源：2］
The semiconductor wafer fab equipment market is divided into three major segments: silicon wafers, fab fab devices, devices and equipment. Apart from that, it is dominated by various types of devices such as semiconductors, chipsets, components and other materials. Monitoring the wafer production environment includes monitoring the temperature, humidity, temperature and humidity that the silicon wafer is exposed to, which can negatively affect its production yield. [Sources: 2, 14]
半导体晶圆厂设备市场分为三大块：硅晶圆、晶圆厂设备、设备和设备。除此之外，半导体、芯片组、元件和其他材料等各类设备也是市场的主导。硅片生产环境监测包括监测硅片所处的温度、湿度、温度和湿度，这些因素都会对硅片的生产良率产生负面影响。[资料来源：2，14］
The pertinent observation is that the scope of functioning of silicon wafers is much higher than that of compound semiconductors. The above data analysis has taught us that in order to ensure the quality of the silicon produced in semiconductor wafer factories, it should not be used in the manufacture of electronic products. In the manufacture of top-class silicon wafers, manufacturers rely on wathers specialists such as Pure Wafer to help test top-class shafts and support the films to fully optimize the production process. [Sources: 3, 9, 11]
与此相关的是，硅晶片的功能范围远远高于化合物半导体。上述数据分析告诉我们，为了确保半导体硅片工厂生产的硅片的质量，不应将其用于制造电子产品。在制造顶级硅片的过程中，制造商需要依靠像 Pure Wafer 这样的硅片专家来帮助测试顶级轴和支持薄膜，以全面优化生产过程。[资料来源：3、9、11]
With continued investment in innovation, UniversityWafer, Inc. was founded to keep pace with the next generation of semiconductor technologies. We also offer special services, including the production of high quality silicon wafers for medical and electronic products. UniversityWafer, Inc. collaborates with some of the largest medical electronics manufacturers in the country and provides the highest quality silicon wafer manufacturing equipment and services. Through America's leading research and science universities, we provide the best education, training, and technical support to the medical industry. [Sources: 10, 11]
UniversityWafer, Inc.的成立是为了跟上下一代半导体技术的发展步伐。我们还提供特殊服务，包括生产用于医疗和电子产品的高质量硅晶圆。UniversityWafer, Inc. 与美国一些最大的医疗电子产品制造商合作，提供最高质量的硅晶圆生产设备和服务。通过美国一流的研究和科学大学，我们为医疗行业提供最好的教育、培训和技术支持。[资料来源：10、11］
Our wafers are not the only place where silicon is used, and they are not even close to the largest consumer silicon. UniversityWafer, Inc. has been selected by some of the leading military contractors in the US Army, Navy, Air Force, Marine Corps, Army Corps of Engineers, Department of Defense and many other government agencies. The UniversityWafer, Inc. website is one of the few that provides access to a comprehensive list of equipment and services for the production of silicon wafers. Our two leading suppliers demonstrate our ability to produce flawless silicon wafers, controlling more than 90% of the world's medical electronics and medical device production capacity, as well as the vast majority of the world's medical devices. [Sources: 0, 6, 10, 12]
我们的晶圆并不是唯一使用硅的地方，甚至还比不上最大的消费硅。UniversityWafer, Inc. 已被美国陆军、海军、空军、海军陆战队、陆军工程兵团、国防部和许多其他政府机构的一些主要军事承包商选中。UniversityWafer, Inc. 网站是为数不多的提供硅片生产设备和服务综合清单的网站之一。我们的两家领先供应商证明了我们有能力生产完美无瑕的硅晶圆，控制着全球 90% 以上的医疗电子和医疗设备生产能力，以及全球绝大多数的医疗设备。[来源：0、6、10、12]
Many of China's domestic silicon suppliers supply wafers up to 150mm or smaller, but silicon wafer manufacturers are experiencing booming demand, resulting in tight supply and high prices for wafers. [Sources: 1, 5]
中国国内的许多硅片供应商都供应 150 毫米或更小的硅片，但硅片生产商的需求却在不断增长，导致硅片供应紧张，价格高企。[资料来源：1，5］
While China's silicon wafer suppliers continue to lag behind international peers in manufacturing capacity, the region's silicon production ecosystem is maturing and becoming more integrated. Due to the rapid growth of silicon production in China, according to a recent report by the Chinese Academy of Sciences, the country's central and local governments have enabled the financing of several silicon wafer production projects in recent years. [Sources: 1]
虽然中国的硅片供应商在生产能力方面仍然落后于国际同行，但该地区的硅片生产生态系统正日趋成熟，并变得更加一体化。根据中国科学院最近的一份报告，由于中国硅生产的快速增长，近年来中国的中央和地方政府已促成了多个硅片生产项目的融资。[资料来源：1］
The Wafer Semiconductor Factory (FAB), built in India, is the first of its kind in the world and an indication of what India can do in terms of silicon wafer production capacity and supply chain integration. The idea of setting up a wafer production facility for S-semiconductors [F AB] unit in India is a clear indication that India could do well as a major silicon manufacturing center in the Asia-Pacific region. [Sources: 8]
在印度建立的晶圆半导体工厂（FAB）是世界上首家此类工厂，它表明了印度在硅晶圆生产能力和供应链整合方面的能力。在印度建立 S 型半导体[F AB]单位的硅片生产设施的想法清楚地表明，印度作为亚太地区的一个主要硅生产中心，可以做得很好。[资料来源：8］
The five largest wafer manufacturers, which generate more than 90 percent of the market revenue, are the first to do so. The advantage of working with larger diameters is more pronounced, as the basic material costs for compound semiconductors are lower. More recently, the ability to build these devices at a lower cost per square inch than traditional semiconductor wafers has led the industry to produce a wide range of high-performance, low-power devices. Cooperation is essential to ensure lower costs and better product quality for the consumer and commercial markets. [Sources: 1, 3, 7, 9]
占市场收入 90% 以上的五大晶圆制造商率先这样做。由于化合物半导体的基本材料成本较低，使用更大直径的优势更为明显。最近，由于能够以比传统半导体晶片更低的每平方英寸成本制造这些器件，业界开始生产各种高性能、低功耗的器件。合作对于确保为消费和商业市场降低成本和提高产品质量至关重要。[资料来源：1、3、7、9］
Sources: 资料来源
[0]: https://blog.lamresearch.com/silicon-wafers-and-more/
[1]: https://roboticsandautomationnews.com/2019/01/10/china-silicon-wafer-production-capacity-growth-fastest-in-the-world-says-semi/20480/
[2]: https://www.transparencymarketresearch.com/semiconductor-wafer-fab-equipment.html
[3]: https://www.businesswire.com/news/home/20191106005708/en/Global-Semiconductor-Silicon-Wafer-Market-Report-2019
[4]: https://www.computerhistory.org/revolution/digital-logic/12/288
[5]: https://semiengineering.com/mixed-outlook-for-silicon-wafer-biz/
[6]: https://www.universitywafer.com/top-things-you-should-know-about-silicon-wafer.html
[7]: https://patents.google.com/patent/US6312525B1/en
[8]: https://analyticsindiamag.com/india-semiconductor-chip-manufacturing/
[9]: https://www.semi.org/en/macroeconomics-450mm-wafers
[11]: https://www.globenewswire.com/news-release/2020/08/13/2078320/0/en/Pure-Wafer-s-Announces-wafersontheweb-com-Largest-Selection-of-Prime-and-Test-Grade-Silicon-Wafers-for-Semiconductor-Fabrication.html
[12]: https://www.tel.com/museum/magazine/material/150430_report04_03/02.html
[14]: https://www.thermofisher.com/ca/en/home/industrial/manufacturing-processing/manufacturing-processing-learning-center/electronics-information/semiconductor-analysis-imaging-metrology-information/chemical-analysis-semiconductor-fabs-process-wafer-environment.html
Do all solar cell manufactures recycle their Kerf or is it only some percentage of them?
是否所有太阳能电池制造商都会回收他们的 Kerf，还是只有部分制造商会这样做？
Waste from the silicon cutting or polishing process is filtered through a filter, then the ground powder is 
separated and reused for sandblasting and abrasive production. Depending on the size of the powder, it is separated into powders ranging in size from #100 to #3000. The manufacturer pays a fee to process the waste, and the processor receives a fee. After collection, a recycling company reprocesses the product and resells the product. Separation uses various methods such as /filter /centrifugation/sedimentation/chemical treatment/temperature heating...etc.
硅切割或抛光过程中产生的废料通过过滤器过滤，然后将研磨粉分离出来，重新用于喷砂和磨料生产。根据粉末的大小，它们被分离成大小从 #100 到 #3000 不等的粉末。生产商支付一定的废料处理费，处理商则收取一定的费用。收集后，回收公司对产品进行再加工并转售。分离采用各种方法，如/过滤/离心/沉淀/化学处理/温度加热......等。