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10473,第 8 期

Q150T S/E/ES plus 使用说明书
Q150T S/E/ESplus 使用说明书

有关技术和 应用建议,请访问www.Quorumtech 的。com
有关技术和应用建议 ,请访问 wwwQuorumtech 的。com

问题

日期

修订者

1

03/06/10

初始问题

SRM

2

20/08/10

辉光放电更新

SRM

3

31/01/12

配方, 孔径清洁更新, 涂层
配方, 孔径清洁更新,涂层

SRM

4

04/02/13

供气材成型说明、除气
供气 材成型说明、除气

SRM

5

12/06/14

添加受控脉冲和其他校正

SRM

6

03/08/15

CE 更新和新的警告消息
CE 更新和新的警告消息

SRM

7

19/07/16

替换目标表
替换目标表的更新
更新

SRM

8

31/08/18

Plus 模型修订版
Plus 模型修订版

SRM

免責聲明
免責聲明

本文档 中描述的 组件软件包相互 兼容 ,并保证满足或超过已发布的 性能规格。 但是在这些 组件存在 的情况下,不能 提供性能保证 Quorum Technologies Ltd
本文档中描述的组件软件包相互兼容 ,并保证满足或超过已发布的性能规格。 但是 如果这些组件公司提供的设备一起使用,则不能提供性能保证 QuorumTechnologiesLtd. 公司
. 以外的 公司提供的 设备一起使用
本文档中描述的组件软件包相互兼容 ,并保证满足或超过已发布的性能规格。 但是 在这些组件存在的情况下,不能提供性能保证QuorumTechnologiesLtd. 以外的公司提供的设备一起使用

www.quorumtech.com

Quorum Technologies Limited 公司编号 04273003
QuorumTechnologiesLimited 公司编号 04273003

注册办公地址Unit 19, Charlwoods Road East GrinsteadWest Sussex RH19 2HL UK
注册办公地址 Unit19, Charlwoods Road,East GrinsteadWestSussex,RH 19 2HL,UK

Q150T S/E/ES

内容
内容

本章节内容
本章节内容

1 引言 8
1 引言 8

1.1 概述 8
1.1 概述 8

1.2 溅射镀膜 9
1.2 溅射镀膜 9

1.3 涂层 9
1.3涂层 9

1.4 金属蒸发 10
1.4 金属蒸发 10

1.5 孔径清洁 10
1.5 孔径清洁 10

1.6 辉光放电 10
1.6 辉光放电 10

2 安装 11
2 安装 11

2.1 预装 11
2.1 预装 11

2.1.1 所需服务 ............................................................................................11
2.1.1 所需服务 ............................................................................................11

2.2 开箱 12
2.2 开箱 12

2.3 连接 13
2.3 连接 13

2.3.1 气体连接 14
2.3.1 气体连接 14

2.3.2 电气连接 15

2.3.3 辅助网络连接 16
2.3.3 辅助网络连接 16

2.3.4 USB连接 16
2.3.4 USB 连接 16

2.3.5 真空连接 16
2.3.5 真空连接 16

2.4 安装标准 Stage 17
2.4 安装标准 Stage 17

2.5 状态指示 18
2.5 状态指示 18

2.6 音频 18
2.6 音频 18

3 19
3 19

3.1 第一次 开机 19
3.1 第一次开机 19

3.2 主屏幕 19
3.2 主屏幕 19

3.3 运行配方 20
3.3 运行配方 20

4 使用配方 22
4 使用配方 22

4.1.1 创建新的 配方....................................................................................23
4.1.1 创建新的配方 ....................................................................................23

4.1.2 编辑配方参数..............................................................................24
4.1.2 编辑配方参数 ..............................................................................24

4.1.3 复制 配方..............................................................................................25
4.1.3 复制配方 ..............................................................................................25

4.1.4 重命名 配方..........................................................................................25
4.1.4 重命名配方 ..........................................................................................25

4.1.5 删除 配方.............................................................................................25
4.1.5 删除配方 .............................................................................................25

4.2 材料 26
4.2 材料 26

4.3 材料清单 26
4.3 材料清单 26

4.3.1 创建新 材质..................................................................................27
4.3.1 创建新材质 ..................................................................................27

4.3.2 编辑材质参数 ...........................................................................27
4.3.2 编辑材质参数 ...........................................................................27

4.3.3 删除 材质...........................................................................................28
4.3.3 删除材质 ...........................................................................................28

5 申请指南 29
5 申请指南 29

5.1 定时溅射 29
5.1 定时溅射 29

5.1.1 SEM 工作.........................................................................................29
5.1.1 SEM 工作 .........................................................................................29

5.1.2 用于发射 SEM .............高分辨率 SEM 涂层 ....................29
5.1.2 用于发射 SEM .............高分辨率 SEM 涂层 ....................29

5.1.3 铝薄膜 29
5.1.3 铝薄膜 29

5.2 FTM 溅射.....................................................................................................................30
5.2 FTM 溅射 .....................................................................................................................30

5.2.1 用于发射 SEM .............高分辨率 SEM 涂层 ....................30
5.2.1 用于发射 SEM .............高分辨率 SEM 涂层 ....................30

5.2.2 一般薄膜 涂层...............................................................................31
5.2.2 一般薄膜涂层 ...............................................................................31

5.3 金属蒸发..........................................................................................................31
5.3 金属蒸发 ..........................................................................................................31

5.3.1 如何 获得 20nm 涂层.............................................................31
5.3.1 如何获得 20nm涂层 .............................................................31

5.4 脉冲蒸发...............................................................................................32
5.4 脉冲蒸发 ...............................................................................................32

5.4.1 如何 创建 20nm 涂层.......................................................... 32
5.4.1 如何创建 20nm涂层 .......................................................... 32

www.quorumtech.com 3 10473 - 第 8

5.5 受控脉冲线 E蒸发 33
5.5 受控脉冲线 E 蒸发 33

5.5.1 为 EBSD 33
5.5.1 为 EBSD33 创建 15nm 至 2nm 的涂层
创建 15nm 至 2nm 的涂层
5.5.1 为 EBSD 33 创建 15nm 至 2nm 的涂层

5.6 脉冲蒸发 34
5.6 脉冲蒸发 34

5.6.1 如何 SEM 创建导电r 34
5.6.1 如何SEM 创建导电r34

5.7 使用排气选项 35
5.7 使用排气选项 35

5.7.1 设置排气选项 36
5.7.1 设置排气选项 36

5.7.2 运行多次放气 36
5.7.2 运行多次放气 36

5.8 斜坡配方 37
5.8 斜坡配方 37

5.8.1 碳嵌件设置 37
5.8.1 碳嵌件设置 37

5.8.2 定时斜坡配方 38
5.8.2 定时斜坡配方 38

5.8.3 调整涂层厚度 39
5.8.3 调整涂层厚度 39

5.8.4 如何为 TEM 40
5.8.4 如何为 TEM40 创建支撑
创建 支撑

5.8.5 如何创建导电层 f SEM 41
5.8.5 如何创建导电层 fSEM41

5.8.6 FTM 42
5.8.6FTM 42 控制的厚度斜坡
控制的厚度斜坡
5.8.6 由 FTM 42 控制的厚度斜坡碳

5.9 辉光放电 43
5.9 辉光放电 43

5.9.1 亲 水性 43
5.9.1 亲水性 43

5.9.2 表面清洁 43
5.9.2 表面清洁 43

5.10 光圈清洁 44
5.10 光圈清洁 44

6 仪器设置 46
6 仪器设置 46

6.1.1 日期 47
6.1.1 日期 47

6.1.2 文件管理器 47
6.1.2 文件管理器 47

6.1.3 关于 47
6.1.3 关于 47

6.1.4 FTM 48

6.1.5 Maintenance 48

6.2 用户管理 49
6.2 用户管理 49

6.2.1 添加用户 49
6.2.1 添加用户 49

6.2.2 编辑用户 50
6.2.2 编辑用户 50

6.2.3 删除 用户账户 50
6.2.3 删除用户账户 50

6.2.4 登录 51
6.2.4 登录 51

6.2.5 默认 U系列 51
6.2.5 默认 U 系列 51

6.3 属性 51
6.3 属性 51

6.3.1 溅射参数 52
6.3.1 溅射参数 52

6.3.2 真空参数 53
6.3.2 真空参数 53

6.3.3 硬件参数 54
6.3.3 硬件参数 54

6.4 历史 56
6.4 历史 56

7 配件 57
7 配件 57

7.1 溅射插件 57
7.1 溅射插件 57

7.2 嵌件 59
7.2嵌件 59

7.2.1 脉冲 蒸发 碳棒成型 60
7.2.1 脉冲蒸发碳棒成型 60

7.2.2 用于斜坡蒸发 的成型 Carbon 62
7.2.2 用于斜坡蒸发的成型 Carbon62

7.3 安装 Carbon Fibre Insert 62
7.3 安装碳纤维 Insert 62

7.4 金属蒸发插件 63
7.4 金属蒸发插件 63

7.4.1 安装线 64

7.4.2 安装舟进行孔径清洁 64
7.4.2 安装舟进行孔径清洁 64

7.4.3 调整插件以向上 蒸发 64
7.4.3 调整插件以向上蒸发 64

7.4.4 重新定位 FTM 64
7.4.4 重新定位 FTM64

7.5 辉光放电插件 66
7.5 辉光放电插件 66

7.6 Rotacota 68
7.6Rotacota68

7.7 滑台 69
7.7 滑台 69

7.8 102mm 载物台变速箱 70
7.8 102mm 载物台变速箱 70

7.9 倾斜舞台 71
7.9 倾斜舞台 71

7.10 膜厚 Monitor (FTM) 72
7.10 膜厚 Monitor (FTM)72

7.10.1 更换 FTM 晶振 72
7.10.1 更换 FTM 晶振 72

7.11 加长高度气缸 73

7.12 全范围真空计组件 74

10473 - 第 8 期 4 www.quorumtech.com
10473 - 第 8 期 4 www.quorumtech.com

7.13 旋转真空龙头 75
7.13 旋转真空龙头 75

7.14 备用 76
7.14 备用 76

7.15 其他配饰 77
7.15 其他配饰 77

8 服务与维护 78
8 服务与维护 78

8.1 养护 78
8.1 养护 78

8.2 服务 78
8.2 服务 78

8.3 故障排除 79
8.3 故障排除 79

8.4 错误消息 79
8.4 错误消息 79

9 附录 82
9 附录 82

9.1 配方参数 82
9.1 配方参数 82

9.2 覆盖配方 中的 系统参数 88
9.2 覆盖配方 中的系统参数 88

9.3 技术规格 89
9.3 技术规格 89

9.4 溅射沉积速率 90
9.4 溅射沉积速率 90

9.5 退货 93
9.5 退货 93

9.5.1 概述 93
9.5.1 概述 93

9.5.2 健康与安全宣言 93
9.5.2 健康与安全宣言 93

9.5.3 发送 93

9.5.4 退货地址: 93

9.5.5 污染申报 94
9.5.5 污染申报94

10 指数 95
10 指数 95

图表列表

1-1.Q150T 8 前视图
1-1.Q150T8 前视图

2-1. Q150T 面板 13
2-1. Q150T面板 13

2-2. 带过滤器的气体接头(零件编号 12842) 安装在吹扫气体入口 14
2-2. 带过滤器的气体接头(零件编号 12842) 安装在吹扫气体入口 14

2-3.电源插座 引线 15
2-3.电源插座引线 15

2-4.安装标准载物台 17
2-4.安装标准载物台 17

3-1. 主屏幕 19
3-1. 主屏幕 19

3-2.食谱屏幕 20
3-2.食谱屏幕 20

3-3. 运行正在进行中:已安装 FTM(左)未安装 FTM(右) 21
3-3. 运行正在进行中:已安装 FTM(左)未安装 FTM(右)21

3-4.腔室通风:安装 FTM(左)和不安装 FTM(右) 21
3-4.腔室通风 :安装 FTM(左)和不安装 FTM(右)21

图 4-1.创建新 配方:选择工艺类型 23
图 4-1.创建新配方: 选择工艺类型 23

图 4-2.输入 配方名称 23
图 4-2.输入配方名称 23

图 4-3. 配方参数 24
图 4-3. 配方参数 24

图 4-4.编辑 配方参数 24
图 4-4.编辑配方参数 24

图 4-5. 材质编辑器 26
图 4-5. 材质编辑器 26

图 4-6.编辑材质参数 28
图 4-6.编辑材质参数 28

5-1。金属蒸发工艺 31
5-1。金属蒸发工艺 31

5-2.典型 12nm 受控脉冲e 蒸发 34
5-2.典型 12nm 受控脉冲 e 蒸发 34

5-3。碳成型器(蓝色手柄),用于制备 1.2 毫米(直径)34 螺柱
5-3。碳成型器(蓝色手柄),用于制备 1.2 毫米(直径)34 螺柱

5-4.提示重复除气程序或使用涂层 36 处理 d
5-4.提示重复除气程序或使用涂层 36 处理 d

5-5.用于制备 1.4 毫米(直径)套管的碳成型器(红色手柄) 37
5-5.用于制备 1.4 毫米(直径) 套管的碳成型器(红色手柄)37

5-6.楔形工具(零件编号 12097) 37
5-6.楔形工具 (零件编号 12097)37

5-7。成品楔形棒(左); 并与 Plain Rod (右) 38
5-7。成品楔形棒(左); 并与 PlainRod (右)38

5-8。带默认参数 斜坡蒸发电流 profile 38
5-8。带默认参数 斜坡蒸发电流 profile38

5-9.正在进行 清理 44
5-9. 正在进行光圈清理 44

6-1. 系统屏幕 46
6-1. 系统屏幕 46

6-2.系统日期和时间 设置 47
6-2.系统日期和时间设置 47

6-3.文件管理器(一般用户 只能访问备份选项 47
6-3.文件管理器(一般用户只能访问备份选项 47

6-4.关于(左) FTM 状态(右)屏幕 48
6-4.关于(左)FTM 状态(右) 屏幕 48

6-5. 维护 48
6-5. 维护 48

6-6. 创建用户 50
6-6. 创建用户 50

6-7。更改用户屏幕 51
6-7。更改用户屏幕 51

6-8. 溅射参数 (admin mode) 52
6-8. 溅射参数 (adminmode)52

6-9. 真空参数 (admin mode) 53
6-9. 真空参数 (AdminMode)53

6-10.硬件参数 (admin mode) 54
6-10.硬件参数 (adminmode)54

www.quorumtech.com 5 10473 - 第 8

6-11.“处理历史记录”屏幕(左)和“详细视图”选项卡(右) 56
6-11。处理历史记录 “屏幕(左)和 ”详细视图“选项卡(右) 56

6-12.“进程视图”(左)“消息视图”(右)选项卡 56
6-12。进程视图“(左)”消息视图“(右)选项卡 56

7-1. 溅射插件 58 的俯视图
7-1. 溅射插件 58 的俯视图

7-2.溅射插件和靶材组件mbly 59
7-2.溅射插件和靶材组件 mbly 59

7-3. 嵌件 60
7-3. 嵌件 60

7-4.推荐的形状 61
7-4.推荐的形状 61

7-5.Carbon Rod 成型机 (S8650/S8651)) 61
7-5.CarbonRod 成型机 (S8650/S8651))61

7-6. 碳纤维嵌件 62
7-6. 碳纤维嵌件 62

7-7.将金属蒸发装置安装在 sert 中,以便向下蒸发 63
7-7.将金属蒸发装置安装在 sert 中,以便向下蒸发 63

7-8.适用于向上蒸发 金属蒸发插件 65
7-8. 适用于向上蒸发 金属蒸发插件 65

7-9。 发光排放插件 66
7-9。 发光排放插件 66

7-10.拆卸闭门 67
7-10.拆卸闭门67

7-11.Rotacota 阶段 68
7-11.Rotacota 阶段 68

7-12.滑台 69
7-12.滑台 69

7-13.大型 (102mm) 样品载物台和变速箱 70
7-13.大型 (102mm) 样品载物台和变速箱 70

7-14. 可调节倾斜平台 71
7-14. 可调节倾斜平台 71

7-15.FTM(左); 更换 FTM crystal(中); FTM 引线(右) 72
7-15.FTM(左); 更换 FTMcrystal(中);FTM 引线 (右)72

7-16. 位置 73 加长 气缸
图 7-16.位置 73 的加长 气缸

7-17.旋转真空龙头 75
7-17.旋转真空龙头 75

9-1.7 x 10-3 mbar 的柱 使用金溅射沉积速率

1 x 10-2 mbar 90
1 x10-2mbar90

9-2。使用 7 x 10-3排放压力下使用溅射沉积速率

mbar 和 1 x 10-2 mbar 91
mbar 和 1 x10-2mbar91

9-3。7 x 10-3 mbar 的排放压力下使用溅射沉积速率

1 x 10-2 mbar 92

表格列表 

1 状态指标 18

2 Q150T 默认配方 22

表 3 材料及其密度 26

表 4 材料参数 27

5 20nm 镀膜脉冲线蒸发参数 32

6 25nm 镀膜受控脉冲线蒸发参数 33

表 7 SEM 导电 脉冲蒸发参数 35

8 选项 35

9 用于 5nm 涂层 碳 TEM 参数 40

10 用于 SEM 涂层 定时向碳 parameter 41

11 5nm 涂层的厚度斜坡参数 42

Table 12 Glow discharge treatments 43
12 辉光放电处理 43

Table 13 Q150T System options 46
13 Q150T 系统选项 46

Table 14 Sputter Parameters (System Properties, page 1) 52
14 溅射参数 (系统属性, 第 1 页 52

Table 15 Vacuum parameters (System Properties, page 2) 53
15 真空参数 (系统属性, 第 2 页 53

16 硬件参数(系统属性,第 3 页 55

17 Q150T 76 备件

18 Q150T S Q150T ES 76替代目标

19 Q150T 77 的附件

20 维护任务 78

21 错误混乱 79

22 警告消息 81

23 编消息 81

24 FTM/定时溅射镀膜参数 82

25 碳脉冲/Rod 蒸发配方参数 83

26 受控脉冲线 84

27 斜坡配方参数 85

28 金属蒸发配给配方参数 86

29 孔径清洗配方参数 87

表 30 真空关闭特性 87

表 31 系统覆盖属性 88

表 32 技术规格 89

33 污染分类 94

10473 - 第 8 期 6 www.quorumtech.com

Q150T S/E/ES

健康与安全

使用任何仪器,安全性都非常重要。在 Quorum,我们努力:

我们的员工 客户提供安全的工作环境

Conduct our business responsibly, in a manner designed to protect the health and safety of customers, employees and the public at large, and to minimise any adverse effects on the environment.
负责任的方式开展业务, 以保护客户、员工和广大公众健康和安全 ,并尽量减少环境的任何不利影响。

Review our operations regularly to achieve environmental, health and safety improvements in line with UK and European Community legislation.
定期审查我们的运营 ,以根据英国和欧洲共同体的立法实现环境 健康和安全的改善

All service work carried out on the equipment should only be undertaken by suitably qualified personnel.
设备上进行的所有维修工作只能具有适当资格的人员进行

Quorum is not liable for any damage, injury or consequential loss resulting from servicing by unqualified personnel. Quorum will also not be liable for damage, injury or consequential loss resulting from incorrect operation of the instrument or modification of the instrument.
Quorum 不对因招聘合格人员而造成的任何损害、伤害或间接损失负责 。对于因仪器作不当或对仪器进行修改而造成的损害、伤害或间接损失 ,Quorum 概不负责

Control of Substances Hazardous to Health (COSHH)
危害健康物质控制 (COSHH)

The EC legislation regarding the“Control of Substances Hazardous to Health”requires Quorum to monitor and assess every substance entering or leaving their premises. Consequently, a completed Health and Safety Declaration form must accompany any returned goods (see Appendix -9.5.5on page94 for the form)
EC 关于 “控制对健康有害的物质” 的立法要求 Quorum 监测和评估 场所的所有物质 。因此, 任何退货都必须附有 一份完整的健康和 安全声明表 (表格见94 附录 -9.5.5

Without this declaration, Quorum reserves the right not to handle the substance/item. Also, in accordance with EC regulations, we will supply on request hazard data sheets for substances used in our instruments.
如无声明,Quorum 保留处理物质/物品的权利 此外, 根据 EC 法规,我们将根据要求提供我们仪器中使用的物质的危险数据表。

WEEE Compliance
WEEE 合规性

This
product
产品
is
required
必填
to
comply
遵守
with
the
European
欧洲人
Union’s
联合的
Waste Electrical
废电器
& Electronic
电子的
Equipment (WEEE)
设备 (WEEE)
Directive
命令
2002/96/EC.

For full details of our environmental policies, including WEEE, please visit http://www.quorumtech.com/about-us/environmental-policy.html
有关我们的环境政策(包括 WEEE)的完整详情,请访问 http://www.quorumtech.com/about-us/environmental-policy.html
.

Conformity
整合

This Equipment of this Design and manufacture and marked CE, conforms with the requirements of the European Directives EMC 2004/108/EC & LVD 2006/95/EG.
本设计和制造的设备带有 CE 标志 符合欧洲标准 EMC 2004/108/EC&LVD2006/95/EG 的要求

Quality
质量

Quorum Technologies Ltd operates a quality management system in accordance with ISO 9001.
QuorumTechnologiesLtd 按照 ISO 9001 标准运行质量管理体系

Certificate No: 3698/03
证书编号 :3698/03

Hazard Signal Words
危险信号

This manual defines hazards using the following key words:
手册使用以下关键字定义危害

WARNING Potentially hazardous situation or unsafe practice that, if not avoided, could result in
警告 如果不避免, 潜在的危险情况或不安全的做法可能会导致

death or severe injury.
死亡或伤。

CAUTION Potentially hazardous situation or unsafe practice that, if not avoided, may result in
注意 如果不避免, 可能会导致潜在危险的情况或不安全的做法

minor or moderate injury or damage to equipment.
轻微中度伤害设备损坏。

Fail Safe
故障安全

This Equipment will“fail safe”in the presence of excessive RF, Electrostatic Discharge or Mains Transients. While a loss of function could occur under extreme circumstances, the Equipment’s operation will be fully recoverable under normal operating conditions.
设备在存在过多射频、 静电放电电源干扰的情况下将“故障安全 ”。 虽然极端情况下可能会丧失功能 ,但在正常条件下, 设备的运行是可以完全恢复的。

Intended Use
有可能的使用

This instrument is designed for laboratory use only and is not intended for use in a production environment.
仪器仅供实验室使用 不适用于生产环境。

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Q150T S/E/ES plus

Introduction
介绍

General Description
一般描述

The Q150T plus system is a versatile sputter coater/turbo evaporator (seeFigure 1-1) for preparing specimens for examination by electron microscopy.
Q150Tplus 系统是一种多功能溅射镀膜机 / 涡轮蒸发器 1-1), 用于制备用于电子显微镜检查的样品。

With a comprehensive selection of easily interchanged inserts and sample stages, the Q150T can be used to
Q150T 具有多种易于互换的插件和样品台,可用于
:

Sputter coat samples using targets such as chromium or gold
● 使用铬或金等靶材的溅射涂层样品
.

Evaporate support films and replicas for TEM and X-Ray analysis and conducting coatings for SEM using 3mm or 6mm carbon rods or cords
● 使用 3 mm 或 6 mm 碳棒或碳丝蒸发用于 TEM 和 X 射线分析的支撑膜和复制品,以及用于 SEM 的导电涂层
.

Evaporate metals upwards or downwards from a wire basket or molybdenum boat arrangement.
金属丝篮舟布置向上向下蒸发金属

Clean aperture strips
● 清洁孔径条
.

There are three models in the Q150T range
Q150T 系列有三种型号
:

Q150T S plus Sputter coater version only.
仅限 Q150T S plus 溅射镀膜机版本

Q150T E plus Carbon/metal evaporation version only.
仅限 Q150T E plus 碳/金属蒸发版本

Q150T ES plus Combined system with interchangeable inserts for sputter coating
Q150T ES plus 组合系统 ,带 i 可更换刀片 ,用于溅射镀膜

or carbon/metal evaporation.
碳/金属蒸发离子。

The instrument is fully adaptable to a wide range of specimens and offers easy loading and unloading of samples. The changeover between sputtering and evaporation inserts is simple. The system is fully automated with a user defined recipe controlling the pumping sequence, preheating, outgassing, pulses for evaporation and sputter current and time.
该仪器完全适用于各种样品 可轻松装卸样品 溅射蒸发插件之间的转换很简单。该系统完全自动化的,用户定义的配方控制泵送顺序 预热 除气 蒸发脉冲以及溅射电流和时间。

The Q150T can be fitted with a film thickness monitor (FTM), which measures the coating thickness on a crystal in the chamber, to control the coating applied to the sample. For example, the Q150T can automatically terminate a coating cycle when the required thickness has been achieved.
Q150T 可以配备监测器 FTM),监测器可测量腔室晶体上的涂层厚度 控制涂覆的涂层样本中。 例如 Q150T 可以在达到所需厚度自动终止涂层周期

Figure 1-1. Front view of the Q150T
图 1-1.Q150T 视图

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Q150T S/E/ES plus

The Q150T features a turbo molecular pump backed by a rotary vacuum pump and controlled by the instrument throughout the fully automatic coating cycle.
Q150T 配备一个 turbo 分子,由旋转真空提供支持 ,并在整个全自动镀膜周期智能装置控制

The system has a recipe allowing the instrument to be pumped down when it is not in use to maintain vacuum specification or it can be terminated to leave the chamber under vacuum.
该系统有一个配方 允许在不使用仪器进行真空以保持真空规格 或者可以将其置于真空室中。

1.2

Sputter Coating
溅射镀膜

Sputter Coaters are used in Scanning Electron Microscopy to provide an electrically conductive thin film representative of the surface topography of the specimen to be viewed, such films inhibit 'charging', reduce thermal damage, and enhance secondary electron emission.
溅射镀膜机用于扫描电子显微镜 ,以提供代表观察物种表面形貌导电薄膜 例如薄膜抑制 充电 ”, 减少损伤 增强二次电子发射。

The Q150T S and Q150T ES employ a magnetron sputter target assembly. This enhances the efficiency of the process using low voltages and giving a fine-grain (order of 0.5nm Cr grain size), cool sputtering. The unit features a rotating sample table ensuring even depositions (typically 5nm thickness). The instrument is fitted with a 57mm diameter quick-change target giving optimum consumable cost performance. Various target materials are available.
Q150TSQ150TES 采用磁控溅射组件 ,这提高了使用电压工艺效率 ,并提供了粒度 0.5nmCrgrain 大小量级 ),溅射。装置具有一个旋转样品,可确保均匀沉积 通常 5nm 厚度 )。仪器配有直径为 57mm 的快速更换靶材 可提供最佳的耗材性价比 。提供各种靶

A shutter assembly is fitted as standard, which allows sputter cleaning of oxidising targets.
一个百叶窗组件 允许氧化目标进行溅射清洁

1.3

Carbon Coating
碳涂层

Carbon films, because of their mechanical stability, good electrical conductivity, and low background signal are commonly used to prepare samples for Electron Microscopy (EM).
由于其机械稳定性、 良好的导电性和背景信号 用于制备电子显微镜 EM) 样品

Thin films of about 5 nm (50Å) are used for particle support and as an isolating layer in autoradiography. Thicker films are used in Scanning Electron Microscopy (SEM) also for support, in addition to coating for X-Ray Microanalysis. In general, there is a need for all these films to be fine grain, even coating, with uniform and reproducible film thickness.
5nm(50Å) 薄膜用于颗粒支持放射自显影中的隔离较厚薄膜也用于扫描电子显微镜 SEM) 用于支持, 除了用于 X 射线 Micr 分析涂层 一般来说 所有这些薄膜都需要颗粒 涂层均匀 具有均匀可重复的薄膜厚度。

The most common form of deposition is from resistance heated carbon rods. The rods are shaped to achieve high current density with sufficient temperature to cause evaporation. Carbon filaments can also be used, which at high temperature burn quickly, from which has evolved the terminology: Carbon 'Flash' Evaporation. The resulting short coating times and reduced total power input distinguishes it from the somewhat longer process of carbon rod evaporation.
最常见的沉积形式是来自 resistance 加热的碳棒。的形状可实现电流密度,并具有足够的温度以引起蒸发 也可以使用 它在高温会迅速燃烧 ,因此演变术语 闪蒸 蒸发 由此产生的较短的涂层时间和减少的总功率输入将其稍长蒸发过程区分开来

Q150T E and ES models feature a multi-change head system for Carbon rod, Carbon fibre and metal evaporation.
Q150TEES 型号具有用于碳纤维金属蒸发 n更换系统

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1.4 Metal Evaporation
1.4 金属蒸发

By vaporizing a metal film onto a sample, it is possible to enhance the topographic detail for high resolution analyses by TEM or SEM. This technique is particularly useful in the analysis of biological specimens. The metal evaporant, usually a wire of platinum or gold, is heated and vaporised by a filament (typically made of tungsten).
通过将金属汽化样品 可以增强细节,以便通过 TEM SEM 进行高分辨率分析 。该技术生物标本分析特别有用 金属蒸发剂, 通常是或金细丝(通常由制成 加热和蒸发

For downwards evaporation, evaporants usually in the form of wire: e.g gold, platinum, aluminium, etc are placed directly onto the filament. For upwards evaporation, the evaporant is placed in a 1boat’(typically made of molybdenum or tungsten).
对于向下蒸发, 蒸发剂通常金属丝的形式出现:例如金、直接放置在灯丝 对于向上蒸发, 将蒸发剂放置在 1 船'(通常是钼或钨的 mad e)中。

The Q150T E and ES can be configured for metal evaporation in an upwards or downwards direction.
Q150TEES配置为向上向下金属蒸发

1.5 Aperture Cleaning
1.5 孔径清洁

In its metal evaporation configuration, you can use a Q150T E or Q150T ES to clean aperture strips and other electron microscope components. With the component placed in a molybdenum boat, it can be heated to evaporate contaminants.
在其金属蒸发配置中, 您可以使用 Q150TEQ150TES 清洁孔径条和其他电子显微镜组件。将组件放置在 可以加热蒸发污染物。

1.6 Glow Discharge
1.6 辉光放电

Freshly-made carbon supports tend to have a hydrophobic surface which inhibits the spreading of suspensions of particles in negative staining solutions. However, after glow discharge treatment with air, the carbon film is made hydrophilic and negatively charged thus allowing easy spreading of aqueous suspensions.
新鲜制备的载体往往具有疏水表面,可抑制颗粒悬浮液染色溶液中的扩散 然而, 在用空气进行辉光放电处理 碳膜变得亲水性并带电,因此允许水性悬浮液轻松铺展

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Q150T S/E/ES plus

Installation
安装

It is important that this equipment is installed by skilled personnel in accordance with these instructions. Failure to do so may result in damage or injury. 'If in doubt - ASK'.
请务必熟练的人员按照这些说明安装设备 否则可能会导致损坏受伤。“如有疑问 - 询问 ”。

Pre-installation
预安装

Identify a suitable location for the unit:
确定 unit合适位置

Mount the unit on a bench or the recommended trolley. The total weight of the system is 33.4 kg
● 将设备安装在长凳或推荐的手推车上系统的总重量为 33.4 kg
.

The environment should have an ambient temperature range of 15ºC to 25ºC in a non-condensing relative humidity of not more than 75%.
环境温度范围应15ºC25ºC冷凝相对湿度不超过 75%。

Sufficient ventilation is required, and positioning should be out of direct sunlight. The system is rated for continuous operation.
需要足够的通风 并且位置避免阳光 该系统额定值为连续运行。

Required Services
所需服务

Argon

Supply for sputtering should be N4.8 (Zero Grade) 99.998% purity capable of supplying 10 psi at 3 litres/min (maximum) for a 4 minute maximum sputter cycle time (some instruments may have specially extended sputter cycles). The system is supplied with 3m plastic tubing 3mm I.D. x 6mm O.D. from quick release connectors on the rear of the unit. It is the customers responsibility to connect from this hose to the pressure regulator set at approximately 10psi, from gas bottle or plant supply. Typically, a system will use 0.2 litres of Argon for a 4 minute sputter cycle
溅射备件应为 N4.8(零级)99.998% 纯度,能够以 3 升/分钟(最大值)的速度提供 10 psi,最长溅射循环时间为 4 分钟(某些仪器可能具有特别延长的溅射循环时间)。该系统配有 3m 塑料管,内径 3mm x 外径 6mm,来自设备后部的快速释放连接器客户负责从此软管连接到设置在大约 10psi 的压力调节器上,来自气瓶或工厂电源通常,系统将使用 0.2 升氩气进行 4 分钟的溅射循环
.

If bottle supply is adjacent it can be isolated locally, if not or plant supply, local isolation valves should befitted.
如果瓶子供应相邻 则可以在本地隔离 如果不是或工厂供应, 则应安装本地隔离阀。

Nitrogen

Supply for purging should be N4.8 (Zero Grade) 99.998% purity 10 psi 3 litres per minute (maximum) for 60 seconds. The system is supplied with 3 metres plastic tubing 3mm I.D. x 6mm O.D. from quick release connectors to be fitted to pressure regulator set at approximately 10psi, bottle or plant supply.
吹扫供应量应N4.8) 99.998% 纯度 10 psi 每分钟 3 最大值 ), 持续 60系统配有 3 长的塑料3mm 内径 x6mm 外径安装到压力调节器的快速释放连接器 ,设置为大约 10psi、 瓶子设备供应。

If bottle supply is adjacent it can be isolated locally if not or plant supply, local isolation valves should befitted.
如果瓶子供应相邻 则可以在本地隔离 如果没有或工厂供应, 则应安装本地隔离阀。

Pressure Regulators are Customer Supply, Nitrogen is recommended for Purging for Economy, Argon must be provided for Sputtering, it can also be used for Purging in the event of Nitrogen purge gas not readily available.
减压客户供应 建议使用氮气进行经济吹扫 ,溅g 必须提供氩气 在氮气吹扫气体不易获得的情况下 它也可以用于吹扫。

Typical regulators suitable for Argon and Nitrogen are the C106X/2 series available
适用于氩气和氮气的典型稳压器是 C106X/2 系列,可用

from BOC
来自 BOC

http://www.boconline.co.uk/en/products-and-supply/speciality- equipment/regulators/two-stage-regulators/c106x2-series/c106x-2-series.html
http://wwwBocOnlineCoUK/en/products-and-supply/speciality-equipment/regulators/two-stage-regulators/c106x2-series/c106x-2-series.html

Electrical supply
电力供应

90-240V, 50/60Hz, 1350VA, including pump.
90-240V,50/60Hz,1350VA 包括泵。

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Q150T S/E/ES plus

Vacuum Pump
真空泵

Rotary pump complete with vacuum hose & oil mist filter (35 litre/min; 2 m³/hr).
旋转配有真空软管过滤器 (35/ 分钟 2 立方米/ 小时 )。

2.2 Unpacking
2.2 开箱

1. Remove the Instrument from its packing and place it in its operational position
1. 从包装中取出仪器并将其放在作位置
.

CAUTION!
谨慎!

DON’T TRY TO LIFT THE UNIT BY YOURSELF: IT WEIGHS 33.4KG. GET SOMEONE TO HELP YOU MOVE IT.
请勿尝试自行抬起设备 它重 33.4 公斤。帮你搬走

2. Carry out a visual inspection to check for any signs of transit damage
2. 进行目视检查,检查是否有任何运输损坏的迹象
.

3. Remove the Accessories Pack, and check contents against Q150T Accessories Pack shipping list
3. 取出配件包,并根据 Q150T 配件包发货清单检查内容
.

CAUTION!
谨慎!

Do Not attempt to lift the lid from the chamber. Unlatch the grey top cover and remove the 2 transit screws retaining the top plate assembly. The set screw and the transit plate should be retained with the instrument accessories in case further transit of the instrument is necessary.
请勿尝试盖子上掀开盖子 松开灰色,卸下固定板组件2 颗运输螺钉 。固定螺钉运输仪器附件一起保留 以防需要进一步运输仪器。

4. Ensure that all areas of the Instrument are free from loose packaging material. Check specifically the instrument chamber, glass cylinder, and gaskets. (Do not use vacuum grease on gaskets).
4. 确保仪器的所有区域都没有松散包装材料。 特别检查器械 玻璃圆筒垫圈 不要在垫圈上使用真空润滑脂 )。

5. If your unit includes a vacuum pump, carry out preliminary checks in accordance with the manufacturers recommendations
5. 如果您的设备包含真空泵,请按照制造商的建议进行初步检查
.

If you are intending to use an existing or alternative vacuum pump, and have any difficulty with these connections, please contact our technical support.
如果您打算使用现有或替代的真空泵,并且在连接方面遇到任何困难 请联系我们的技术支持

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Q150T S/E/ES plus

2.3 Connections
2.3 连接

Installation consists of the following steps:
安装包括以下步骤

Connect gas supplies (see below).
连接气体供应 见下文 )。

Make electrical connections (see page14)
● 进行电气连接(参见第 14 页)
.

Connect the vacuum pump (see page16)
● 连接真空泵(参见第 16 页)
.

Install the sample stage (see page17)
● 安装样品台(参见第 17 页)
.

If you want to install a different insert than that supplied with your instrument, please see page 57. If you have ordered a Q150T ES, the instrument will be fitted with the sputter insert, unless you have specifically requested another configuration.
如果您想安装仪器随附的 in sert 不同的 in-sert 请参见57 页。 如果您订购Q150TES,则仪器配备溅射插件, 除非您特别要求其他配置。

Figure 2-1 shows the location of connectors and switches on the rear panel of the Q150T.
2-1 显示了 Q150T 后面板上连接器开关的位置

AUX POWER INLET PUMP OUTLET USB GAS INLETS VACUUM
AUX 电源入口 泵出口 USB 进气口 真空

CONNECTION
连接

Ethernet
以太网

Power inlet with
电源插座

Power supply for
电源

Copy/backup
复制/备份

Argon1
1

Nitrogen2
氮气 2

Rotary pump
旋转

network
网络

integral On/Off
积分开/关

rotary pump
旋转

process data
过程数据

0.3 bar
0.3

0.3 bar
0.3

vacuum
真空

connection
连接

rocker switch
翘板开关

allowing control by instrument
允许通过仪器进行控制

and log files to
日志文件添加到

USB flash drive
USB 闪存驱动器

(4 psi)
(4 磅/平方英寸)

(4 psi)
(4 磅/平方英寸)

connection
连接

Figure 2-1. Q150T Rear Panel
图 2-1.Q150T 后 P

(1). S versions only
(1). 仅限 S 版本

(2). If using air instead of Nitrogen, fit filter part no. 12842 seeGas Connections”, below.
(2). 如果使用空气代替氮气,请安装部件号 12842 的过滤器,请参见下面的 气体连接”。

WARNING!
警告!

UNDER
NO
CIRCUMSTANCES
情况 下
SHOULD
应该
ANY
任何
OTHER
其他
CONNECTIONS
连接
OR OUTLETS/INLETS BE USED
或使用出口/入口
FOR ANY
对于任何
OTHER
其他
EQUIPMENT
设备
OR
SERVICES.
服务业。

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Q150T S/E/ES plus

2.3.1 Gas Connections
2.3.1 气体连接

1. Connect a suitable argon supply at a regulated input of 0.3bar (4psi) to the quick connect Argon gas connector on the rear panel (see Figure 2-1. If you prefer, you can use argon for both process and purge supplies. To do so, install a 'T' piece across both gas inlets
1. 将 0.3bar (4psi) 稳压输入的合适氩气源连接到后面板上的快速连接氩气连接器(参见图 2-1。如果您愿意,可以将氩气用于工艺和吹扫备件。为此,请在两个进气口上安装一个“T”形件
.

2. Connect a suitable nitrogen supply at a regulated input of 0.3bar (4psi) to the quick connect Nitrogen connector on the rear panel. Air may be used in place of nitrogen for venting but it is important to fit the filter (part no. 12842) to prevent ingress of dust (see Figure 2-2). Failure to connect this filter could prevent the system venting at the end of a cycle.
2. 合适的氮气供应0.3bar (4psi调节输入连接到控制面板上的快速连接氮气连接器 可以使用空气代替氮气进行排气 ,但安装过滤器 部件 12842) 以防止灰尘进入 (见2-2) 未能连接此过滤器可能会阻止系统在循环结束时排气。

Connectors are push-fit and will 'snap' into a locked position. To release a connector, depress the metal tongue.
连接器推入式的 ,可以 “卡入” 锁定位置。为了松开连接器, 请按下金属舌片。

Figure 2-2. Gas connectors with filter (part no. 12842) fitted to purge gas inlet
图 2-2.带过滤器的气体接头(部件号 12842)安装在吹扫气体入口

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2.3.2 Electrical Connections
2.3.2 电气连接

1. Connect the instrument to a suitable earthed single-phase ac supply using the supplied cable. The lead should be fitted with the appropriate plug for your country. Ensure the plug is firmly located.
1. 使用随附的电缆仪器连接到合适的接地交流电源引线配备适合您所在国家/地区的插头 确保插头位置牢固

WARNING! - EARTH CONNECTION
警告!- 接地连接

This Equipment must be Earthed and fitted with the correct lead for the country of operation. This Equipment is normally supplied from 3 pin supply including Earth. For fuse information, refer toTable 32.
设备必须接地 并配备适用于作国家/地区的正确引线。本设备通常由 3 引脚电源供电,包括接地。 有关熔断器的信息,请参阅表 32。

2. Connect the rotary pump power lead to the Pump Output connector on the rear panel (see Figure 2-1). If the rotary pump has its own switch, ensure that this is set to theOnposition (if applicable, program the pump to turn on automatically when mains power is applied).
2. 旋转电源线连接到面板上的输出连接器 (见2-1) 如果旋转自己的开关, 请确保这是 设置为 On 位置 如果适用 ,将编程为接通市电时自动打开 )。

WARNING! - PUMP OUTPUT
警告!- 泵输出

Check that the Power Output is suitable for the rotary pump. The Pump Output is intended for connection to the pump supply only and provides the electrical supply voltage at a maximum of 4 Amps.
检查 PowerOutput 是否适合旋转泵。 泵输出仅用于连接泵 ,并提供最大 4 安培电源电压

Pin2 Earth
Pin2 接地

Pin 3
引脚 3

Neutral
中性

PIN

UK AND EUROPE
英国和欧洲

U.S.A. AND CANADA
美国和加拿大

Pin 1 ( Live or Hot)
引脚 1 带电热)

Brown
棕色

Black

Pin 2 ( Earth )
引脚 2 接地

Green / Yellow
绿色 / 黄色

Green
绿

Pin 3 ( Neutral)
引脚 3 中性)

Blue

White

Figure 2-3. Power outlet lead wiring
图 2-3.Power outletlead wiring

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2.3.3 Aux Network Connection
2.3.3 辅助网络连接

To link the Q150T to your network, use a standard CAT5/5e cable with RJ45 network connectors to connect the AUX Network port directly to your computer’s network port or a network hub/switch.
要将 Q150T 连接到您的网络 请使用带有 RJ45 网络连接器的标准 CAT5/5e 电缆AUX 网络端口直接连接到计算机的网络工作端口网络集线器/switch.

2.3.4 USB Connection
2.3.4USB 连接

Connect a USB flash drive to copy and backup process data and log files for viewing on a computer.
连接 USB 闪存驱动器复制和备份过程数据和日志文件 ,以便在计算机上查看

2.3.5 Vacuum Connections
2.3.5 真空连接

1. If you are using an existing or alternative vacuum pump, and have any difficulty with connections, please ask for advice.
1. 如果您使用的是现有替代的真空,并且在连接方面遇到任何困难 k 寻求建议。

2. If the instrument is NOT going to be vented into an extraction system, fit an Oil Mist Filter with metal adapter to the outlet of the vacuum pump. Please refer to the manufacturer’s instructions.
2. 如果仪器打算抽气系统 ,请在真空的出口处安装一个带有金属适配器过滤器 请参阅制造商的说明

3. Ensure that the vacuum pump is filled with the correct oil
3. 确保真空泵注满正确的油
.

4. If the vacuum pump is fitted with an on/off switch, ensure that it is set to the 'on' position to allow the instrument to control its power supply.In some cases, it may be necessary to program the rotary pump to come on when mains voltage is applied.
4. 如果真空配有/开关 请确保将其设置为 “开” 位置,以便仪器控制电源 在某些情况下 可能需要旋转进行编程 ,使其在施加电源电压时启动

6. Connect the flexible vacuum hose to the spigot on the rear panel using the hose clip provided. This is a push-on fit to the Instrument. Ensure that this is firmly in place to the full length of the spigot
6. 使用提供的软管夹将柔性真空软管连接到后面板上的龙头。这是对乐器的推入式安装。确保将其牢固地固定在龙头的整个长度上
.

A rotating vacuum spigot is available for more convenient hose connection in installations where the instrument is to be located close
旋转真空龙头可用于在仪器靠近的安装更方便地连接软管

to a back wall (see page73)
到后墙(见第 73 页)
.

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2.4 Fitting the Standard Stage
2.4 安装标准舞台

The Q150T is supplied with a standard stage (10067). For installation instructions for other stages, see page57. To install the standard stage:
Q150T 配有标准载物台 (10067)。 有关其他 stages 安装说明 请参见57 页。安装标准阶段,请执行以下作:

1. Ensure that the instrument is vented and in standby mode
1. 确保仪器通风并处于待机模式
.

2. Open the top cover fully so it rests against its backstop
2. 完全打开顶盖,使其靠在逆止器上
.

3. If there is already a stage in place, remove it by lifting carefully upwards
3. 如果已经有一个载物台,小心地向上抬起将其移除
.

4. Fit the standard stage by locating its shaft into the top of the stage rotation drive spigot protruding from the baseplate and with a twisting motion pushing it gently down until the collar around the shaft rests on top of the drive spigot (see below).
4. 将标准载物台的定位载物台的顶部 旋转驱动底板龙头 然后以扭转动作轻轻推动它, 从而安装标准载物台向下直到周围的驱动龙头的顶部 见下文 )。

Standard stage
标准载物台

Height-adjusting collar
高度调节项圈

Rotation drive spigot
旋转驱动龙头

Figure 2-4. Fitting the standard stage
图 2-4.安装标准舞台

You can adjust the height of the stage above the base plate by moving the collar up or down the shaft. Unfasten the M3 screw with a hexagonal key, slide the collar to the required position and retighten the M3 screw.
您可以通过在轴上上移动调整平台板上的高度 角键松开 M3 螺丝 将套环滑到所需位置,然后重新拧紧 M3 螺丝。

For maximum distance between the stage and the target, remove the collar so that the underside of the stage rests on the top of the drive spigot. To reduce the distance between the stage and target, fit the stage with the alternative long shaft (10214 – supplied with stage).
为了获得载物台和目标之间的最大距离 ,请取下项圈 使 stage底部位于驱动龙头的顶部 为了减少载物台目标之间的距离 ,请使用备用10214 - 载物台提供 )安装载物台

When using small 1/8”pin stubs, it is advisable to unscrew the stage and fit it upside down for easy access to the stub
使用小的 1/8 英寸针头时,建议拧下载物台并将其倒置安装,以便于接触 stub
.

Note that the Q150T’s default tooling factors are based on a stage height of 60mm from the base plate
请注意,Q150T 的默认工具系数基于距底板 60 毫米的平台高度
.

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2.5

2.6

Status Indication
状态指示

The front panel houses a status indicator (see Figure 1-1). The displayed colour represents the status of the system as described below.
前面板上有一个状态指示灯 1-1)。 显示的颜色表示系统的状态,如下所述

Table 1 Status indicator
表 1 状态指示灯

Status indicator display
状态指示灯显示

Instrument condition
仪器条件

Blue (slow flash)
蓝色(慢闪)

Initialising
初始化

Blue

Idle

Green
绿

Pumping

Purple
紫色

Coating

Green (flashing)
绿色(闪烁)

Finished/Venting
完成 / 排气

Red (flashing)
红色(闪烁)

Error
错误

Audio
音频

At the completion of a recipe process, the instrument emits abeep-beepsound. This may be switched off with the Sound button on the Home screen (seeFigure 3-1)
在配方过程完成时,乐器会发出“哔-哔”的声音这可以通过主屏幕上的“声音”按钮关闭(参见图 3-1)
.

Q150T S/E/ES plus

3 Operation
3 手术

This chapter describes the basic operation of the Q150T. For more advanced use, please see below andApplication Guidelineson page29. The status of the system is indicated by the status bar (see page18)
本章介绍 Q150T 的基本作。有关更高级的使用,请参阅下文和第 29 页的申请指南。系统状态由状态栏指示(参见第 18 页)
.

3.1 Switching On for the First Time
3.1 第一次开机

1. Ensure that you have completed the installation as described in the previous sections.
1. 确保您已完成前面部分所述安装

2. Switch the instrument on using the rocker switch located on the rear panel. The front panel LCD display should illuminate and show the initialising message.
2. 使用位于面板上的摇臂开关打开仪器前面板 LCD 显示屏亮起并显示初始化消息。

3. Once the instrument hardware and software has initialised, the Home screen is displayed (seeFigure 3-1)
3. 仪器硬件和软件初始化后,将显示主屏幕(参见图 3-1)
.

Function buttons
功能按钮

Chamber pressure display on/off
腔室压力显示开/关

Home

Sound on/off Username Help Log in/out
声音开/关 U 系列 帮助 登录 /注销

Figure 3-1. Home screen
3-1. 主屏幕

3.2 The Home screen
3.2 主屏幕

The Standby screen has five function buttons:
待机屏幕有五个功能按钮:

History (see page56)
历史 56 页)

Recipes (see page22)
食谱 22 页)

System (see page46)
系统 46 页)

Login (see page51)
登录 51 页)

Materials (see page26)
材料 26 页)

The menu bar has buttons for commonly used task such as logging in/out, accessing the online Help system, and returning to the Home screen.
菜单包含用于常用任务按钮 例如登录/注销、 访问在线帮助系统和返回主页 screen。

The chamber pressure button toggles the pumping/vacuum information display across the bottom of the screen (see Figure 3-3). This shows the chamber pressure bar graph and reading, and turbo speed indicator.
腔室压力按钮切换屏幕底部的抽气/真空信息显示 (见3-3)显示了腔室压力条形图读数,以及涡轮速度指示器。

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3.3 Running a Recipe
3.3 运行 Recipe

Before you can run a recipe, ensure you have:
运行配方之前, 请确保您已:

Completed the installation as described on page11.
按照11的说明完成安装

Switched on the instrument (see section19)
● 打开仪器(参见第 19 节)
.

Loaded a sputter/coating target or loaded an evaporation source (see page57). To run a recipe:
加载溅射 / 镀膜加载蒸发 参见57 页)运行配方:

1. Load your sample onto the centre of the sample stage
1. 将样品加载到样品台的中心
.

2. Close the top cover assembly and press it firmly down to secure the latch
2. 关闭顶盖组件并用力向下按压以固定闩锁
.

3. Tap on the Recipes button (seeFigure 3-2)
3. 点击“食谱”按钮(见图 3-2)
.

Figure 3-2. Recipes screen
3-2.Recipes (配方) 屏幕

4. The Q150T has several default recipes for common tasks as shown in Table 2.
4. Q150T 有几个常见任务的默认配方 2 所示

Tap
水龙头
on
the
name
名字
of
the
recipe
食谱
you
want
to
run
(you
(您
may
need
需要
to
scroll
滚动
down
the
list
列表
to
find
找到
it
).

Recipes ready to run are listed at the top and are ordered according to how often they are used
准备运行的配方列在顶部,并根据其使用频率进行排序
.

If the run
如果运行
arrow (
箭头 (
) is grey rather than
) 是灰色的,而不是
green the pr
绿色公关
ocess
口服
cannot be
不能
run as the correct head has n
运行,因为正确的 head 有 n
ot been fitted.
安装。

5. Tap on
5. 点击

. The
Q150T starts
开始
pumping
the
sample
样本
chamber
. The
progress
进展
of
the
run
is
shown through
显示方式
a series
系列
of on-screen
在屏幕上
messages.
消息。

6. 6. During outgassing, a Skip to Process prompt gives you the option to commence directly with the process, avoiding the Pump Hold Time period as set in the systems Vacuum Parameters (see page53). Outgassing improves the quality of the coating but can be set to zero as a default.
6. 6. 除气过程中 SkiptoProcess 跳至过程)提示允许您选择直接开始该过程,从而避免系统的 Vacuum(真空 )中设置的 Pump Hold Time(泵保持时间)时间段参数 参见53 页) 脱气可以提高涂层的质量 可以默认设置为零

7. The screen shows the vacuum and control parameters and, if an FTM is installed, the coating thickness achieved (Figure 3-3)
7. 屏幕显示真空和控制参数,如果安装了 FTM,则显示达到的涂层厚度(图 3-3)
.

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Figure 3-3. A run in progress: with FTM installed (left) and without FTM (right)
图 3-3.正在进行的运行:已安装 FTM(左)和未安装 FTMM(右)

8. If you want to stop a run while it is in progress, tap on ea
8. 如果您想在运行正在进行时停止运行,请点击 ea
.

9. At the completion of the run, the Q150T begins to vent the chamber (see Figure 3-4). Full details of deposition are logged in the instrument’s History - see page56)
9. 运行完成后,Q150T 开始对腔室进行排气(见图 3-4)沉积的全部详细信息记录在仪器的历史记录中 - 见第 56 页)
.

Figure 3-4. Venting the chamber: with FTM installed (left) and without FTM (right).
图 3-4.腔室通风:安装 FTM(左)和不安装 FTM(right)。

10. Click on the OK button to return to the Recipes screen. You can now remove your sample and set up another run.
10. 单击 “确定 按钮返回 Recipes 屏幕。 您现在可以删除样品设置另一次运行。

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4 Working with Recipes
4 使用配方

The operation of the Q150T is controlled by a recipe. This describes the sequence of operations in sputter coating or evaporation cycles. You can also create recipes to carry out simple operations such as pumping or venting the sample chamber. Many of the basic operations such as pumping, outgassing or venting the chamber occur automatically as does the sequence in which they occur.
Q150T 的作配方控制 描述了溅射镀膜蒸发循环中的作顺序 您还可以创建配方执行简单的 例如泵送放空样品室。 许多基本抽气、 除气腔室进行排气 它们发生的顺序都会自动占用

The Q150T is supplied with several default recipes to perform the basic and most common operations (seeTable 2)
Q150T 提供了几个默认配方,用于执行基本和最常见的作(见表 2)
.

Table 2 Q150T Default Recipes
表 2Q150T 默认配方

RECIPE NAME
配方名称

PURPOSE

Vent
发泄

Vent Chamber
通风

Vent sample chamber
排气样品

5nm Chromium*
5nm 铬*

FTM Terminated Sputter
FTM 端接溅射

Sputter coating run using Chromium target terminated by FTM at a coating thickness of 5nm (see page29)
溅射镀膜使用 FTM5nm 的镀膜厚度终止的铬靶(参见29 页)

Timed Chromium
定时镀铬

Timed Sputter
定时溅射

Sputter coating run using Chromium target terminated by time
溅射镀膜运行使用 Chromium 靶材终止时间

Aperture Cleaning
孔径清洁

Aperture Cleaning
孔径清洁

Clean hydrocarbon contamination from SEM & TEM apertures (see page44)
SEM 和 TEM 孔径中清洁碳氢化合物污染 44 页)

Glow Discharge -ve
辉光放电 -ve

DC Glow Discharge
DC 辉光放电

Etching / cleaning and modifying surfaces to be hydrophilic
蚀刻/ 清洁和改性表面以使其具有亲水性

Glow Discharge +ve
辉光放电 +ve

DC Glow Discharge
DC 辉光放电

Etching / cleaning and modifying surfaces to be hydrophobic
蚀刻/ 清洁和改性表面以

Metal Evaporation
金属蒸发

Metal Evaporation
金属蒸发

Metal evaporation terminated by time.
金属蒸发因时间而终止。

Pulsed Rod Evaporation
脉冲棒蒸发

Pulsed Rod Evaporation
脉冲蒸发

Evaporation using carbon rod with the coating built up of
使用进行蒸发 ,涂层

multiple thin layers using short current pulses (see page32)
使用短电流脉冲的多个薄(参见32 页)

Pulsed Cord Evaporation
脉冲索蒸发

Pulsed Cord Evaporation
脉冲蒸发

Evaporation using carbon cord with the coating built up of multiple thin layers using short current pulses (see page32)
使用进行蒸发 ,涂层使用短电流脉冲形成多个薄(参见第 3 2 页

10nm Ramped Carbon
10nm 斜向碳

Thickness Ramped Carbon
坡度厚度

Evaporation using carbon rod and a ramped evaporation current, terminated by FTM at a coating thickness of 10nm (see page42)
使用棒和斜坡 e 蒸发电流进行蒸发,FTM 以 10nm 的涂层厚度终止 (参见42 页)

Timed Ramped Carbon
定时斜向碳

Timed Ramped Carbon
定时斜向

Evaporation using carbon rod and a ramped evaporation current, terminated by time (see page38)
使用棒和斜坡 e 蒸发电流进行蒸发 由 time 终止(参见38 页)

Controlled Pulsed Cord*
受控脉冲线*

Controlled Pulsed Cord
ControlledPulsedCord ( 受控脉冲索)

Evaporation using carbon cord with the coating built up of multiple thin layers generated by short current pulses (see page35)
使用线进行蒸发 涂层短电流脉冲产生的多个薄构成 (参见35 页)

Pump Down
抽空

Evacuate chamber to maintain vacuum specification. Manual venting required.
抽真空室以保持真空规格。 需要手动排气

* Recipe only present on systems equipped with FTM.
* 配方仅存在于配备 FTM 的系统上

To customise recipes for your own applications, you can:
为您自己的应用程序自定义配方 ,您可以

Create a new recipe
创建新配方

Edit an existing recipe
编辑现有配方

Make a copy of an existing recipe
复制现有食谱

Rename an existing recipe
重命名现有配方

Delete a recipe
删除配方

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Q150T S/E/ES plus

4.1.1 Creating a New Recipe
4.1.1 创建新的 Recipe

To create a new recipe:
创建新配方:

1. From the Home screen, tap on the Recipes button. The Recipes screen is displayed (seeFigure 3-2)
1. 在主屏幕上,点击配方按钮。此时将显示 Recipes 屏幕(参见图 3-2)
.

2. Tap on
2. 点击

. The
Choose
选择
Process
过程
Type
类型
screen
屏幕
is
displayed
显示
(see
Figure
数字
4-1).

Figure 4-1. Creating a new recipe: choosing the process type
4-1.创建新配方:选择工艺类型

3. Choose
选择
the
type
类型
of
process
过程
, for
example
, Timed
定时
Sputter
溅射
. You
may
五月
need
需要
to
scroll
滚动
through the
通过
list to find the type
list 查找类型
of
process you
处理你
want.
要。
See page
见页面
82for
a list
列表
of
all
the
available
可用
recipes.
食谱。
Note
注意
that th
那个
e recipes
食谱
listed
上市
are
different
不同
for
Q150TE
TE 公司
, Q150
、Q150
TS
TS 系列
and
Q150TES
储热
models
模型
.

4. Enter a name for the recipe using the on-screen keyboard
4. 使用屏幕键盘输入配方名称
.

Figure 4-2. Entering a new recipe name
4-2. 输入新配方名称

5. Tap on the Enter button to confirm the recipe name. Alternatively, tap on
5. 点击 Enter 按钮确认配方名称或者点击

to
close the
关闭
screen wit
屏幕机智
hout
豪特
creating
创建
a new
新增功能
recipe.
食谱。

6. The new recipe is created using the default settings for the chosen process type.
6. 配方是使用所选工艺类型的默认设置创建的

7. Now refer to the Editing Recipe Parameters section, below
7. 现在,请参阅下面的 Editing Recipe Parameters 部分
.

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4.1.2 Editing Recipe Parameters
4.1.2 编辑配方 Pa 辐射

1. To edit a recipe from the Recipes screen, tap on the
1. 要从 Recipes 屏幕编辑配方 请点击

symbol
象征
alongside
旁边
its name
它的名字
. The
recipe
食谱
s properties
性能
are
displayed
显示
. If
如果
you
have
just
created
创建
a new
新增功能
recipe, this
recipe 中,这个
screen
屏幕
is
displayed
显示
after you
在您之后
have
enter
进入
ed
艾德
a name.
名字。

Figure 4-3. Recipe Parameters
4-3. 配方 Pa 射线

2. Properties are displayed across two pages. Tap on the numbered buttons
2. 属性显示在两个页面上。点击编号吨数

to
move
移动
between
之间
the
paged
screens
屏幕
. The
first
第一
page
lists
列表
the
properties
性能
that
define
定义
and
control
控制
the recipe
食谱
type.
类型。
The
second page lists
第二页列表
the
default
违约
system
系统
parameters
参数
(see
(参见
page
51) that are
他们是
applied to the
应用于
recipe.
食谱。
3. To
edit
编辑
a parameter
参数
, for
example
Sputter
溅射
Current
当前
, tap
水龙头
on
it
.

If a parameter is shown in grey text, you do not have the necessary user privileges to edit it. See page54for details.
如果参数以灰色文本显示, 则表示您没有编辑它所需的用户权限。参见第 54的 details。

4. Change the value using the onscreen keypad. Note that the screen shows the allowed values for the parameter.
4. 使用屏幕上键盘更改请注意 屏幕会显示参数的允许值

5. Tap on the Confirm button to apply the change or on the Cancel button to restore the previous value.
5. 点击 确认按钮应用更改,或点击 取消按钮恢复以前的 value。

Figure 4-4. Editing a Recipe Parameter
4-4. 编辑配方参数

6. Edit other parameters as required
6. 根据需要编辑其他参数
.

7. Tap on
7. 点击

to
return
返回
to
the
recipes
食谱
list
列表
or
on
to
display
显示
the
Home
screen
屏幕
. To
see
a list
列表
of the
parameters
参数
used
使用
in
recipes
食谱
see
page
82.

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4.1.3 Copying a Recipe
4.1.3 复制配方

To copy an existing recipe:
复制现有配方:

1. From the Recipes screen, tap on the
1. 在 “配方” 屏幕中, 点击

symbol alongside the recipe’s name
符号

2. Tap on
2. 点击

.

3. Click on the OK button to confirm the action
3. 点击 OK 按钮确认作
.

A copy of the recipe is created with the name“copy_< recipe name>”. You may now want to rename (see below) and edit the recipe.
将创建名称为“copy_<recipename>”配方副本 现在可能想要重命名 (见下文 编辑配方。

4.1.4 Renaming a Recipe
4.1.4 重命名配方

To rename an existing recipe:
重命名现有配方:

1. From the Recipes screen, tap on the
1. 在 “配方” 屏幕中, 点击

symbol alongside the recipe’s name
符号

2. Tap on
2. 点击

. Use the onscreen keyboard to type a new name for the recipe
使用屏幕键盘键入配方的新名称
.

3. Click on the OK button to confirm the action
3. 点击 OK 按钮确认作
.

The recipe is renamed in the recipe list.
配方将在 recipe 列表中重命名

4.1.5 Deleting a Recipe
4.1.5 开发 Recipe

To delete an existing recipe:
删除现有 recipe:

1. From the Recipes screen, tap on the
1. 在 “配方” 屏幕中, 点击

symbol alongside the recipe’s name
符号

2. Tap on
2. 点击

.

3. Click on the OK button to confirm the action
3. 点击 OK 按钮确认作
.

The recipe is deleted.
配方将被删除。

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4.2

4.3

Materials
材料

The software contains a database of the most common elements and alloys used in sputtering and evaporation applications (see Table 3). The embedded density information is used to calculate film thickness.
该软件包含一个数据库 ,其中包含和蒸发应用中最常用的元素合金 (见3) 嵌入的密度信息用于计算薄膜厚度。

Table 3 Materials and their density
表 3 材料及继承人密度

Material
材料

Density, g/cm3
密度,g/cm3

Aluminium

2.70

Carbon

2.25

Titanium

4.54

Chromium

7.19

Nickel

8.90

Copper

8.96

Silver

10.50

Palladium

12.02

Gold / Palladium (Au/Pd) (80:20 mix)
/ Au/Pd (80:20 混合

17.86

Tungsten

19.30

Gold

19.32

Platinum / Palladium (Pt/Pd) (80:20 mix)
/ Pt/Pd (80:20 混合

19.56

Platinum

21.45

Iridium

22.40

User Defined allowable range
用户定义的允许范围

1.00 - 23.00
1.00-23.00

The Materials list
“材质”列表

To list the materials currently in the database, tap on the Materials button on the Home screen (seeFigure 4-5)
列出数据库中的当前材料 请点击 材料主页屏幕上按钮 n( 4-5)
.

Figure 4-5. Materials Editor
4-5. 材质编辑器

To create a new material, tap on
创建新材料 请点击

(see Creating a new material, 4.3.1).
参见 Creatinganewmaterial4.3.1)。

To edit a material, tap on
编辑材质 请点击

adjacent to its name (see Editing material parameters,4.3.2)
(请参阅编辑材质参数 4.3.2)
.

To delete a material, tap on its name and then tap on
删除素材 请点击名称 然后点击

.

Q150T S/E/ES plus

4.3.1 Creating a New Material
4.3.1 创建新的 M 天线

To create a new material:
创建新材质:

1. Tap on the Materials button on the Home screen. The Select Material screen is displayed (seeFigure 4-5)
1. 点击主屏幕上的“材料”按钮显示“选择材料”屏幕(见图 4-5)
.

2. Tap on
2. 点击

. .

3. Enter a name for the material using the on-screen keyboard
3. 使用屏幕键盘输入材质的名称
.

4. Tap on the Enter button to confirm the new material’s name.
4. 点击 Enter 按钮以确认材料的名称

Alternatively, tap on
或者,点击

to
close the
关闭
screen without
无屏幕
creating a
创建
new
新增功能
materi
材料
al.
铝。

5. Now refer to the Editing Material Parameters section, below
5. 现在,请参阅下面的 Editing Material Parameters 部分
.

4.3.2 Editing Material Parameters
4.3.2 编辑材质参数

Each material is defined by the parameters shown inTable 4:
每种材料都由表 4 中所示的参数定义

Table 4 Material parameters
表4 材质参数

Name
名字

Default Value
默认值

Minimum Value
最小值

Maximu
马克西姆

m Value
m

Comment
评论

Density
密度

10

1

30

Material Type
材料类型

Oxidising
氧化

Noble
高贵

Oxidising
氧化

Sputter Current
溅射电流

50

1

150

Clean Current*
Clean Current (清洁电流)*

150

100

150

Material Tool*
材质工具*

0.1

10

Sputter cleaning mode**
溅射清洁模式**

Timed
定时

Specifies how the material will be cleaned. Options are:
指定如何清洁材质 选项包括:

Timed
定时

Continuous sputter for fix time. Pulse above
固定时间的连续溅射 脉搏以上

Cycle plasma until target voltage is above that specified in
循环等离子体 ,直到目标电压高于 中指定的值

Sputter stop cleaning at
溅射停止清洗

Pulse below
脉搏

Cycle plasma until target voltage is below that specified in
循环等离子体 ,直到目标电压低于

Sputter stop cleaning at
溅射停止清洗

Sputter stop
溅射停止

cleaning at (Volts)**
清洁电压 (伏特)**

250

90

600

Target voltage that needs to be achieved before cleaning is
清洁需要达到的目标电压

completed and the coating
完成和涂层

starts. Only used during pulse cleaning of target.
开始。 仅在目标的脉冲清洁期间使用

Turbo Sputter
Turbo 溅射

Bleed Vacuum (mbar)*
排放真空 (mbar)*

1 x 10-2
110-2

5 x 10-4
5x10-4

0.5

* Requires Admin level privileges to edit this parameter.
* 需要管理员级别的权限才能编辑此参数。

** Changes to these parameters will need to be carried out by a Quorum agent.
** 对这些面值表的更改需要由 Quorum 代理进行。

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To edit a material:
编辑材质:

1. Tap on the
1. 点击

symbol alongside its name on the Select Material screen. The materials properties are displayed. If you have just created a new material, this screen is displayed after you have entered a name.
符号 并显示材质的属性 如果您刚刚创建了材质 在您输入名称会显示屏幕

2. To edit a parameter, tap on its value
2. 要编辑参数,请点击其值
.

3. Change the value using the onscreen keypad. Note that the screen shows the allowed values for the parameter.
3. 使用屏幕上键盘更改请注意 屏幕显示参数的允许值

4. Tap on the Confirm button to apply the change or on the Cancel button to restore the previous value.
4. 点击 确认按钮应用更改 ,或点击 取消按钮恢复以前的 value。

5. Edit other parameters as required
5. 根据需要编辑其他参数
.

6. Tap on
6. 点击

to return to the materials list or on to display the Home screen
返回材质列表,或打开以显示主屏幕
.

Figure 4-6. Editing Material Parameters
图 4-6.编辑材质参数

4.3.3 Deleting a Material
4.3.3 删除材质

To delete a material, tap on its name and then tap on
删除材质,请点击名称 ,然后点击

.

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5 Application Guidelines
5 申请指南

This section describes the recipes and their typical applications.
本节介绍 Recipes 及其典型应用。

5.1 Timed Sputter
5.1 定时 Sputter

Suitable for the following applications:
适用于以下应用

SEM coatings for tungsten emission SEM
● 用于钨发射 SEM 的 SEM 涂层
.

High resolution SEM coatings for field emission SEM
● 用于场发射 SEM 的高分辨率 SEM 涂层
.

General thin film coatings
● 通用薄膜涂层
.

Target materials: Au, Au/Pd or Pt
材料:AuAu/PdPt

5.1.1 Tungsten SEM work
5.1.1 钨 SEM 工作

For this type of work, the aim is to achieve a typical thickness of 10-20 nm from a gold target. Figure 9-1 shows the deposition rate vs current graph for gold. With a current of 20mA, a deposition rate of 20nm/minute is typically achieved (assuming that the sample height is set to the default height of 60mm and the vacuum is 1x10-2 mbar).
对于此类工作 目标是材获得 10-20nm 的典型厚度 9-1s 金的沉积速率当前图表如何。 20mA 的电流 通常可实现 20nm/min沉积速率 假设样品高度设置为默认高度 60mm真空度为 1x10-2 mbar)。

To achieve a gold coating of 10nm create a new recipe based on Timed Sputter. The default Material setting is Gold. Set the time to 30 seconds
要获得 10nm 的金涂层,请创建一个基于定时溅射的新配方默认材料设置为 Gold 将时间设置为 30 秒
.

If necessary adjust the time or current slightly to modify the thickness.
如有必要 ,稍微调整时间电流修改厚度。

5.1.2 High resolution SEM coatings for field emission SEM
5.1.2 用于场发射 SEM高分辨率 SEM 涂层

Generally, the recommended target materials are chromium or iridium and the objective is to generate a coating thickness of 5-10 nm
通常,推荐的靶材是铬或铱,目标是产生 5-10 nm 的涂层厚度
.

The deposition rate vs current graph using a chromium target is shown inFigure 9-2. With a current of 100 mA, a deposition rate of 20nm/minute is typically achieved (assuming that the sample height is set to the default height of 60mm and the vacuum is 1x10-2 mbar)
使用 铬靶材的沉积速率与电流的关系图如图 9-2 所示 电流 100 mA 通常可实现 20nm/min 沉积速率 假设 样品高度 设置为 默认高度 60mm 真空度为 1x10-2 mbar

To achieve a chromium coating of 10nm, create a new recipe based on Timed Sputter
要获得 10nm 的铬涂层,请创建一个基于定时溅射的新配方
:

Set the material to Chromium
● 将材质设置为 Chromium
.

Set the time to 30 seconds
● 将时间设置为 30 秒
.

If necessary adjust the time or current slightly to modify the thickness.
如有必要 ,稍微调整时间电流修改厚度。

5.1.3 Aluminium thin film
5.1.3 铝薄膜

Aluminium is often difficult to coat due to its fast oxidizing properties. Also, its oxidized layer is difficult to remove as it reduces the required target voltage to produce a sputter current of 150mA. This increases the time required to clean the target.
由于其快速氧化特性 ,通常难以涂层 而且它的氧化层也很难去除 因为它会降低产生溅射所需的靶电压电流150mA。会增加清洁目标所需的时间

However, the Q150T is set up to cycle the plasma which reduces this cleaning time. The cleaning cycle is terminated when the target voltage rises above 300V, thus preventing an already clean target coating the chamber excessively.
然而,Q150T设置为循环等离子 这减少了这种清洁时间 目标电压上升300V 以上时 清洁周期终止 从而防止已经清洁的目标过度覆盖腔室

As an example, to achieve an Aluminium coating of 100nm
例如,要实现 100nm 的铝涂层
:

1. Create a new recipe based on FTM Terminated Sputter
1. 基于 FTM 端接溅射创建新配方
.

2. Set the material to Aluminium
2. 将 material 设置为 Aluminium
.

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3. When prompted, select Setup process using material data. This applies a sputter current of 150mA to clean the target
3. 出现提示时,选择使用材料数据设置过程。这施加了 150mA 的溅射电流来清洁目标
.

4. Edit the Terminate Thickness setting to 100nm
4. 将 Terminate Thickness 设置编辑为 100nm
.

The clean time on the second page of recipe properties should be between 10 and 30 seconds. However, leave at the default value of 30 seconds for this setup (requires Admin level to edit). The Q150T applies the optimum parameters for the cleaning cycle appropriate to your selection in the material list (in this case, aluminium).
recipe 属性第二页上清理时间介于 1030之间, 但是 ,对于此设置 ,请保留默认值 30 (需要管理员级别进行编辑)。Q150T 根据您材料列表中的选择 在本例中为铝 )为清洁周期应用最佳参数

On running the above process the coater will:
在运行上述过程时, 涂布机将:

1. Pump down to the clean stage as before
1. 像以前一样抽真空至清洁阶段
.

2. Clean the target for the time specified by Clean Time in the recipe
2. 在配方中 Clean Time 指定的时间内清洁目标
.

3. Wait for 20 seconds with the plasma off
3. 关闭等离子体 20 秒
.

4. Repeat the procedure until the target voltage is above 300V at the end of the clean cycle for two consecutive cycles.
4. 重复该过程 直到清洁周期结束时目标电压高于 300V 连续两个周期。

5. Continue with the standard sputter cycle
5. 继续进行标准溅射循环
.

If the target voltage fails to reach 300V after 15 cycles (see note below) the process is stopped automatically. This might occur if the target has not been used recently. Vent the system, remove the target and clean it manually using a fine abrasive. Repeat the process.
如果目标电压15 次循环未能达到 300V 参见下面的注释 ), 则该过程将自动停止如果未使用目标 则可能会发生这种情况最近对系统进行通风,移除目标并使用ABrasive 手动清洁 重复该过程

The maximum of 15 cycles is determined by the Max pulse clean cycles property in System Properties - Sputter Parameters (see page 52). Note administrator level access is required to change this property.
最大 15 个周期系统属性 - 溅射参数 s 中的 Maxpulsecleancycles 属性决定 (参见52)。 注意需要管理员级别的访问权限才能更改此属性。

5.2 FTM Sputter
5.2FTM 溅射

This process (only available if the FTM is fitted) is suited to the following typical applications:
此过程 仅在安装 FTM可用 适用于以下典型应用:

SEM coatings for tungsten emission SEM
● 用于钨发射 SEM 的 SEM 涂层
.

High resolution SEM coatings for field emission FE- SEM
● 用于场发射 FE-SEM 的高分辨率 SEM 镀膜
.

General thin film coatings
● 通用薄膜涂层
.

5.2.1 High resolution SEM coatings for field emission SEM
5.2.1 用于场发射 SEM高分辨率 SEM 涂层

For High resolution SEM coatings for field emission SEM, the recommended target materials are generally chromium or iridium and the objective is to generate a coating thickness of 5-10 nm
对于用于场发射 SEM 的高分辨率 SEM 涂层,推荐的靶材材料通常是铬或铱,目标是产生 5-10 nm 的涂层厚度
.

To achieve a chromium coating of 5nm, create a new recipe based on FTM Sputter
要获得 5nm 的铬涂层,请基于 FTM 溅射创建一个新配方
:

Set the material to Chromium
● 将材质设置为 Chromium
.

When prompted, select Setup process using material data. This applies a Sputter Current of 120 mA and automatically sets the Clean Current to 150 mA and the Terminate Thickness to 5.00 nm.
出现提示 选择使用物料数据设置过程 这将施加 120 mA溅射电流 自动CleanCurrent 设置为 150 mATerminateThickness 设置为 5。00 纳米。

If necessary adjust the thickness required if the coating is not sufficient.
如有必要 如果涂层不足 请调整所需的厚度

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5.2.2

5.3

5.3.1

General thin film coatings
通用薄膜涂层

As an example, to achieve a silver coating of 100nm
例如,要实现 100nm 的银涂层
:

Create a new recipe based on FTM Terminated Sputter
● 基于 FTM 端接溅射创建新配方
.

Edit the newly created recipe
● 编辑新创建的配方
.

Set the material to Silver
● 将材质设置为银色
.

When prompted, select Setup process using material data. This applies a Sputter Current of 50 mA and a Terminate Thickness of 5.00 nm
● 出现提示时,选择使用物料数据设置过程。这施加了 50 mA 的溅射电流和 5.00 nm 的端接厚度
.

Edit the Terminate Thickness setting to 100nm.
TerminateThickness 设置编辑为 100nm。

Metal Evaporation
金属蒸发

This process is designed for the following applications:
此过程专为以下应用程序而设计

Alternative coatings methods for SEM samples where sputtering is not available.
用于无法进行溅射SEM 样品替代镀膜方法

Coating metal films on non-EM substrates
● 在非 EM 基材上涂覆金属薄膜
.

It is only available with Q150T E/ES models equipped with the optional metal evaporation insert. To achieve a specific coating thickness, the FTM must be installed.
仅适用于配备可选金属蒸发嵌件Q150TE/ES 型号 达到特定的涂层厚度 必须安装 FTM

How to achieve a 20nm gold coating
如何获得 20nm 金涂层

Fit the tungsten filament to the evaporation insert as described on page64.
64所述 ,将钨丝安装到 ev 发酵插件上。

Load the filament with a small quantity of the gold to be evaporated. Carefully fit the insert as described on page62.
细丝上加载少量要蒸发黄金 按照62的说明小心地安装插件

1. Create a new recipe based on Metal Evaporation
1. 创建基于金属蒸发的新配方
.

2. Edit the new recipe
2. 编辑新配方
:

Change Outgas time to a minimum of 2 seconds
Outgas 时间更改为至少 2

Set the Outgas Current to zero (outgassing is not necessary for this material).
OutgasCurrent 设置为零 材料不需要除气 )。

3. Ensure the FTM cover is open
3. 确保 FTM 盖已打开
.

4. Run the new recipe
4. 运行新配方
.

5. When the Pump Hold message is displayed, tap Continue when ready to proceed.
5. 当显示 Pump Hold保持 消息,准备好时点击 Continue(继续 继续。

6. The system pumps the chamber to the required vacuum
6. 系统将腔室泵送至所需的真空度
.

7. When pumping is complete, the system gradually increases the evaporation current.
7. 当抽气完成 系统逐渐增加蒸发电流。

Figure 5-1. Metal evaporation process
图 5-1。金属蒸发工艺

Q150T S/E/ES plus

8. When evaporation can be seen on the FTM monitor, press the Stop Ramp button
8. 当在 FTM 监视器上可以看到蒸发时,按下 Stop Ramp 按钮
.

9. When the required thickness is achieved, tap the Terminate button to stop evaporation and vent the chamber.
9. 当达到所需的厚度 点击 Terminate(终止) 按钮停止蒸发并对腔室进行排气。

5.4 Pulsed Cord Evaporation
5.4 脉冲索蒸发

This process is designed for preparing conductive carbon coatings for SEM specimens for X-ray microanalysis EDX and WDX. It is only available with Q150T E/ES models equipped with the carbon cord insert option.
工艺设计用于制备用于 X 射线微量分析SEM 样品的导电涂层 EDXWDX,仅适用于 Q150TE/ES 配备 CarbonCOrd 插件选项的型号。

5.4.1 How to create a 20nm carbon coating
5.4.1 如何创建 20nm 碳涂层

1. Install the carbon cord insert as described on page62.
1. 按照62的说明安装素线插件

2. Ensure the stage is fitted with the extended height cylinder (see page 73) to give the maximum source-to-stage distance.
2. 确保载物台装有加长高度的圆柱体( 参见73 页), 以提供最大的源到载物台的距离

3. Create a new recipe based on Pulsed Cord
3. 基于 Pulsed Cord 创建新配方
.

4. Edit the newly created recipe setting the parameters as shown inTable 5.
4. 编辑创建的配方设置参数 ,如5 所示

5. Run the new recipe
5. 运行新配方
.

Table 5 Pulsed cord evaporation parameters for 20nm coating.
表 5 20nm 镀膜的脉冲线蒸发参数。

Parameter
参数

Value
价值

Pulse Current
脉冲电流

50 A
一个 50

Pulses length
脉冲长度

3 s
3

Pulse count
脉冲计数

1

Outgas time
放气时间

60 s
60

Outgas Current
放气电流

30 A
一个 30

Pump Hold*
泵滞留*

Yes
是的

*Administrator level access is required to change this property.
*需要管理员级别的访问权限才能更改此属性

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5.5 Controlled Pulsed Cord Evaporation
5.5 受控脉冲索蒸发

This process is used for preparing conductive carbon coating using carbon cord. It requires the optional carbon cord insert (see page62)
该工艺用于制备使用碳帘线的导电碳涂层。它需要可选的碳素线插件(参见第 62 页)
.

During the process the coating is built up of multiple thin layers using short current pulses (see Figure 5-2). This reduces the heating effect on the sample and allows the FTM to be used to terminate the coating.
在此过程中 涂层 g 使用电流脉冲多个组成 (见5-2)减少了样品加热效应 ,并允许 FTM 用于研磨涂层。

5.5.1 Creating a 15nm to 2nm coating for EBSD
5.5.1 为 EBSD 创建 15nm 至 2nm 涂层

This section describes how to create a 15 to 2nm coating for EBSD
本节介绍如何为 EBSD 创建 15 至 2nm 涂层
.

1. Install the carbon cord insert as described on page 62ensuring that the C5421 carbon cord is used. Note the springs in the insert must be removed to ensure that the cord does not fuse prematurely.
1. 按照62的说明安装素线插件 确保使用 C5421素线 请注意 必须卸下插件中的弹簧 以确保电源线不会过早熔合

2. For the default tooling factor to be valid the stage should be fitted so the top of the sample is 60mm above the base plate
2. 为了使默认工具系数有效,应安装载物台,使样品顶部高于底板 60 毫米
.

3. Create a new recipe based on Controlled pulsed cord
3. 根据受控脉冲线创建新配方
.

4. Edit the newly created recipe setting the parameters as shown inTable 6. If an EBSD coating is required, set the terminate thickness to the required thickness i.e. 3nm
4. 编辑新创建的配方,设置参数,如表 6 所示。如果需要 EBSD 涂层,请将端接厚度设置为所需的厚度,即 3nm
.

Table 6 Controlled Pulsed cord evaporation parameters for 25nm coating.
表 6 25nm 镀膜的受控脉冲线蒸发参数。

Parameter
参数

Value
价值

Terminate Thickness
终止厚度

15 nm
15 纳米

Pulse Current
脉冲电流

54 A
一个 54

Pulse length
脉冲长度

1 s
1

Pulse Interval
脉冲间隔

10 s
10

The remaining properties have been optimised for coatings between 2 and 15nm with the top of the sample 60mm from the base plate. Thicker coatings at this stage position can be achieved. However this will increase the risk of the cord fusing before reaching the required thickness. If the cord does fuse it tends to deposit about 6nm, thus it can cause the required thickness to be exceeded. In order to reduce this error the system attempts to detect when the cord is about to fuse. If detected the coater will assume next pulse will produce 6 nm thus will apply the pulse if the predicted outcome would be closer to the terminate value.
其余特性已针对 2 至 15nm 之间的涂层进行了优化 ,样品顶部 60 毫米 在这个阶段位置可以实现涂层 但是,这将增加帘线达到所需厚度之前熔断的风险 如果电线确实熔合 它往往会沉积6nm 的波长,因此可能会导致超过所需的厚度 。为了减少错误 系统会尝试检测电源线何时即将熔断 如果检测到 镀膜机假设下一个脉冲将产生 6 nm 因此 ,如果预测结果更接近终止值 则应用脉冲

For a full list of recipe parameters seeTable 26.
有关 recipe 参数的完整列表 ,请参阅26。

5. Run the new recipe
5. 运行新配方
.

The reliability of this process depends on the operation of the FTM. The stability of the FTM is affected by the quality of the crystal. A crystal will need to be changed before the end of its maximum life. This can even be before the FTM status indicates 10% used (see page 48) as the deposited carbon will increase the thermal errors and can easily flake. These effects will increase if materials other than carbon are deposited on the crystal.
此过程可靠性取决于 FTM 运行 FTM 的稳定性晶体质量的影响 水晶在其最大使用寿命结束之前需要更换 甚至可以 FTM 状态显示 10% 的使用量之前 参见48 页), 因为沉积的会增加误差并且很容易剥落。 如果碳以外的材料沉积在晶体中 这些影响会增加

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Q150T S/E/ES plus

Figure 5-2. Typical 12nm Controlled pulse evaporation
图 5-2.典型的 12 nm C 在线脉冲蒸发

5.6 Pulsed Rod Evaporation
5.6 脉冲蒸发

Use this process for preparing TEM coatings for applying carbon reinforcement layers onto formvar grids. It is only available with Q150T E/ES models
使用此工艺制备 TEM 涂层,用于将碳增强层施加到 formvar 网格上它仅适用于 Q150T E/ES 型号
.

For a full list of recipe parameters seeTable 25on page83.
有关配方参数的完整列表, 请参见 83 页的表 25

5.6.1 How to create a conductive layer for SEM
5.6.1 如何为 SEM 创建导电层 r

1. Install the carbon insert as described on page 59. Use the rod shaper with the blue handle (provided in the accessory pack) to prepare carbon rods with a
1. 按照59的说明安装插件 使用带有蓝色手柄整形器 附件中提供 制备带有

1.2mm diameter spigot as described on page60.
直径为 1.2mm 的龙头 ,如60所述

Figure 5-3. Carbon rod shaper (blue handle) for preparing 1.2mm (dia) spigot
图 5-3。碳棒整形器(蓝色手柄),用于分离 1.2mm(直径)套管

2. Ensure the stage is fitted with an extended height cylinder (see page73) to give the maximum source-to-stage distance.
2. 确保载物台装有加长高度的圆柱体 参见73 页), 以提供最大的离子源到载物台的距离。

3. Create a new recipe based on Pulsed Rod
3. 基于 Pulsed Rod 创建新配方
.

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Q150T S/E/ES plus

4. Edit the newly created recipe setting the parameters as shown inTable 7.
4. 编辑创建的配方 设置参数 ,如7 所示

5. Run the new recipe
5. 运行新配方
.

6. The thickness of coating can be varied by adjusting the stage height, raise the stage to increase thickness, lower to reduce.
6. 可以通过调整载物台高度来改变涂层厚度 升高载物台以增加厚度, 降低以减少厚度。

Table 7 Pulsed rod evaporation parameters for conductive layer for SEM
表 7SEM 导电层脉冲棒蒸发参数

Parameter
参数

Value
价值

Material
材料

Carbon

Pulse Current*
脉冲电流*

62A

Pulses length
脉冲长度

3 s
3

Pulse count
脉冲计数

1

Outgas time
放气时间

10 s
10

Outgas Current
放气电流

40A

* Administrator level access is required to change this property.
* 需要管理员级别的访问权限才能更改此属性

CAUTION! For pulsed rod evaporation, the recommended pulse current range is 60-65A. Currents above this may activate the power supply safety trip causing the unit to shut down.
谨慎! 对于脉冲蒸发, 建议的脉冲电流范围 60-65A。 高于值的电流可能会激活电源安全跳闸,从而导致设备关闭。

5.7 Using Outgas Source options
5.7 使用废气源选项

In addition to the evaporation parameters described in the previous section, you can also set up enhanced outgassing with the Outgas source parameter with the Pulsed Rod or Pulsed Cord recipes. This has three settings: Multiple, Single or No as described below.
除了一节中描述的蒸发参数,您还可以通过 Pulsed Rod PulsedCord 配方Outgassource 参数设置增强的除气 。这有三个设置 MultipleSingle No 如下所述

.You need to be logged in at Administrator level to access this parameter (see page49)
您需要以管理员级别登录才能访问此参数(参见第 49 页)
.

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Table 8
8

Outgas Source options
排气源选项

Setting
设置

Action
行动

Single

outgas
排气

Applies the outgas current for the outgas time once. If the vacuum max recovery
除气电流应用于除气时间一次。 如果 vacuum 最大恢复

time is zero the coat cycle will automatically start. Otherwise, the current is turned off and outgas recovery starts. In this period, the Q150T waits for the vacuum to return to the level it was before the current was applied. This time is limited by
时间为零,涂层周期将自动开始。 否则, 电流关闭并开始除气回收 在此期间 Q150T 等待真空恢复到当前 wa s 施加之前的水平 。此时间

the max outgas recovery time parameter (default 10s). After this, the coating continues automatically.
Max Outgas Recovery Time 参数(默认 T10S)。在此之后, 涂层会自动继续。

Multiple outgas
多次排气

The Multiple outgas option allows you to verify that out gassing is occurring and to decide to continue or repeat the outgas cycle. It applies the outgas current and outgas recovery as above. After a cycle is completed, you are prompted to (a)
Multiple outgas( 多次放气 )选项允许您验证是否正在发生放气 决定继续重复放气 cycle。 它应用如上所述的排气电流和排气回收。一个周期完成后 ,您将提示 a)

carry out further out gas cycles, (b) start the coating or (c) vent the chamber.
进行进一步的气体循环,(b) 开始涂层或 (c) 对腔室进行排气。

If the vacuum is less than 0.05 mbar below the vacuum after the outgassing, the Coat button changes to green to advise that further outgassing is not necessary.
如果除气后真空度低于真空0.05mbar,则涂层按钮将变为绿色,以告知无需进一步除气

No

Skips the outgas step and waits 5 seconds for the stage to speed up before commencing coating.
跳过除气步骤并等待 5 秒,让该阶段加速 ,然后再开始涂层。

Q150T S/E/ES plus

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5.7.1

5.7.2

Setting Outgas Source options
设置出气源选项

To set up outgassing options:
设置脱气选项 s:

1. Change the user group mode to Admin level (see page49)
1. 将用户组模式更改为管理员级别(参见第 49 页)
.

2. On the Home screen, tap on Recipes (see page22)
2. 在主屏幕上点击配方(参见第 22 页)
.

3. Choose the recipe you want to edit: Pulsed Rod Evaporation or Pulsed Cord Evaporation
3. 选择要编辑的配方脉冲棒蒸发或脉冲绳蒸发
.

4. Tap on Outgas source
4. 点击排气源
.

5. Select Multiple, Single or No
5. 选择 MultipleSingle 或 No
.

6. Tap on OK to confirm the change
6. 点击确定以确认更改
.

Running Multiple Outgassing
运行多次脱气

When you run a recipe modified for multiple outgassing, you are prompted to repeat outgassing or proceed with coating (see below).
当您运行针对多次脱气修改的配方时, 系统会提示您重复脱气继续包衣 见下文 )。

Tap on the Yes button to run another outgas cycle.
点击按钮运行另一个排气循环。

Tap on the No button to continue with the coating following the parameters set for the particular recipe.
点击 “否 按钮 按照特定配方设置参数继续涂层

Figure 5-4. Prompt to repeat the outgas procedure or proceed with coating
图 5-4.提示重复除气程序或进行涂层处理

Q150T S/E/ES plus

Ramped Recipes
斜坡配方

The Q150T Ramped Recipes produce carbon coatings from a shaped carbon rod. We recommend these recipes instead of the Pulse Rod process if you require a consistently repeatable deposited thickness. There are two ramped recipes:
Q150T 斜向配方成型生产涂层如果您需要始终如一可重复性, 我们建议使用这些配方而不是脉冲工艺沉积厚度。这是两个斜坡食谱:

Timed Ramped Carbon - see page38
定时斜坡-38

Thickness Ramped Carbon - see page42(only available if FTM installed)
斜射厚度 - 参见42 仅在安装了 FTM 可用

Generally, these recipes require the use of the extended height chamber (see page 73). The short chamber may be used for a coating thickness greater than 12nm although the FTM will be inaccurate due to the close proximity of the high
通常, 这些配方需要加长高度的使用 (参见73 页)。 腔室可用于大于 12nm涂层厚度 但由于靠近

temperature rods.
温度棒。

Carbon insert setup
碳嵌件设置

1. Use the rod shaper with the red handle (provided in the accessory pack) to prepare two carbon rods each with a spigot 5mm long and with a diameter of
1. 使用带有红色手柄整形器 附件中提供 准备带有 5mm 直径

1.4mm diameter (see page62)
直径 1.4 mm(参见第 62 页)
.

Figure 5-5. Carbon rod shaper (red handle) for preparing 1.4mm (dia) spigot
图 5-5.用于制备 1.4 毫米(直径)套管的碳棒成型器(红色手柄)

2. You will then need to shape one of these rods to form a wedge using the wedge tool (Part No. 12097). This tool can be used to shape 3mm or 6mm rods. Use the end which has the grove closest to the plate to shape 3mm rods (seeFigure 5-6, detail B).
2. 然后 您需要使用楔形工具 零件 12097 将其中一根成型形成楔形 该工具可用于塑造 3mm 6mm 的棒材。 使用凹槽靠近一端形成 3 毫米的棒材(5-6, 细节 B)。

3. Hold the tool with the grove to be used uppermost
3. 握住最上面要使用的凹槽的刀具
.

Figure 5-6. Wedge tool (Part No. 12097)
图 5-6.楔形工具(零件 12097)

4. Place the rod with its shaped end into the grove ensuring the rod is pushed up to the shoulder.
4. 杆及其形状放入凹槽 确保肩部。

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5. File the rod so it is level with the metal tool. For best results, tap the dust out of the grove several times during this shaping process being careful not to move the rod.
5. 锉削,使其金属工具齐平为了获得最佳效果 在此成型过程中灰尘凹槽几次 ,小心不要移动杆。

6. Fit the flat-ended rod into the carbon gun (see page59)
6. 将平头杆安装到碳枪中(参见第 59 页)
.

7. Fit the wedge-shaped rod with its point closest to the plate of the insert (see Figure 5-7). Ensure that the sliding clamp of the insert is pulled back approximately 5mm and the point of the spigot is resting on the end of the plain spigot. It may be necessary to swap the side of the wedged spigot or to rotate the plain spigot.
7. 尖端靠近嵌件安装 5-7)。 确保将插件滑动向后5 毫米 并且龙头尖端位于普通龙头末端 可能需要交换楔形龙头一侧旋转普通龙头。

Figure 5-7. A finished wedge-shaped rod (left); and in position with plain rod (right)
图 5-7。成品楔形棒(左);和带普通杆的 P 位置(右)

5.8.2 The Timed Ramped Carbon recipe
5.8.2 定时斜坡碳配方

To achieve the controlled thickness this process uses a controlled evaporation current profile (seeFigure 5-8)
为了实现受控的厚度,该工艺使用受控的蒸发电流曲线(见图 5-8)
.

Ramped carbon process
斜向工艺

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50

45

40

35

30

25

20

15

10

5

0

Current increasing at Current Ramp Rate
电流斜坡速率下电流增加

Ramp terminated at Evaporation Current
斜坡终止于蒸发电流

Ramp terminated
坡道终止

PreEvap End current
PreEvap 结束电流

Evaporation time
蒸发时间

Current increasing at Pre Evap Rate
电流在蒸发下增加

Outgas time
放气时间

0 10 20 30 40 50 60 70 80 90 100

Time(s)
时间

Figure 5-8. Ramped evaporation current profile with default parameters
图 5-8。 使用默认参数的斜坡 ev 分布电流曲线

This consists of four phases:
这包括四个阶段:

1. The rods are outgassed at the Outgas Current for the Outgas Time. The shutter opens and the evaporation starts.
1. 除气电流时间快门打开 开始蒸发

Q150T S/E/ES plus

2. The evaporation current increases at the Pre Evap Rate* until the value of PreEvap End current is reached.
2. 蒸发电流PreEvapRate*(预蒸发速率)*增加 直到 PreEvap End current 的值达到最大值

3. The evaporation current now increases at the Current Ramp Rate* until the Evaporation Current value is reached or the Evaporation Time has expired.
3. 蒸发电流现在当前斜坡速率 * 增加 直到达到蒸发电流蒸发时间已过。

4. The evaporation current is held constant until Evaporation Time has expired.
4. 蒸发电流he ld数, 直到蒸发时间结束。

(* Admin level required to change these parameters)
(* 更改这些标准需要管理员级别

If you observe excessive sparking during the first 30 seconds of the evaporation stage the Pre Evap End Current parameter should be reduced by 1A at a time (but no lower than 27A).
如果您在蒸发阶段的前 30内观察到过多的火花 ,则 Pre Evap End Current 参数应一次减少 1A(但不低于 27A)。

If excessive sparking is seen 30 seconds or more into the evaporation stage, reduce the Current Ramp Rate.
如果在蒸发阶段 30更长时间看到过多的火花 ,请重新显示当前斜坡速率

If you change Thickness/Timed Ramped Carbon recipe parameters ensure that the Evaporation Time is sufficient to achieve a constant current for at least 8 seconds (but no more than 30s) at the end of the recipe
如果您更改了 Thickness/Timed Ramped Carbon(厚度/定时斜坡碳)配方参数,请确保蒸发时间足以在配方结束时实现至少 8 秒(但不超过 30 秒)的恒定电流
.

The default settings are correct for use with a 1.4mm spigot. However, there is often a slight variation in the tooling of the rod shapers. You can correct the default current setting for the actual rod spigot size using the following formula:
默认设置适用于 1.4mm 龙头。 然而,材成型机模具通常存在细微的变化 您可以使用以下公式更正 act ualrodspigotsize 的默认当前设置

New current =Spigot diameter2 x Default current
电流 = 龙头直径 er2x 默认电流

1.69

For example, if the actual spigot diameter is 1.1mm you should use an evaporation current of 30.8A.
例如 如果实际龙头直径1.1mm 则应使用 30.8A 蒸发电流

5.8.3 Adjusting coating thickness
5.8.3 调整涂层厚度

The default settings in the Thickness/Timed Ramped Carbon recipes will produce a 15 to 20nm coating suitable for SEM use. The actual coating thickness will depend on the stage height and the diameter of the spigot produced by your sharpener.
厚度 / 定时斜向配方中的默认设置产生适合 SEM 使用的 1520nm 涂层 实际涂层厚度取决于载物台高度磨刀机生产的龙头直径

As an approximate guide, the coating thickness is proportional to the square of the distance between the stage height and the rods (the same amount of material is distributed over an increasing area as it travels away from the rods).
作为近似指导, 涂层厚度载物台高度之间距离平方成正比 相同数量的材料 分布在增加的 a 上 因为它远离杆)。

New Thickness = Distance from source2 x Thickness at original distance Required distance2
新厚度 = 的距离 2 x 原始距离的厚度 s 所需距离 2

Example. Assume that a coating thickness of 18nm has been achieved with a separation between the rods and source of 125mm (equivalent to a stage height of 75mm using the extended height chamber). To achieve a coating thickness of 11nm you would need to increase the separation to 160mm
例。假设在棒和源之间的间隔为 125 毫米(相当于使用加长高度室的 75 毫米平台高度)的情况下实现了 18 纳米的涂层厚度。要实现 11nm 的涂层厚度,您需要将间隔增加到 160mm
.

The thickness of the deposited carbon can also be controlled by changing the propertyEvaporation current”. This property is the final current achieved during the ramped recipe (see Figure 5-8). The default current is 46A and this is the maximum that should be used for a 1.4mm spigot. However, reducing the Evaporation Current reduces the thickness of the coating. For example, with the Evaporation Current set to 38A the thickness of the coating (at a distance of 125mm) is reduced to approximately 5nm.
沉积厚度也可以通过改变 蒸发电流 特性来控制 属性是在斜坡配方期间达到的最终电流 5-8) 默认电流46A 这是应该使用的最大值 用于 1.4 毫米的插口。 然而, 降低蒸发电流减少涂层厚度 例如,蒸发rrent 设置为 38A 涂层的厚度 距离 125mm 减少大约 5nm。

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5.8.4 How to create a carbon support layer For TEM
5.8.4 如何为 TEM 创建碳支撑层

1. Install the carbon insert as described on page59.
1. 按照59的说明安装插件

2. Use the rod shaper with the red handle (provided in the accessory pack) to prepare two carbon rods each with a spigot 5mm long and with a diameter of
2. 使用带有红色手柄形器 附件中提供 准备带有 5mm 直径5mm套管

1.4mm diameter (seeFigure 5-5, page37)
直径 1.4 mm(参见图 5-5,第 37 页)
.

3. Ensure the stage is fitted with the longer support shaft adjusted to a height of 75mm above the base plate
3. 确保载物台装有较长的支撑轴,该轴可调节到底板上方 75 毫米的高度
.

4. Ensure the extended height cylinder 10429 is fitted as described on page73.
4. 确保按照73的说明安装加长高度气缸 10429

5. Create a new recipe based on Timed Ramped Carbon
5. 根据定时 Ramped Carbon 创建新配方
.

6. Edit the newly created recipe setting the parameters as shown inTable 9.
6. 编辑创建的 recipe 设置参数 9 所示

7. Run the new recipe
7. 运行新配方
.

Table 9 Ramped Carbon TEM parameters for 5nm coating
表 9 5nm 镀膜的斜向碳 TEM 参数

Parameter
参数

Value
价值

Evaporation Current
蒸发电流

41 A
一个 41

Evaporation time
蒸发时间

60 s
60

Maximum evaporation time *
最大蒸发量*

6 min
6 分钟

Tooling Factor
工具系数

1

Pre Evap End Current
预蒸发结束电流

32.0 A
一个 32.0

Current Ramp Rate
当前斜坡速率

0.25 A/s
0.25 每秒

Outgas Current
放气电流

20 A
一个 20

Out Gas time
用完 Gas 时间

10 s
10

Pump Hold
泵保持

Yes
是的

Pre Evap Rate*
蒸发前率*

1.00 A/s
1.00 每秒

* Administrator level access is required to change this property.
* 需要管理员级别的访问权限才能更改此属性

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5.8.5 How to create a conductive carbon layer for SEM
5.8.5 如何为 SEM 创建导电碳铺设

1. Install the carbon insert as described on page59.
1. 按照59的说明安装插件

2. Use the rod shaper with the red handle (provided in the accessory pack) to prepare two carbon rods each with a spigot 5mm long and with a diameter of
2. 使用带有红色手柄整形器 附件中提供 准备棒,带有 5 mm 直径

1.4mm diameter (see page62)
直径 1.4 mm(参见第 62 页)
.

3. Ensure the stage is fitted with the longer support shaft adjusted to a height of 75mm above the base plate
3. 确保载物台装有较长的支撑轴,该轴可调节到底板上方 75 毫米的高度
.

4. Ensure the extended height cylinder 10429 is fitted as described on page73.
4. 确保按照73的说明安装加长高度气缸 10429

5. Create a new recipe based on Timed Ramped Carbon
5. 根据定时 Ramped Carbon 创建新配方
.

6. Edit the newly created recipe setting the parameters as shown inTable 10.
6. 编辑创建的配方 ,设置参数 ,如10 所示

7. Run the new recipe
7. 运行新配方
.

Table 10 Timed Ramped Carbon parameters for SEM coatings
表 10 SEM 涂层的定时斜坡 Carbon 参数

Parameter
参数

Value
价值

Evaporation Current
蒸发电流

52 A
一个 52

Evaporation time
蒸发时间

108 s
108

Maximum evaporation time *
最大蒸发量*

6 min
6 分钟

Tooling Factor
工具系数

1

Pre Evap End Current
预蒸发结束电流

32.0 A
一个 32.0

Current Ramp Rate
当前斜坡速率

0.25 A/s
0.25 每秒

Outgas Current
放气电流

20A

Out Gas time
用完 Gas 时间

10 s
10

Pump Hold
泵保持

Yes
是的

Pre Evap Rate*
蒸发前率*

1.00 A/s
1.00 每秒

* Administrator level access is required to change this property.
* 需要管理员级别的访问权限才能更改此属性

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5.8.6 Thickness Ramped Carbon controlled by the FTM
5.8.6FTM 控制的厚度斜坡碳

The
Thickness
厚度
Ramped
加大
Carbon
recipe
食谱
is
only
available
可用
if
如果
an
FTM isfitted
已装配
.

To achieve a controlled thickness this process uses a controlled ramped evaporation current (see Figure 5-8) as in the Timed Ramped Carbon recipe but, instead of using time as the control, the FTM controls the thickness.
为了实现受控的厚度 工艺使用同步的斜坡蒸发电流 5-8), 就像定时斜坡配方一样 不是使用时间作为控件,FTM 控制厚度。

The following differences between the Timed Ramped Carbon recipe and the Thickness Ramped Carbon recipe are:
定时斜切 Carbon 配方ThicknessRamped Carbon 配方之间的以下区别是:

The thickness is only monitored by the FTM from 15 seconds after the end of the current ramp, when the current is stabilised, until the end of the recipe when the required thickness has been achieved.
厚度FTM 监控 ,从电流斜坡结束后的 15开始 ,当电流稳定时, 直到配方结束 已达到所需的厚度

The shutter will open 15 seconds after the end of the current ramp when the current is stabilised.
电流稳定时, 快门将在电流斜坡结束后 15 打开

Evaporation will stop when the correct thickness is reached, and the shutter will close.
当达到正确的厚度 蒸发停止 百叶窗关闭。

To use this recipe:
使用此配方:

1. Install the carbon insert as described on page59.
1. 按照59的说明安装插件

2. Use the rod shaper with the red handle (provided in the accessory pack) to prepare two carbon rods each with a spigot 5mm long and with a diameter of
2. 使用带有红色手柄整形器 附件中提供 准备棒,带有 5 mm 直径

1.4mm diameter (see page37)
直径 1.4 mm(参见第 37 页)
.

3. Ensure the stage is fitted with the longer support shaft adjusted to a height of 75mm above the base plate
3. 确保载物台装有较长的支撑轴,该轴可调节到底板上方 75 毫米的高度
.

4. Ensure the extended height cylinder 10429 is fitted as described on page73.
4. 确保按照73的说明安装加长高度气缸 10429

5. Create a new recipe based on Thickness Ramped Carbon
5. 根据 Thickness Ramped Carbon 创建一个新配方
.

6. Edit the newly created recipe
6. 编辑新创建的配方
.

7. Set Terminate Thickness to the required value (default 5 nm).
7. TerminateThickness(终止厚度) 设置为所需的 默认5nm)。

Table 11 Thickness Ramped Carbon parameters for 5nm coating
表 11 5nm 涂层的厚度斜波碳参数

Parameter
参数

Value
价值

Evaporation Current
蒸发电流

52 A
一个 52

Maximum evaporation time *
最长蒸发时间 *

10 min
10 分钟

Terminate Thickness
终止厚度

5 nm
5 纳米

Tooling Factor
工具系数

1

PreEvap End current
PreEvap 结束电流

32 A
一个 32

Current Ramp Rate*
当前升温速率*

0.2 A/s
0.2 每秒

Outgas Current
放气电流

20 A
一个 20

Outgas time
放气时间

10 s
10

Pump Hold
泵保持

Yes
是的

* Administrator level access is required to change this property.
* 需要管理员级别的访问权限才能更改此属性

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Q150T S/E/ES plus

5.9 Glow Discharge
5.9 辉光放电

Requires optional Glow Discharge insert.
需要可选的 Glow Discharge 插件。

This process can be used to clean hydrocarbon contamination from components. It is only available with Q150T S and ES models which are equipped with the Sputter power supply.
工艺可用于去除组件中的碳氢化合物污染 它仅适用于配备溅射电源Q150TSES 型号

1. Carefully fit the insert as described on page66.
1. 按照66的说明小心地安装插件

2. Select Glow Discharge from the Recipes screen and run the process
2. 从“配方”屏幕中选择 Glow Discharge,然后运行该过程
.

The default settings should be sufficient to create a hydrophilic surface on a carbon film. The process can be varied by creating a new recipe:
默认设置足以创建亲水表面 可以通过创建新配方来改变该过程

1. Create a new recipe from the default Glow discharge -ve recipe
1. 从默认 Glow discharge -ve 配方创建新配方
.

2. Edit the Glow Discharge Current from 20mA to a higher value, for example, 25mA
2. 将辉光放电电流从 20mA 编辑到更高的值,例如 25mA
.

The current may also be increased manually during the process but this setting would not be retained for future runs.
在此过程中 ,也可以手动增加电流 ,但此设置不会保留以备将来运行。

5.9.1 Hydrophilisation

Freshly made carbon support films tend to have a hydrophobic surface which inhibits the spreading of suspensions of particles in negative staining solutions. However, after Glow Discharge treatment with air, the carbon film is made hydrophilic and negatively charged, thus allowing easy spreading of aqueous suspensions. With alternative equipment such as Quorum GloCube, Magnesium Acetate treatment will make the surface hydrophilic and positively charged.
制备支撑往往具有疏水表面 ,可抑制颗粒悬浮液负稳定溶液中的扩散 然而 在用空气进行辉光放电处理变得亲水性 因此允许水性悬浮液轻松铺展 使用 QuorumGloCube酸镁替代设备 处理将使表面具有亲水性p 带电

In addition to Glow Discharge with the Quorum GloQube treatment using air, other processes may be used to modify surface properties. Such treatments can facilitate the optional absorption of selected biomolecules.
除了使用 airQuorumGloQube 处理辉光放电 还可以使用其他工艺改变表面特性。 这种处理可以促进选定生物分子选择性吸收

5.9.2 Surface Cleaning
5.9.2 表面清洁

In many instances, surfaces need to be completely cleared of contamination films or deposits. This applies particularly to EM components where such deposits impair the maintenance of a clean vacuum system. A Glow Discharge treatment can be used to clean such components of undesirable residues.
在许多情况下 需要完全清除表面污染沉积物。这尤其适用于电磁组件 因为这些沉积物会损害清洁真空系统的维护 GlowDischarge 处理可用于清洁不需要残留物的此类成分

Table 12 Glow discharge treatments
表 12 辉光放电处理

Atmosphere
大气层

Surface
表面

Charge
负责

Air
空气

Hydrophilic
亲水的

Negative
阴性

Air
空气

Hydrophilic
亲水的

Positive (with subsequent
阳性(后续

magnesium acetate treatment)
醋酸镁酯

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5.10 Aperture Cleaning
5.10 孔径清洁

Requires optional Metal Evaporation insert (see page63)
需要可选的金属蒸发插件(参见第 63 页)
.

This process is designed to clean hydrocarbon contamination from SEM & TEM apertures. It is only available with Q150T E/ES models equipped with the optional metal evaporation insert.
这个过程旨在清理 SEMTEM 孔径中的碳氢化合物污染 仅适用于配备可选金属蒸发插件Q150TE/ES 型号

1. Fit the molybdenum boat source to the evaporation insert as described on page64.
1. 64 所述 安装到蒸发插件上。

2. Choose the Aperture Cleaning recipe from the list. Edit the recipe and change the Clean Current to 10A and the Clean time to 5 minutes
2. 从列表中选择 Aperture Cleaning 配方。编辑配方,将 Clean Current 更改为 10A,将 Clean time 更改为 5 分钟
.

3. Run the recipe
3. 运行配方
.

4. When the coating unit has reached < 1 x 10-4 mbar and the current reads 10 A move the slider to the right or tap the Right Arrow button (
4. 涂布装置 达到 < 1 x 10-4 mbar 电流读数为 10 A 移动 向右 的滑块 点按 向右箭头按钮

) to
increase
增加
the
current gradually.
电流逐渐。

5. Watch the metal boat and keep increasing the current until the boat glows cherry red (see below). Make a note of the current.
5. 观察金属并继续增加水流 直到船发出樱桃红色的光(见下文 )。 记下当前情况

Figure 5-9. Aperture cleaning in progress
图 5-9.正在进行 Aperture 清洁

6. Tap on the O button to reduce the current to zero and terminate the process
6. 点击 O 按钮将电流降至零并终止进程
.

7. Create a new recipe based on the Aperture Cleaning recipe and save with a new name.
7. 根据 ApertureCleaning 配方创建新配方 ,并使用名称保存

8. Change the current to a value approximately 5-10 A below the point where the boat was glowing cherry red. Change the time to 5 minutes and save the recipe.
8. 电流更改为发出樱桃红色5-10A 的值 ,将时间更改为 5 分钟保存配方。

9. Remove
删除
the
head
.

CAUTION! Take care when removing the head as it will be very hot!
谨慎! 取下头部小心 因为它很热!

10. Add the aperture to be cleaned
10. 添加需要清洁的孔径
.

11. Replace the head into the coater carefully
11. 小心地将头部装回涂布机
.

12. Load and run the recipe that has just been created
12. 加载并运行刚刚创建的配方
.

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13. When the current has reached the value set in the recipe slowly increase the current until the boat is glowing cherry red.
13. 电流达到配方中设置的值 慢慢增加电流 直到发出樱桃红色的光。

14. Heat the aperture in the boat for approximately 30 seconds
14. 加热船上的孔约 30 秒
.

CAUTION! Do not take the current beyond the point where the boat is no longer cherry red (i.e. bright yellow/white) as this will damage the aperture.
谨慎! 不要current 超过不再红色(即亮黄色/白色),因为这会损坏船体

15. After 30 seconds either slide the slider to the left or tap on the Z button to zero the current. The boat will stop glowing.
15. 30,向左滑动滑块点击 Z 按钮电流归零 船将停止发光。

16. Terminate the process or wait until the process self terminates after 5 minutes.CAUTION! Take care when removing the head and aperture as it will be very hot!
16. 终止进程等待进程 5 分钟自行终止 谨慎! 取下头部和涂抹时要小心 因为它会非常热!

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6 Instrument Settings
6 仪器选择

The specific operation of the Q150T is determined by the settings of the active recipe. Default sputter settings and general hardware settings are configured through the System menu. This section describes how you can:
Q150T 的具体取决于活动配方设置 默认溅射设置常规硬件设置通过 System 菜单进行配置 。本示例描述了如何

Adjust the date and time
调整日期和时间

Change general instrument settings
更改常规仪器设置

Create user accounts
创建用户帐户

Monitor the Film Thickness Monitor (FTM)
监控 监视器 FTM

Tap on System on the Home screen (seeFigure 6-1)
点击主屏幕上的 System(见图 6-1)
.

Figure 6-1. System screen
6-1. 系统屏幕

The System screen displays the categories available at your privilege level.
System 系统 屏幕显示您的权限级别的类别 available

Table 13 Q150T System options
表 13Q150T 系统选项

Option
选择

Pages
页面

Purpose
目的

Date
日期

Set the instrument clock (see page47)
设置仪器时钟 参见47 页)

File Manager
文件管理器

Backup or restore* instrument files such as recipes and processing data.
备份还原 *仪器文件 ,例如接收处理数据。

About
大约

View version information about the operating software.
查看有关作软件版本信息

FTM

Monitor FTM usage (see page48)
监控 FTM 使用情况 参见48 页)

(Note. Only displayed if FTM installed)
注意 仅在安装了 FTM 显示

Maintenance
保养

View usage and service information
查看使用情况和服务信息

Users
用户

Create, edit or delete user accounts (see page49)
创建、 编辑或删除用户帐户 参见49 页)

Properties
性能

Sputter
溅射

Parameters*
参数*

Edit gas bleed parameters and cleaning times and cycles (see page52)
编辑气体排放参数以及清洁时间和周期 参见52 页)

Vacuum
真空

Parameters*
参数*

Edit pumping parameters (see page53)
编辑泵送参数 参见53 页)

Hardware
硬件

Parameters
参数

Stage rotation control, target information and screen brightness adjustment (see page54)
载物台旋转控制、目标信息和屏幕亮度调整(参见54 页)

* Admin group level required to edit these properties
* 编辑这些属性需要 管理员级别

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Q150T S/E/ES plus

6.1.1 Date
6.1.1 日期

Use this option to set the date and time used by the instrument (seeFigure 6-2)
使用此选项可设置仪器使用的日期和时间(参见图 6-2)
.

Figure 6-2. System date and time settings
图 6-2.系统日期和时间设置

6.1.2 File Manager
6.1.2 文件 马纳格尔

File Manager (see Figure 6-3) allows all users to back up process log files and recipes to a USB device or another location on the network. Users with administrator level privileges (see page49) can also
文件管理器(请参见图 6-3)允许所有用户将进程日志文件和配方备份到 USB 设备或网络上的其他位置。具有管理员级别权限的用户(参见第 49 页)也可以
:

Restore data from a previously saved backup
以前保存备份中恢复数据

Update the operating software
更新软件

Use File Manager to selectively copy, move or delete files
使用文件管理器有选择地复制 、移动或删除文件

Figure 6-3. File Manager (general users have access to Backup option only)
图 6-3.文件管理器(一般用户只能访问备份选项

6.1.3 About
6.1.3 关于

The About screen shows version information about the operating software: the installation date and version number, and also details about the firmware installed for internal processor boards (seeFigure 6-4). You may be asked for this information during any calls with technical support.
“关于”屏幕显示软件的版本信息 安装日期版本号, 以及内部处理器安装的固件的详细信息 (参见6-4)与技术支持进行任何通话时 系统可能会要求您提供此信息

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6.1.4 FTM

This option is only displayed if an FTM is fitted in the instrument. If this is not the case, any processes which depend on an FTM are not displayed in the software.
仅当仪器中安装了 FTM 才会显示此选项 如果不是这种情况,任何依赖于 FTM 的进程都不会显示在软件

Tap on FTM to view the status of the Film Thickness Monitor (seeFigure 6-4)
点击 FTM 查看 Film Thickness Monitor 的状态(参见图 6-4)
.

This
shows
显示
the
percentage
百分比
of
the
crystal
晶体
used
使用
and
will
help
帮助
you
decide
决定
when
什么时候
to
replace
取代
it
(see
page
72).

Figure 6-4. About (left) and FTM Status (right) screens
6-4.关于(左)和 FTM 状态(右)屏幕

6.1.5 Maintenance
6.1.5 养护你的厨具

The Maintenance screen shows usage information and is updated by the service engineer:
“维护”屏幕显示使用信息,并服务工程师进行指定

Operation time
作时间

Serviced on
服务日期

Chamber cleaned on
清洁

Processing done since last clean
上次清洁以来完成的处理

Figure 6-5. Maintenance
图 6-5. 保养

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6.2

6.2.1

User Management
用户管理

The Q150T software employs a user account system with individual login names and passwords. Registered users are granted access privileges at a group level.
Q150T 软件采用具有个人登录密码的用户帐户系统 注册用户将在级别被授予访问权限

Student is the lowest privilege level and is not password protected. At this level, a user can run the instrument for sputtering or evaporation and create or edit recipes but cannot change any settings. It is also possible to register users with student privileges.
Student最低权限级别 不受密码保护在此级别 用户可以运行仪器进行溅射eva 处理 ,并创建编辑配方 ,但无法更改任何设置 也可以注册具有学生权限的用户。

Default is for general users and is password protected. At this level, a user can run the instrument for sputtering or evaporation and create or edit recipes. It is also possible to register users with student or default privileges. A default user has additional access to vacuum and hardware settings.
默认值适用于一般用户 ,并且密码保护。 在这个 level, 用户可以运行仪器进行溅射蒸发 并创建编辑配方也可以用户注册到 studentdefault 权限 默认用户具有对 vacuum 和 d 硬件设置的额外访问权限。

Admin is password protected. In this level, it is possible to edit a number of hardware settings. It is also possible to register users with admin, student or default privileges. With admin privileges, a user can edit many sputter, vacuum and hardware settings.
管理员密码保护 d. 在这个级别, 可以编辑许多硬件设置。 也可以adminstudentdefault 权限注册用户 。使用 admin 权限 用户可以编辑许多溅射真空硬件设置。

Some system properties can only be accessed with additional privileges. Contact Quorum for details.
某些系统属性只能通过附加权限进行访问 。有关详细信息,请联系 Quorum。

When first switched on, the Q150T starts in the default startup user account (see Default User,6.2.5)
首次开机时,Q150T 从默认启动用户帐户启动(参见默认用户 6.2.5)
.

Adding a User
添加用户

To create a new user account:
创建新的用户帐户

1. From the Home screen, tap on the System button
1. 在主屏幕上点击系统按钮
.

2. Tap on the Users button. The Edit Users screen is displayed (seeFigure 6-6)
2. 点击用户按钮。此时将显示 “Edit Users” 屏幕(请参见图 6-6)
.

3. Tap on
3. 点击

. The Edit User Details screen is displayed
.此时将显示 Edit User Details (编辑用户详细信息) 屏幕
.

4. Tap on the Username text box and use the on-screen keyboard to type the name for the user..
4. 点击用户名文本框 然后使用屏幕键盘输入用户的名称

5. Select the privilege level for the new user from the Level dropdown list
5. 从“级别”下拉列表中选择新用户的权限级别
.

6. Tap on the Full Name text box and use the on-screen keyboard to type the full name of the user..
6. 点击 文本框 然后使用屏幕键盘输入用户的

7. Tap on the Password text box and use the on-screen keyboard to type a password for the user’s account.
7. 点击密码文本框 ,然后使用屏幕键盘输入使用 r 帐户的密码

8. Repeat the password in the Confirm Password text box and tap on the Enter button
8. 在确认密码文本框中重复密码,然后点击 Enter 按钮
.

9. Tap on the Save button to create the user account. Alternatively, tap on the Cancel button to close the on-screen keyboard without creating the account and return to the Edit Users screen.
9. 点击 “保存 按钮创建用户帐户 或者点击 “取消” 按钮关闭屏幕键盘 ,而不创建帐户返回“ 编辑用户 屏幕。

10. The Edit Users screen is displayed. Register further users as required.
10. 将显示 “编辑用户 屏幕 ,根据需要注册更多用户

11. Tap on
11. 点击

to return to the System Properties screen or to return to the home screen.
返回到 SystemProperties 屏幕返回主屏幕

Q150T S/E/ES plus

Figure 6-6. Creating a user
6-6. 创建用户

Editing a User
编辑用户

To edit an existing user account:
编辑现有用户帐户

1. From the Home screen, tap on the System button
1. 在主屏幕上点击系统按钮
.

2. Tap on the Users button. The Edit Users screen is displayed (seeFigure 6-6)
2. 点击用户按钮。此时将显示 “Edit Users” 屏幕(请参见图 6-6)
.

3. Tap on the username of the account you want to edit. The Edit User Details screen is displayed.
3. 点击编辑账户用户名此时将显示 “编辑用户详细信息 ”屏幕

4. Edit the Username, Level, or Fullname as required.
4. 根据需要编辑 Username、Level Fullname

5. To change the Password associated with the account, tap on the Edit password button. You will be required to enter to the existing password to be able to enter a new password.
5. 更改帐户关联的密码 请点击 “编辑密码 ”按钮 您需要输入现有密码才能输入帕斯沃路。

6. Tap on the Save button to confirm the user account. Alternatively, tap on the Cancel button to discard any changes and return to the Edit Users screen
6. 点击“保存”按钮以确认用户帐户或者点击“取消”按钮以放弃任何更改并返回“编辑用户”屏幕
.

7. The Edit Users screen is displayed. Edit further users as required
7. 此时将显示“编辑用户”屏幕根据需要编辑更多用户
.

8. Tap on
8. 点击

to
return
返回
to
the
System
系统
Properties
性能
screen
屏幕
or
to
return
返回
to
the
home
screen.
屏幕。

Deleting a User Acc
删除用户帐户
ount

To delete an existing user account:
删除现有用户帐户

1. From the Home screen, tap on the System button
1. 在主屏幕上点击系统按钮
.

2. Tap on the Users button. The Edit Users screen is displayed (seeFigure 6-6)
2. 点击用户按钮。此时将显示 “Edit Users” 屏幕(请参见图 6-6)
.

3. Tap on the username of the account you want to delete. The Edit User Details screen is displayed.
3. 点击删除账户的用户名 将显示 “编辑用户详细信息 ”屏幕

4. Tap on the Delete button.
4. 点击删除按钮。

5. The Edit Users screen is displayed
5. 此时将显示 Edit Users 屏幕
.

6. Tap on
6. 点击

to
return
返回
to
the
System
系统
Properties
性能
screen
屏幕
or
to
return
返回
to
the
home
screen.
屏幕。

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Q150T S/E/ES plus

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6.2.4

6.2.5

6.3

Login
登录

To log in as a different user:
其他用户身份登录

From the Home screen, tap on the Login button.
主屏幕,点击登录按钮。

From elsewhere in the software, tap on
软件的其他位置 点击

.

The Change User screen is displayed. Use the on-screen keyboard to type your username and password and then tap on the Enter button.
显示更改用户屏幕使用屏幕键盘输入您的用户名和密码 ,然后点击 Enter 按钮。

Figure 6-7. Change User screen
6-7。 更改用户屏幕

Default User
默认用户

To select the user account active when the instrument is switched on:
选择仪器打开时处于活动状态的用户帐户

1. From the Home screen, tap on the System button
1. 在主屏幕上点击系统按钮
.

2. Tap on the Users button. The Edit Users screen is displayed (seeFigure 6-6)
2. 点击用户按钮。此时将显示 “Edit Users” 屏幕(请参见图 6-6)
.

3. Tap on the‘rosette’icon
3. 点击 “rosette”图标

next to the user profile you want to load when the instrument is first switched on.
加载的用户配置文件旁边 首先打开仪器

4. Tap on
4. 点击

to return to the System Properties screen or to return to the home screen.
返回到 SystemProperties 屏幕返回主屏幕

Properties
性能

The specific operation of the Q150T is determined by the settings of the active recipe. However, the default sputter settings and general hardware settings are configured through the System menu.
Q150T 的具体取决于活动配方设置 但是,错误溅射设置和常规硬件设置是通过系统模块配置的

Some parameters are specified at a system level, but can be overridden in the recipe. For example bleed pressure can be set in a sputter or glow discharge recipe, and this overrides the system default bleed pressure. Within properties, all parameters that are currently active are indicated by a "Global" icon. If this icon is crossed out in red, it indicates that the default value has been overridden in the active recipe.
某些参数在 system leve l 指定 ,但可以在 recipe 覆盖 例如 可以在辉光显示配方中设置排放压力 这将覆盖系统默认的排放压力 属性 当前处于活动状态的所有参数都由 “Global” 图标指示 如果 this 图标红色划掉 表示活动配方覆盖默认值

Q150T S/E/ES plus

6.3.1 Sputter Parameters
6.3.1 溅射参数

These are the default settings used during sputter coating sequences. The Q150T uses these settings in all recipes of type: Timed Sputter and FTM Terminated Sputter unless overridden in the recipe (see page88)
这些是溅射镀膜序列中使用的默认设置 Q150T 在所有类型的配方中都使用这些设置:定时溅射和 FTM 终止溅射,除非在配方中被覆盖(参见第 88 页)
.

To change the settings, tap System on the Home screen and then Properties. The System Properties screen consists of three pages; Sputter Parameters are displayed on
更改设置, 请点击主屏幕上的系统 然后点击属性系统属性屏幕页组成; 溅射参数显示在

the first page (seeFigure 6-8andTable 14)
第一页(见图 6-8 和表 14)
.

Figure 6-8. Sputter Parameters (admin mode)
图 6-8.溅射参数(管理模式)

Table 14 Sputter Parameters (System Properties, page 1)
表 14 溅射参数(系统属性,第 1 页

Name
名字

Default Value
默认值

Minimum Value
最小值

Maximum Value
最大值

Comment
评论

Gas Bleed Time* (s)
气体排放时间*(s)

15

0

60

Time Argon allowed to flow into chamber before plasma started
等离子体开始之前允许氩流入腔室的时间

Bleed Vacuum*
排放真空*

1x10-2
1x10-2

2x10-2
2x10-2

5x10-1
5x10-1

Pressure at which the
压力

chamber is maintained while the plasma is present
血浆存在时,腔保持

Clean Current* (A)
清洁电流*(A)

150

20

200

Current applied during target cleaning phase
在目标清洁阶段施加的电流

Clean Time*(s)
清洁时间*(s)

30

0

60

Target cleaning time
目标清洁时间

Clean discharge time* (s)
清洁放电时间* (s)

20

15

90

Wait period between cleaning pulses with plasma off and
在关闭等离子体的情况下,清洁脉冲之间的等待时间

argon flowing. Only when Pulse Cleaning.
氩流。 仅在脉冲清洁时。

Max pulse clean cycles*
最大脉冲清洁次数*

15

2

25

* Admin group level required to edit this property
* 编辑属性需要 管理员级别

1. To edit a parameter, tap on its value
1. 要编辑参数,请点击其值
.

2. Change the value as required
2. 根据需要更改值
.

3. When you edit a value, tap on the Confirm button to accept the change or on the Cancel button to restore the previous value
3. 当您编辑值时,点按 确认 按钮以接受更改,或点按 取消 按钮以恢复之前的值
.

4. Edit other parameters as required
4. 根据需要编辑其他参数
.

5. Tap on
5. 点击

to
return
返回
to
the
System
系统
Properties
性能
screen
屏幕
or
to
return
返回
to
the
home
screen.
屏幕。

10473 - Issue 8 52 www.quorumtech.com
10473 - 第 8 52 www.quorumtech.com

6.3.2 Vacuum Parameters
6.3.2 真空参数

These are the default settings for pumping/venting cycles used in both sputter coating and evaporation sequences. The Q150T uses these settings in all recipes.
这些镀膜和蒸发序列中使用的泵送 / 排气循环默认设置 Q150T 在所有配方中都使用相同的设置

To change the settings, tap System on the Home screen and then Properties. The System Properties screen consists of three pages; Vacuum Parameters are displayed on the second page (see Figure 6-9 and Table 15). To display the list, tap on the“2” button.
更改设置, 请点击主屏幕上的系统 然后点击属性系统属性页面三个页面组成; 真空参数显示在第二页上 参见 6-9 15)。 显示列表 请点击 “2” 按钮。

Figure 6-9. Vacuum parameters (admin mode)
图 6-9.真空参数 (admin mode)

Table 15 Vacuum parameters (System Properties, page 2)
表 15 真空参数 (系统属性,第 2 页)

Name
名字

Default Value
默认值

Minimum Value
最小值

Maximum Value
最大值

Comment
评论

Operational Vacuum (mbar)*
工作真空度 (mbar)*

1x10-3
1x10-3

8x10-3
8x10-3

2x10-1
2x10-1

Vacuum level that must be reached before coating
涂层必须达到的真空

commences
开始

Safe Outgas
安全排气

threshold (mbar)*
阈值 (mbar)*

1x10-0
1x10-0

5x10-5
5x10-5

2x10-3
2x10-3

Vacuum level that must be reached before turbo ON.
在涡轮增压器开启之前必须达到的真空

Vent Time (s)*
排气时间 *

70

1

240

Time to vent the chamber
是时候对腔室进行通风了

Flush Time (s)*
冲洗时间 (s)*

30

1

60

Chamber flush time
腔室冲洗时间

Flush Pump time (s)*
冲洗泵时间 (s)*

30

1

120

Chamber pump time between flushes.
腔室泵冲洗之间的时间

Outgassing time (s)*
除气时间 (s)*

120

1

600

Time waited after the operational vacuum is achieved
达到作真空后的等待时间

Pump Hold Time (hrs)*
泵保持时间 (小时)*

24

0

72

Wait time before process begins
进程开始的等待时间

Max Pumpdown Time (s)**
最大抽空时间 (s)**

600

Maximum time the system will wait for the chamber to reach the operational
系统等待暗室到达运行状态的最长时间

vacuum
真空

Max Pump Time to 200 mbar (s)**
最大泵送时间200 mbar (s)**

30

Time to chamber has to reach 200mbar or aborts
腔室时间必须达到 200 mbar中止

Bleed Gas Flush Vac (mbar)*
排放气体冲洗真空 (mbar)*

5

0.1

100

Vacuum the system will
吸尘系统

pump down to before
抽真空之前

venting with nitrogen during a flush
冲洗氮气排气

Bleed Gas Flush Time (s)*
排放气体冲洗时间 (s)*

15

5

60

Time allowed to flush chamber with argon
气冲洗腔室的时间

Enable Pulsed
启用脉冲

Yes
是的

No

Yes
是的

Pulsed venting which slows
脉冲排气减慢

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Name
名字

Default Value
默认值

Minimum Value
最小值

Maximum Value
最大值

Comment
评论

Venting*
发泄*

turbo pump safely
安全涡轮分子

Vent Pulse Time (ms)*
通风脉冲时间 (ms)*

500

Vent pulse period
排气脉冲周期

Vent Off Time (ms)*
排气关闭时间 (ms)*

1000

0

3000

Vent off time during pulse vent
脉冲排气期间排气关闭时间

* Admin group level required to edit this property
* 编辑属性需要 管理员级别

** Engineer (or higher) privileges required to edit this property
** 编辑属性所需的 工程师 更高级别) 权限

1. To edit a parameter, tap on its value (you may need to scroll down the screen to see all the properties)
1. 编辑参数, 请点击 您可能需要向下滚动屏幕才能看到所有属性)

2. Change the value as required
2. 根据需要更改值
.

3. When you edit a value, tap on the Confirm button to accept the change or on the Cancel button to restore the previous value
3. 当您编辑值时,点按 确认 按钮以接受更改,或点按 取消 按钮以恢复之前的值
.

4. Edit other parameters as required
4. 根据需要编辑其他参数
.

5. Tap on
5. 点击

to
return
返回
to
the
System
系统
Properties
性能
screen
屏幕
or
to
return
返回
to
the
home
screen.
屏幕。

6.3.3 Hardware Parameters
6.3.3 硬件参数

These settings define the configuration of your instrument. The Q150T uses these settings in all recipes of type: Timed Sputter and FTM Terminated Sputter
这些设置定义仪器的配置。Q150T 在所有类型的配方中都使用这些设置:定时溅射和 FTM 端接溅射
.

To change the settings, tap System on the Home screen and then Properties. The System Properties screen consists of three pages; Hardware Parameters are displayed on the third page (seeFigure 6-10andTable 16)
要更改设置,请点击主屏幕上的系统,然后点击属性系统属性屏幕由三个页面组成;硬件参数显示在第三页(见图 6-10 和表 16)
.

Figure 6-10. Hardware Parameters (admin mode)
图 6-10.Hardware Parameters (admin mode)

1. To edit a parameter, tap on its value (you may need to scroll down the screen to see all the properties)
1. 编辑参数, 请点击 您可能需要向下滚动屏幕才能看到所有属性)

2. Change the value as required
2. 根据需要更改值
.

3. When you edit a value, tap on the Confirm button to accept the change or on the Cancel button to restore the previous value
3. 当您编辑值时,点按 确认 按钮以接受更改,或点按 取消 按钮以恢复之前的值
.

4. Edit other parameters as required
4. 根据需要编辑其他参数
.

5. Tap on
5. 点击

to
return
返回
to
the
System
系统
Properties
性能
screen
屏幕
or
to
return
返回
to
the
home
screen.
屏幕。

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10473 - 第 8 54 www.quorumtech.com

Table 16 Hardware Parameters (System Properties, Page 3)
表 16 硬件参数(系统属性 第 3 页)

Name
名字

Default Value
默认值

Minimum Value
最小值

Maximu
马克西姆

m Value
m

Comment
评论

Serial Number**
序号**

Read only: identification code for instrument
只读: 仪器标识 n 代码

Backlight
背光

Brightness
亮度

50

1

100

Screen brightness
屏幕亮度

Screen saver Delay (s)*
屏保延迟 (s)*

600

0

100000

Period of instrument activity
仪器活动周期

before screensaver is displayed
显示 Screensaver 之前

Vacuum Gauge Type
真空计类型

Read only: displays installed gauge type
只读: 显示已安装的仪表类型

Use Turbo
使用 Turbo

Pumping

Yes
是的

No

Yes
是的

Apply Turbo pump or use rotary pumping only
使用涡轮分子仅使用旋转

PSU Temperature

Read only: displays power supply temperature
只读: 显示电源温度

Turbo Present**
Turbo 礼物**

Yes
是的

No

Yes
是的

Turbo pump installed?
已安装涡轮分子

FTM Present**
FTM 礼物**

No

No

Yes
是的

FTM installed?
安装了 FTM

Stage Rotate
舞台旋转

Yes
是的

No

Yes
是的

Set the state of the stage unless overridden in the process recipe
设置阶段的状态, 除非进程被覆盖 reci pe

Stage Rotate Speed
载物台旋转速度

70

0

100

Sets the speed of the stage unless overridden in the
设置舞台的速度 除非

process recipe
工艺配方

Available
可用

Targets*
目标*

1

1

3

Sets the number of auxiliary sputter inserts allowing the whole insert to be changed making the use of multiple materials easier
设置辅助溅射插件的数量,允许整个插件进行跟踪 ,从而更容易使用多种材料

Target A
目标 A

Target material.
目标材料。

Target B
目标 B

N/A
不适用

Not applicable for Q150T
不适用于 Q150T

Target C
目标 C

N/A
不适用

Not applicable for Q150T.
不适用于 Q150T。

* Admin group level required to edit this property
* 编辑属性需要 管理员级别

** Engineer (or higher) privileges required to edit this property
** 编辑属性所需的 工程师 更高级别) 权限

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Q150T S/E/ES plus

6.4 History
6.4 历史

To view the process log, listing information about the recipes run on the Q150T plus
查看有关在 Q150T plus 上运行的配方的工艺日志列表信息
:

1. From the Home screen (seeFigure 3-1), tap on History
1. 在主屏幕(见图 3-1)点击历史记录
.

2. The Process History screen is displayed (see Figure 6-11). Process events are
2. 显示 ProcessHistory 屏幕 6-11)。 进程事件包括

listed in order with the most recent at the top of the list. You may need to scroll down the list to see earlier events.
按顺序列出 最近的事件位于列表顶部您可能需要向下滚动列表才能查看较早的事件。

Figure 6-11. Process History screen (left) and Detailed View tab (right)
图 6-11.P 过程历史记录屏幕(左)和 “详细视图”选项卡(右)

3. To view the details of a particular logged event tap on it. The Detailed View tab is displayed (see Figure 6-12). This shows the events that occurred during the process. The actual data displayed will depend on the process type.
3. 要查看特定记录事件的详细信息 请点击详细视图选项卡 (见6-12)显示了过程。 显示的实际数据取决于流程类型。

Figure 6-12. Process View (left) and Message View (right) tabs
6-12.流程视图(左)和消息视图(右)选项卡

4. Tap on the Process View tab to view the recipe parameters applied during the selected event.
4. 点按 ProcessView 选项卡 查看选定事件期间应用的配方参数

5. Tap on the Message View tab for summary information including any error and warning messages if any problems were encountered during the process.
5. 点按消息视图选项卡以获取摘要信息 ,包括任何错误警告消息 (如果在此过程中遇到任何问题 )。

6. Tap on
6. 点击

to
return
返回
to
the
Process
过程
History
历史
screen
屏幕
or
on
to
display
显示
the
Home
screen.
屏幕。

10473 - Issue 8 56 www.quorumtech.com
10473 - 第 8 56 www.quorumtech.com

Q150T S/E/ES plus

Accessories
辅料

The Q150T can be configured for various sputtering and evaporation applications. This section describes the installation of:
Q150T针对各种溅射和蒸发应用进行配置本节介绍安装方法

Sputter insert pre-installed as standard on Q150T S and Q150T ES models. Includes instructions for changing the target. Additional sputter insert available (10453).
Q150TSQ150TES 型号标配插件包括跟踪靶材的说明。 提供额外的溅射插件 (10453)。

Carbon rod insert for 3mm rods (10033) pre-installed as standard on Q150T E models. Carbon rod insert for 6mm rods (10456).
用于 3mm 杆的插件 (10033) 预装Q150TE 型号 用于 6mm 杆的插件 (10456)。

Carbon fibre insert (10455)
碳纤维嵌件 (10455)

Metal evaporation insert (10457) including its configuration for both downwards and upwards evaporation, and the installation of a wire basket or molybdenum boat).
金属蒸发插件 (10457), 包括其向下向上蒸发的配置 以及安装金属丝篮)。

Glow discharge insert (10262).
发光放电插件 (10262)。

Rotacota stage (10360)
Rotacotastage(10360)

Slide stage (10358)
(10358)

Four wafer stage and gear box (10458)
晶圆齿轮箱 (10458)

Specimen stage with adjustable tilt (10357)
可调节倾斜样品 (10357)

Film thickness monitor (10454)
显示器 (10454)

Extended height cylinder (10429)
加长高度气缸 (10429)

Full range vacuum gauge assembly (10428)
系列真空总成 (10428)

Rotating vacuum spigot (10422)
旋转式真空龙头 t(10422)

Sputter InsertThis section describes the installation of the standard sputter head supplied with Q150TS and Q150T ES instruments
溅射插件本节介绍了 Q150TS 和 Q150T ES 仪器随附的标准溅射头的安装
.

DANGER MAGNETIC FIELD!
危险磁场

Strong magnetic fields can disturb devices like pacemakers or impair their function.
强磁场会干扰心脏起搏器设备损害其功能。

Maintain a safety distance of >10 cm between the magnet and the pacemaker or prevent the influence of strong magnetic fields by antimagnetic shielding.
起搏器之间保持 >10 cm 的安全距离 ,或通过防磁屏蔽防止磁场的影响

WARNING - HIGH VOLTAGES AND HIGH VACUUM!
警告 - 高电压和高真空!

This equipment produces high voltages and high vacuum in its operation.
该设备运行产生电压和高真空

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Q150T S/E/ES plus

10473 - Issue 8 58 www.quorumtech.com
10473 -8 58 www.quorumtech.com

Figure 7-1. Top view of the sputter insert
图 7-1. 溅射插件的俯视图

Sputter insert lead
溅射插入引线

Securing button
固定按钮

Sputter insert
溅射插件

Latch
门闩

Lifting handle
提升手柄

1. Check the machine is not operating
1. 检查机器是否未运转
.

2. Press down firmly on the top cover to release the latch
2. 用力按下顶盖以松开闩锁
.

3. Lift the top cover and rest it against its stop
3. 提起顶盖并将其靠在挡块上
.

4. Turn the two securing buttons to release the installed insert and remove the insert (seeFigure 7-1)
4. 转动两个固定按钮以释放已安装的插件并取出插件(见图 7-1)
.

Q150T ES users only: If the insert is a carbon rod type you may have to remove the rods first (see page59). To do this, check that the securing buttons are restraining the insert and open the lid assembly and rest it against the top cover assembly. Then, using a 2.5mm hex key, release the rod clamping screws and withdraw the rods. Close the lid assembly and release the insert by turning the securing buttons. Now remove the insert.
Q150TES 仅限用户 如果嵌件可能必须先拆下(参见第 59)。 为此 请检查固定按钮是否约束了 insert,然后打开盖子组件并将其靠在顶盖组件上。 然后, 使用 2.5 毫米六角扳手,松开杆夹紧装置并取出杆。 关闭盖子组件,然后转动固定按钮释放插件 。现在删除插入物。

5. Prepare the sputter insert for installation by removing from any packaging, pIastic bags etc. Check the 1O’ring in the outer ring of the Iid assembIy for damage or debris and clean or replace as required.
5. 任何包装袋等中取出插件 准备安装 检查 Iid 组件中的 1O 形圈是否有损坏碎屑 根据需要清洁更换

6. To fit a target (we recommend you wear latex gloves to do so):
6. 要适合目标 我们建议您手套 ):

a. Unscrew the target clamp ring (seeFigure 7-2)
一个。拧下目标 clamp 环(见图 7-2)
.

b. Place a new target centrally on the holder. Hold it in place with one finger through the clamp ring.
b.目标放在支架的中央一根手指穿过将其固定

c. Screw the clamp ring firmly back in place. If the target thickness is greater than 0.3mm then one or more spacers (Part No. A4117193) should be fitted between the dark space shield and the sputter insert to maintain a 1.5mm gap between the inside face of the dark space shield and the target clamp ring
c. 将 clamp 环牢固地拧回原位。如果目标厚度大于 0.3 毫米,则应在暗空间屏蔽层和溅射插件之间安装一个或多个垫片(零件号 A4117193),以在暗空间屏蔽层的内表面和目标夹紧环之间保持 1.5 毫米的间隙
.

7. Place the insert in position in the outer ring of the lid assembly carefully locating the M3 screw head in the rim of the insert in the slot to the right of the outer ring
7. 将插件放入盖子组件的外圈中,小心地将 M3 螺钉头定位在外圈右侧槽中插件边缘
.

8. Lock the insert in position by turning the securing buttons until their flanges overlap the insert.
8. 转动固定按钮 直到凸缘嵌件重叠,嵌件锁定

9. Plug the sputter insert lead into the socket on the hinge assembly
9. 将溅射插入引线插入铰链组件上的插座中
.

Sputter insert
溅射插件

Holder
持有

Sputter insert leadDark space shield spacerTargetTarget clamp ringDark space shield
溅射插入式引线 DarkspaceshieldspacerTargetTargetclampringDarkspaceshield

Figure 7-2. Sputter insert and target assembly
图 7-2.溅射插入 nd 目标组件

7.2 Carbon Rod Insert
7.2 碳棒嵌件

This section describes the installation of the carbon rod insert supplied with Q150T E and Q150T ES instruments. There are two inserts designed to accommodate 3mm carbon rods (10033) or 6mm rods (10456).
本节介绍了 Q150TEQ150TES 仪器随附的插件安装有两个插件设计用于容纳 3mm 碳(10033)6mm材 (10456)。

To install the carbon rod insert:
要安装插件:

1. Check the machine is not operating
1. 检查机器是否未运转
.

2. Press down firmly on the top cover to release the latch
2. 用力按下顶盖以松开闩锁
.

3. Lift the top cover and lay back against its stop
3. 提起顶盖并靠在挡块上
.

4. Turn the two securing buttons to release the installed insert and remove the insert.
4. 转动两个固定按钮 松开已安装的插件移除插件。

5. Prepare the carbon rod insert for installation by removing from any packaging, pIastic bags etc. Check the 1O’ring in the outer ring of the Iid assembIy for damage or debris and clean or replace as required.
5. 任何包装袋等中取出插件 准备安装 检查 Iid 组件中的 1O 形圈是否有损坏碎屑 根据需要进行清洁更换

6. Prepare two carbon rods (see page60)
6. 准备两根碳棒(见第 60 页)
.

WARNING!
警告!

To avoid the possibility of carbon particulate entering the delicate electronics of any laboratory equipment, clean the carbon rod insert away from the instrument preferably in a fume hood or under an extraction system. As fine particulate may be generated, users should carry out their own risk assessment and use suitable PPE.
为避免碳颗粒进入任何实验室设备的精密电子设备的可能性 ,最好通风抽气装置下清洁插件系统。 可能会产生颗粒物, 用户进行自己的风险评估并使用合适的 PPE。

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Q150T S/E/ES plus

7. Install the carbon rods (seeFigure 7-3)
7. 安装碳棒(见图 7-3)
:

a. Install the flat-ended carbon rod into the fixed terminal.
a. 将平头安装到固定期限内。

b. Install the sharpened carbon rod into the moveable terminal so that the shaped end touches the other rod.
湾。 锋利的安装到可移动端子 使成型一端接触另一杆。

c. Tension the sliding clamp assembly by sliding it to the right to the full extent of the dowels. Tighten the clamp screw to fix the carbon rod in position.
c. 通过将滑动夹组件向右滑动销钉的整个范围张紧滑动夹具组件 拧紧夹紧螺钉固定到位。

8. Place the insert in position in the outer ring of the lid assembly carefully locating the M3 screw head in the rim of the insert in the slot to the right of the outer ring. Lock the insert in position by turning the securing buttons until their flanges overlap the insert.
8. 插件放置在盖子组件的位置, 小心地将 M3 螺钉定位在插槽插件边缘的位置的右侧 通过转动固定按钮直到其法兰嵌件重叠,嵌件锁定

9. Close the lid assembly onto the glass chamber
9. 将盖子组件合上玻璃室
.

10. Check that the copper terminal contacts on the top of the insert and in the underside of the top cover are clean and free from damage and that the top faces are flat for good electrical contact.
10. 检查插件顶部底部的端子触点是否清洁损坏 以及顶部是否是平坦的,具有良好的电气接触。

11. Close the top cover assembly and press firmly down to secure the latch
11. 合上顶盖组件并用力向下按压以固定闩锁
.

Fixed clamp Clamp screw
固定夹具夹紧螺钉

Carbon rods

Clamp screwSliding clamp assembly
夹紧螺钉滑动夹紧组件

Figure 7-3. Carbon Rod Insert
7-3. 碳棒嵌件

7.2.1 Shaping Carbon Rods for Pulsed Evaporation
7.2.1 用于脉冲 E 蒸发的碳成型

WARNING!
警告!

It is essential that you shape the tips of the carbon rods to the correct profile to minimise the possibility of damage to the instrument due to excessive currents.
您必须尖端塑造正确的轮廓 尽量减少因过大电流而对仪器造成损坏的可能性

WARNING!
警告!

To avoid the possibility of carbon particulate entering the delicate electronics of any laboratory equipment, clean the carbon rod insert away from the instrument preferably in a fume hood or under an extraction system. As fine particulate may be generated, users should carry out their own risk assessment and use suitable PPE.
为避免颗粒进入任何实验室设备的精密电子设备,最好烟雾或在抽气系统下清洁插件 。由于可能会产生 fin e 颗粒 使用者进行自己的风险评估并使用合适的 PPE。

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10473 - 8 期 60 www.quorumtech.com

Q150T S/E/ES plus

For pulsed evaporation, one rod should be shaped to 1.2mm diameter x 5 mm long using the shaper with the blue handle. The other should be flattened as shown in Figure 7-4
对于脉冲蒸发,应使用带有蓝色手柄的整形器将一根棒塑造成直径为 1.2 mm x 长 5 mm 的棒。另一个应该如图 7-4 所示平整
.

Figure 7-4. Recommended Carbon Rod shapes
图 7-4.推荐的汽车棒形状

The accessory pack contains a rod shaper (see Figure 7-5) that will accept 3mm and 6mm rods. To enable the shaper to accept 6mm rods, remove the collet by unscrewing the collet screw and pulling the collet out.
附件包含一个成型器 (见7-5), 可以接受 3 毫米6 毫米的杆 为了使整形机能够接受 6mm 的杆, 请拧夹头螺钉夹头 以移除夹头

Figure 7-5. Carbon Rod Shaper (S8650/S8651))
7-5.碳棒成型机 (S8650/S8651))

To shape a carbon rod:
塑造棒:

1. Cut a 50mm length of rod.
1.50 毫米杆。

Use only Quorum rods due to the varying diameter and quality of other manufacturer’s rods. Quorum supply rods in two sizes: 3mm (C5422) and 6mm (C5423).
仅使用 Quorum 因为其他制造商的棒直径和质量各不相同 Quorum 供应杆有两种尺寸:3 毫米 (C5422) 6 毫米 (C5423)。

2. Hold the shaper stationary and insert the carbon rod until it touches the cutters. Pull the cutter shaft out to its full extent.
2. 保持成型机静止不动,插入,直到接触到刀具。切割器 shaft 拉出至其最大范围。

3. Gently
徐徐
tighten
收紧
the
thumb
拇指
screw
螺 杆
to
hold
the
carbon
rod
in
place
地方
.

4. Holding the shaper body and, with very little force, gently turn the black knob on the end of the shaper clockwise (when viewed face on).
4. 握住剃齿机主体 很小的力,轻轻顺时针转动剃齿机末端黑色旋钮 正面观察时)。

5. Keep turning the knob until the tip of the rod touches the end of the cutter shaft (5mm) as shown opposite. Clear the carbon rod dust as necessary.
5. 持续转动旋钮 ,直到接触到的末端 (5mm),对面所示 根据需要清除灰尘

6. Undo the thumb screw and withdraw the rod carefully to avoid damaging the newly formed tip.
6. 松开形螺钉小心地抽出 以免损坏新形成的尖端。

7. If
如果
the
rod
tip
提示
should
应该
break
in
the
cutter
刀具
, it
can
be
removed
删除
by
unscrewing
拧松
the
brass
黄铜
coupling,
耦合
removing
删除
the
cutter
刀具
and
pushing
推动
out
the
broken
破碎
rod
tip,
提示
while
avoid
避免
damaging the teeth
损害牙齿
of the
cutter.
刀具。

WARNING!
警告!

TAKE CARE WHEN HANDLING THE CUTTER:
处理刀具时要小心:
IT IS VERY SHARP.
它非常尖锐。

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Shaping Carbon Rods for Ramped Evaporation
用于斜坡蒸发的碳棒成型

When shaping rods for ramped evaporation, it is necessary to produce a 1.4mm diameter x 5mm long tip to the rod using the shaper with the red handle. Remove the yellow protective cap by pulling the tab. To prevent accidents, replace the cap on the unused cutter. The procedure is the same as that described in the previous section.
斜坡蒸发成型上时 必须使用带有红色手柄整形器产生一个直径1.4mm x 长 5 mm尖端 e。 通过拉动卡舌获得黄色保护。为防止发生意外,请更换未使用的刀具盖子 该过程一节中描述的过程相同

Fitting the Carbon Fibre InsertOuter ring O-ringClamps with M3 tension adjusting screws
M3 个张力调节螺钉安装碳纤维嵌件O 形圈

Figure 7-6. Carbon fibre insert
7-6.纤维 e 嵌件

The carbon fibre insert (10455) is designed for carbon evaporation from carbon fibre woven cord (seeFigure 7-6)
碳纤维插件 (10455) 设计用于从碳纤维编织帘线中蒸发碳(见图 7-6)
.

1. Check the machine is not operating
1. 检查机器是否未运转
.

2. Press down firmly on the top cover to release the latch
2. 用力按下顶盖以松开闩锁
.

3. Lift the top cover and lay back against its stop
3. 提起顶盖并靠在挡块上
.

4. Turn the two securing buttons to release the installed insert and remove the insert.
4. 转动两个固定按钮 松开已安装的插件移除插件。

5. Prepare the carbon fibre insert for installation by removing from any packaging, plastic bags etc. Check the‘O’ring in the outer ring of the lid assembly for damage or debris and clean or replace as required.
5. 任何包装、 塑料中取出 准备安装碳纤维插件检查盖子组件中的 “O”形圈是否损坏碎屑 然后清洁更换必填。

WARNING!
警告!

To avoid the possibility of carbon particulate entering the delicate electronics of any laboratory equipment, load or clean the carbon fibre insert away from the instrument preferably in a fume hood or under an extraction system. As fine particulate may be generated, users should carry out their own risk assessment and use suitable PPE.
为避免碳颗粒进入任何实验室设备的精密电子设备的可能性,请将碳纤维插件从设备中加载或清洁 最好通风橱中或在抽气系统中。由于颗粒物可能是通用的 ,因此使用者进行自己的风险评估并使用合适的个人防护装备。

6. Fit the carbon cord (C5421) between the two clamps. Do not pull the cord tight or induce it to loop. For most applications, the spring-loaded clamps adequately secure the cord and provide the correct tension. However, for controlled pulse evaporation, you will achieve more repeatable results if you remove the springs and tighten the clamps using the screws.
6. 素绳 (C5421) 两个子之间不要索或使其绕圈 对于大多数应用 弹簧加载的夹子可以充分固定绳索并提供正确的张力。 然而, 对于受控脉冲蒸发, 如果您卸下弹簧并使用螺钉拧紧夹具 您将获得可重复的结果

7. To prevent excessive fraying of the cord, cut it to length (35mm) after clamping.
7. 防止绳子过度磨损 ,夹紧将其剪成 (35mm 的长度。

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Q150T S/E/ES plus

8. Place the insert in position in the outer ring of the lid assembly carefully locating the M3 screw head in the rim of the insert in the slot to the right of the outer ring
8. 将插件放入盖组件的外圈中,小心地将 M3 螺钉头定位在外圈右侧槽中的插件边缘
.

9. Lock the insert in position by turning the securing buttons until their flanges overlap the insert.
9. 转动固定按钮 直到凸缘嵌件重叠,嵌件锁定

10. Close the lid assembly on to the glass chamber assembly
10. 将盖子组件合上玻璃腔室组件
.

11. Check the copper terminal contacts on the top of the insert are clean and free from damage (they must have a flat top face) and that the contacts in the underside of the top cover assembly are also clean and flat.
11. 检查插件顶部的端子触点是否干净损坏 它们必须具有平坦的顶), 以及触点是否在组件底面干净平整。

7.4 Metal Evaporation Insert
7.4 金属蒸发插件

This section describes the installation of the metal evaporation insert (10457) designed for downwards evaporation (seeFigure 7-7). To install the stage:
本节介绍用于向下蒸发金属蒸发插件 (10457)安装 (见7-7)。安装舞台,请执行以下作:

1. Check the machine is not operating
1. 检查机器是否未运转
.

2. Press down firmly on the top cover to release the latch. (See note below.).
2. 用力按下松开闩锁 下面的注释 )。

3. Lift the top cover and rest it against its stop
3. 提起顶盖并将其靠在挡块上
.

4. Turn the two securing buttons to release the installed insert and remove the insert.
4. 转动两个固定按钮 松开已安装的插件移除插件。

5. Prepare the metal evaporation insert for installation by removing from any packaging, plastic bags etc. Check the‘O’ring in the outer ring of the lid assembly for damage or debris and clean or replace as required.
5. 任何包装、 塑料中取出金属蒸发插件 准备安装检查盖子组件中的 “O”形圈是否损坏碎屑 然后清洁更换根据需要

6. Place the insert in position in the outer ring of the lid assembly. Carefully align the M3 screw head in the rim of the insert with the slot on the right of the outer ring. Lock the insert in position by turning the securing buttons until their flanges overlap the insert.
6. 插件放置在盖子组件的位置小心地将插件边缘M3 螺钉右侧的插槽对齐 通过转动固定按钮直到其法兰嵌件重叠,嵌件锁定

Clamp/M4 screw Wire basket
卡箍 /M4 螺丝

Figure 7-7. Fitting the metal evaporation insert for downwards evaporation
图 7-7.安装金属蒸发插件以进行向下蒸发

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7.4.1 Installing a Wire Basket
7.4.1 安装钢丝篮

To install a wire basket or molybdenum boat:
要安装金属丝篮舟:

1. Open the lid assembly and lay back against its stop
1. 打开盖子组件并靠在挡块上
.

2. Slacken the two M4 socket screws in the terminal clamps
2. 松开端子夹中的两个 M4 内六角螺钉
.

3. Fit the wire basket so that it lies diagonally across the screws and between the clamps and the terminals (seeFigure 7-7)
3. 安装线篮,使其对角线穿过螺钉,夹子和端子之间(见图 7-7)
.

4. Tighten the two M4 screws
4. 拧紧两颗 M4 螺丝
.

5. Close the lid assembly on to the glass chamber assembly
5. 将盖子组件合上玻璃腔室组件
.

6. Check the copper terminal contacts on the top of the insert are clean and free from damage (they must have a flat top face) and that the contacts in the underside of the top cover assembly are also clean and flat.
6. 检查插件顶部的端子触点是否干净损坏 它们必须具有平坦的顶), 并且触点是否在组件底面干净平整。

7. Close the top cover assembly and press firmly down to secure the latch.
7. 关闭顶组件用力向下按压以固定闩锁。

7.4.2 Installing a Molybdenum Boat for Aperture Cleaning
7.4.2 安装钼舟进行孔径清洁

To install a molybdenum boat:
安装舟:

1. Open the lid assembly and lay back against its stop
1. 打开盖子组件并靠在挡块上
.

2. Slacken the two M4 socket screws in the terminal clamps
2. 松开端子夹中的两个 M4 内六角螺钉
.

3. Fit the molybdenum boat between the screws and between the clamps and the terminals.
3. 安装在螺钉之间以及夹子端子之间

4. Tighten the two M4 screws
4. 拧紧两颗 M4 螺丝
.

5. Close the lid assembly on to the glass chamber assembly
5. 将盖子组件合上玻璃腔室组件
.

6. Check the copper terminal contacts on the top of the insert are clean and free from damage (they must have a flat top face.) and that the contacts in the underside of the top cover assembly are also clean and flat.
6. 检查插件顶部的端子触点是否干净损坏 它们必须具有平坦的顶)。 并且组件下侧触点干净平整。

7. Close the top cover assembly and press firmly down to secure the latch
7. 关闭顶盖组件并用力向下按压以固定闩锁
.

7.4.3 Adapting the Insert for Upwards Evaporation
7.4.3 调整 Upwards 蒸发的插件

Install the evaporation insert as described previously. To adapt the insert for upwards evaporation:
如前所述安装蒸发插件 调整插件以向上蒸发:

1. Remove the two terminal clamps and replace with the electrode extensions (seeFigure 7-8)
1. 拆下两个端子夹,更换电极延长件(见图 7-8)
.

2. Fit the stage assembly to the hole in the centre of the insert shield
2. 将载物台组件安装到插件护罩中心的孔中
.

3. Fit the wire basket or molybdenum boat to the electrode extensions as described above.
3. 如上所述 ,将金属丝篮安装到电极延长件上。

4. If an FTM is fitted, you will need to reposition it as described below
4. 如果安装了 FTM,您将需要按照以下说明重新定位它
.

5. Close the lid assembly on to the glass chamber assembly
5. 将盖子组件合上玻璃腔室组件
.

6. Check the copper terminal contacts on the top of the insert are clean and free from damage, (They must have a flat top face.) and that the contacts in the underside of the top cover assembly are also clean and flat.
6. 检查插件顶部的端子触点是否清洁损坏 它们必须具有平坦的顶 并且组件 mbly 底部的触点干净平整。

7. Close the top cover assembly and press firmly down to secure the latch
7. 关闭顶盖组件并用力向下按压以固定闩锁
.

7.4.4 Relocating the FTM
7.4.4 重新定位 FTM

If you want to use an FTM with the metal evaporation insert adapted for upwards evaporation you will need to reposition it as shown inFigure 7-8.
如果您想使用带有适用于向上蒸发金属蒸发插件FTM,则需要重新定位它,如图 7-8 所示

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1. Remove the glass chamber assembly
1. 拆下玻璃腔室组件
.

2. Unplug the FTM’s lead from the BNC socket and remove the existing crystal holder from its bracket.
2. 从 BNC 插座上拔下 FTM 的引线 ,并从支架上取下现有的晶体支架

3. Remove the two screws near the inside diameter of the glass chamber holding the turbo shield in place and replace with two M3 x 20 hex spacers
3. 拆下将涡轮增压罩固定到位的玻璃室内径附近的两个螺钉,然后更换两个 M3 x 20 六角垫片
.

4. Remove the existing crystal holder bracket
4. 取下现有的晶体支架
.

5. Fit the new crystal holder bracket using two M3x8 socket cap screws
5. 使用两个 M3x8 内六角螺钉安装新的晶体支架
.

6. Attach the FTM lead to the BNC connector
6. 将 FTM 引线连接到 BNC 连接器
.

7. Attach the circular heat shield to the two hex spacers fitted previously with two M3x6 socket cap screws having first fed the FTM lead through the hole provided.
7. 将圆形隔热罩连接到之前安装的两个六角垫片上, 使用两个 M3x6 内六螺钉 首先FTM 引线穿过提供的

8. Pass the FTM lead through the hole in the crystal holder bracket and fix to the crystal holder.
8. FTM 引线穿过晶体支架支架上的固定在晶体支架

9. Fit the crystal holder to the bracket with two M2.5 x 12 socket cap screws
9. 用两颗 M2.5 x 12 内六角螺钉将晶体支架安装到支架上
.

10. Refit the glass chamber assembly
10. 重新安装玻璃室组件
.

Outer ring O-ringSample holder FTMElectrode extension Wire basket
O 形圈样品FTM 电极延长线

Figure 7-8. Metal evaporation insert adapted for upwards evaporation
图 7-8.适用于向上蒸发的 Meta l 蒸发插件

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Q150T S/E/ES plus

7.5 Glow Discharge Insert
7.5 辉光放电插件

This section describes the installation of the glow discharge insert (Part No. 10262).
本节介绍辉光排放插件 部件10262)安装

DANGER MAGNETIC FIELD!
危险磁场

Strong magnetic fields can disturb devices like pacemakers or impair their function.
强磁场会干扰心脏起搏器设备损害其功能。

Maintain
保持
a safety
安全
distance
距离
of >10
>10
cm
厘米
betw
打赌
een the magnet and the
magnet 和
pacemaker
起搏器
or
prevent
防止
the
influence
影响
of
strong
magnetic
agnetic 不可知
fields
领域
by
antimagnetic shielding.
防磁屏蔽。

WARNING - HIGH VOLTAGES AND HIGH VACUUM!
警告 - 高电压和高真空!

This equipment produces high voltages and high vacuum in its operation.
该设备在其运行中会产生高电压和高真空

Figure 7-9. Glow discharge insert
7-9。 辉光放电插件

1. Check the machine is not operating
1. 检查机器是否未运转
.

2. Press down firmly on the top cover to release the latch
2. 用力按下顶盖以松开闩锁
.

3. Lift the top cover and rest it against its stop
3. 提起顶盖并将其靠在挡块上
.

4. Turn the two securing buttons to release and remove the installed insert (see Figure 7-1)
4. 转动两个固定按钮以释放和移除已安装的插件(见图 7-1)
.

Q150T ES users only: If the insert is a carbon rod type you may have to remove the rods first (see page59). To do this, check that the securing buttons are restraining the insert and open the lid assembly and rest it against the top cover assembly. Then, using a 2.5mm hex key, release the rod clamping screws and withdraw the rods. Close the lid assembly and release the insert by turning the securing buttons. Now remove the insert.
Q150TES 仅限用户 如果嵌件可能必须先拆下(参见第 59 页)。 为此 请检查固定按钮是否约束了 insert,然后打开盖子组件并将其靠在顶盖组件上。 然后, 使用 2.5 毫米六角扳手松开杆夹紧螺钉并取出杆。 关闭盖子组件,然后转动固定按钮释放插件 。现在删除插入物。

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Q150T S/E/ES plus

5. Prepare the glow discharge insert for installation by removing from any packaging, plastic bags etc. Check the‘O’ring in the outer ring of the lid assembly for damage or debris and clean or replace as required.
5. 任何包装、 塑料中取出 准备安装发光放电插件检查盖子组件中的 “O”形圈是否损坏碎屑 然后清洁更换根据需要

6. Remove the shutter by unscrewing the two retaining M3 screws (see Figure 7-10).
6. 拧下两个固定 M3 螺钉 ,取下百叶窗 7-10)。

Place the insert in position in the outer ring of the lid assembly carefully locating the M3 screw head in the rim of the insert in the slot to the right of the outer ring
将插件放入盖子组件的外圈中,小心地将 M3 螺钉头定位在外圈右侧插槽中插件边缘
.

7. Lock the insert in position by turning the securing buttons until their flanges overlap the insert.
7. 转动固定按钮 直到凸缘嵌件重叠,嵌件锁定

8. Plug the insert lead into the socket on the hinge assembly
8. 将插入导线插入铰链组件上的插座
.

Hinge assemblyShutter
铰链组件 Shutter

Retaining screws
固定螺钉

Figure 7-10. Removing the shutter
7-10. 取下快门

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Q150T S/E/ES plus

7.6 Rotacota Stage
7.6Rotacota 阶段

The Rotacota stage (10360) is an offset rotating stage, with tilting sample holder, designed to improve the even distribution of sputtering or evaporation (see Figure 7-11).
Rotacota 载物台 (10360) 是一个偏置旋转载物台 带有倾斜样品,旨在改善溅射蒸发均匀分布 (见7-11)。

1. Check the machine is not operating
1. 检查机器是否未运转
.

2. Open the top cover fully so it rests against its backstop
2. 完全打开顶盖,使其靠在逆止器上
.

3. Remove any installed sample stage by lifting carefully upwards
3. 小心地向上提起,移除所有已安装的样品台
.

4. Fit the Rotacota stage
4. 安装 Rotacota 舞台
:

a. Locate its shaft in the top of the stage rotation drive spigot protruding from the baseplate.
一个。 将其定位在底板突出载物台旋转驱动龙头的顶部

b. With a twisting motion, push it gently down until the base collar rests on the baseplate with the location cut-out on the stage aligned with the M3 cap head screw
b.以扭转的动作,轻轻向下推动,直到底座环靠在底板上,舞台上的位置切口与 M3 帽头螺钉对齐
.

5. Adjust the angle of the stage (up to 30° from horizontal):
5. 调整载物台的角度 水平方向最大成 30°):

a. Slacken the screws in the side of the shield
一个。松开防护罩侧面的螺丝
.

b. Angle the stage as required
b.根据需要调整载物台的角度
.

c. Re tighten the screws before use
c. 使用前重新拧紧螺丝
.

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Figure 7-11. Rotacota stage
7-11.Rotacota 阶段

Tilting adjustment screw Cutout
倾斜调节螺钉 Cutout

Stage shaft
舞台

Rotation drive spigot M3 cap head screw
旋转驱动套管 M3螺钉

Q150T S/E/ES plus

7.7 Slide Stage
7.7 幻灯片台

To install the slide sample stage (10358):
安装幻灯片例台 (10358):

1. Check the machine is not operating
1. 检查机器是否未运转
.

2. Open the top cover fully so it rests against its backstop
2. 完全打开顶盖,使其靠在逆止器上
.

3. Remove any installed stage by lifting carefully upwards
3. 小心地向上提升,移除任何已安装的载物台
.

Slide sample stageHeight-adjusting collarStage shaft
滑动样品高度调节系列载物台

Rotation drive spigot
旋转驱动龙头

Figure 7-12. Slide stage
7-12. 滑台

4. If necessary, adjust the stage height above the base plate
4. 如有必要,调整底板上方的载物台高度
:

a. Slacken the M3 screw in the collar with a hexagonal key
一个。用六角键松开轴环中的 M3 螺钉
.

b. Slide the collar to the desired position and retighten the M3 screw
b.将套环滑到所需位置并重新拧紧 M3 螺钉
.

The recommended position for the collar is to achieve a 31.5mm distance between the underside of the collar and the underside of the stage. If you
推荐位置是在衣领下侧载物台下侧之间实现 31.5 毫米的距离 如果你

require a greater distance between the stage and the target, the collar can be removed altogether with the underside of the stage therefore resting on the top of the drive spigot
需要平台和目标之间的更大距离,项圈可以完全移除,平台的底部因此位于驱动套管的顶部
.

An alternative shaft is supplied with the stage (10214) to further increase the range of stage height adjustment available. To fit, hold the stage firmly and release the M5 nut. Unscrew the shaft, transfer the nut to the new shaft and fit to the stage so that the top is flush with the lower surface of the stage when the nut is tightened.
载物台 (10214) 提供了一个替代 以进一步增加可用的载物台高度调节范围 为了适合 请牢牢握住载物台松开 M5 螺母。 拧下 shaft,将螺母转移到上并安装到载物台,以便在螺母 is 时, 顶部载物台的下表面flu h收紧。

5. Fit the slide stage
5. 安装载物台
:

a. Locate its shaft in to the top of the stage rotation drive spigot protruding from the base plate.
一个。 将其定位到伸出载物台旋转驱动龙头的顶部

b. With a twisting motion, push gently down until the collar around the shaft rests on top of the drive spigot (seeFigure 7-12)
b.以扭转的动作轻轻向下推,直到轴周围的轴环靠在驱动套管的顶部(见图 7-12)
.

Remove the collar if you need more distance between the stage and the target: the underside of the stage then rests on the top of the drive spigot.
如果你载物台和目标之间需要更大的距离 请取下项圈 载物台底部然后放在驱动龙头的顶部

To maximise the area or achieve more uniform coating on the slide stage, install the stage gearbox assembly (10359) - see page70.
为了滑台最大化面积实现均匀涂层 请安装载物台齿轮箱组件 (10359) - 参见70 页。

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Q150T S/E/ES plus

7.8 102mm Stage and Gearbox
7.8 102mm 载物台和变速箱

The 102mm stage (10458) is designed to hold 102mm (4”) silicon wafers (see Figure 7-13). If you want to use a FTM with this stage, install the stage offset gearbox assembly (10359).
102mm 载物台 (10458) 设计用于容纳 102mm(4“) 7-13)。 如果您想FTM平台一起使用 请安装 stage 偏置变速箱组件 (10359)。

The sample stage gearbox allows you to install the sample stage in an offset rotating position. To install the 102mm stage and its gearbox
样品台齿轮箱允许您将样品台安装在偏置旋转位置。安装 102 毫米载物台及其变速箱
:

1. Check the machine is not operating
1. 检查机器是否未运转
.

2. Open the top cover fully so it rests against its backstop
2. 完全打开顶盖,使其靠在逆止器上
.

3. Remove any installed stage by lifting carefully upwards
3. 小心地向上提升,移除任何已安装的载物台
.

4. Remove the M3 socket cap screw securing the turbo mesh (this is the screw nearest to the stage rotation drive spigot).
4. 拆下固定涡轮M3 内六螺钉 这是最靠近载物台旋转驱动龙头螺钉 )。

5. Fit the gearbox
5. 安装变速箱
:

a. Locate its shaft into the top of the stage rotation drive spigot
一个。 将其定位到载物台旋转驱动龙头的顶部

b. With a twisting motion, push it gently down until it sits down on the turbo mesh.
湾。 通过扭转动作, 轻轻将其向下,直到涡轮网上。

c. Secure in place with the M3 x 16 socket cap screw provided
c. 使用提供的 M3 x 16 内六角螺钉固定到位
.

6. Fit the large stage by locating its shaft in to the top of the stage rotation drive spigot protruding from the base plate and with a twisting motion pushing it gently down until the collar around the shaft rests on top of the drive spigot.
6. 将载物台的定位在载物台的顶部 ,旋转驱动伸出龙头 ,然后扭转动作将其轻轻向下衣领 ,以安装大载物台围绕位于驱动插口的顶部

7. Adjust the stage height above the base plate
7. 调整底板上方的载物台高度
:

a. Slacken the M3 screw in the collar with a hexagonal key
一个。 松开轴环中的 M3 螺钉

b. Slide the collar to the desired position and retighten the M3 screw
b.将套环滑到所需位置并重新拧紧 M3 螺钉
.

Remove the collar if you need more distance between the stage and the target:
如果您需要载物台目标之间保持更大的距离 请取下项圈

the underside of the stage then rests on the top of the drive spigot.
然后 载物台底面位于驱动龙头的顶部

Figure 7-13. Large (102mm) Sample Stage and gearbox
7-13.大型 (102 mm) 样品台和变速箱

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Q150T S/E/ES plus

7.9 Tilt Stage
7.9 倾斜舞台

The tilt stage (10357) allows you to vary the sample angle or height (see Figure 7-14). To fit the tilt stage
倾斜台 (10357) 允许您改变样品角度或高度(见图 7-14)以适合倾斜台
:

1. Check the machine is not operating
1. 检查机器是否未运转
.

2. Open the top cover fully so that it rests against its back stop
2. 完全打开顶盖,使其靠在后挡块上
.

3. Remove any installed stage by lifting carefully upwards
3. 小心地向上提升,移除任何已安装的载物台
.

4. Fit the tilt stage by locating its shaft in to the top of the stage rotation drive spigot protruding from the baseplate and with a twisting motion. Push gently down until the collar around the shaft rests on top of the drive spigot.
4. 倾斜平台轴定位在平台顶部 旋转驱动底板出的龙,并以 T 形运动安装倾斜平台。 轻轻向下,直到周围的套环位于驱动龙头的顶部

5. Adjust the tilt angle
5. 调整倾斜角度
:

a. Slacken the M3 screw below the stage with a hexagonal key
一个。 松开载物台下方M3 螺钉

b. Tilt the stage to the desired angle and retighten the M3 screw
b.将载物台倾斜到所需角度并重新拧紧 M3 螺钉
.

6. Adjust the stage height above the base plate
6. 调整底板上方的载物台高度
:

a. Slacken the M3 screw in the collar with a hexagonal key
一个。 松开轴环中的 M3 螺钉

b. Slide the collar to the desired position and retighten the M3 screw
b.将套环滑到所需位置并重新拧紧 M3 螺钉
.

Remove the collar if you need more distance between the stage and the target: the underside of the stage then rests on the top of the drive spigot. The
如果您需要载物台和目标之间保持更大的距离 请取下项圈 载物台的底面然后位于驱动龙头的顶部

recommended position is so that the collar is a distance of 31.5mm below the stage
建议的位置是使卡环与载物台下方 31.5 毫米的距离
.

Tilt angle adjustment
倾斜角度调整

Collar
衣领

Stage height adjustment
舞台高度调节

Figure 7-14. Adjustable tilting stage
7-14.可调节的倾斜平台

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Film Thickness Monitor (FTM)
薄膜厚度监测器 (FTM)

If you have specified an FTM on the configuration of your Q150T it will be preinstalled. To install the film thickness monitor (10362):
如果您在 Q150T配置指定了 FTM 它将预装它。 安装监视器 (10362):

1. Check the machine is not operating
1. 检查机器是否未运转
.

2. Open the top cover fully so it rests against its backstop
2. 完全打开顶盖,使其靠在逆止器上
.

3. Remove the glass chamber assembly
3. 拆下玻璃腔室组件
.

4. Fit the FTM assembly to the baseplate with two M3 x 8 socket cap screws (see Figure 7-15)
4. 用两颗 M3 x 8 内六角螺钉将 FTM 组件安装到底板上(见图 7-15)
.

5. Plug the FTM lead in to the BNC connector on the baseplate after removing the dust cap.
5. 取下防尘,将 FTM 引线插入底板上BNC 连接器

6. Refit the glass chamber assembly
6. 重新安装玻璃腔室组件
.

7. Close the top cover assembly and press down firmly to secure the latch
7. 关闭顶盖组件并用力按下以固定闩锁
.

8. Enable
8. 启用
the
FTM in
Hardware
硬件
Parameters
参数
(see
(参见
System > Properties
系统 > 属性
on
page
54). The
crystal
晶体
cover
(see
Figure
数字
7-15) may
五月
be
removed
删除
completely
完全
for
cleaning
清洗
or
if
如果
the
FTM is
in
continual
持续
use.
用。

Figure 7-15. FTM (left); replacing the FTM crystal (centre); FTM lead (right)
7-15.FTM( 左); 更换 FTM 晶体 (中心);FTM 引线 (右)

Replacing the FTM cry
替换 FTM 哭泣
stal

1. Check the machine is not operating
1. 检查机器是否未运转
.

2. Press down firmly on the top cover to release the latch
2. 用力按下顶盖以松开闩锁
.

3. Lift the top cover and rest it against its stop
3. 提起顶盖并将其靠在挡块上
.

4. Remove the glass chamber assembly
4. 拆下玻璃腔室组件
.

5. Unscrew the top cap of the crystal holder and withdraw (seeFigure 7-15)
5. 拧下晶体支架的顶盖并取出(见图 7-15)
.

6. Turn the cap upside down and remove the spring insulator assembly
6. 将盖子倒置并拆下弹簧绝缘体组件
.

7. Tip the old crystal (if fitted) out of the cap and fit the new crystal with the cap inverted.
7. 晶体 如果安装 盖子中取出 ,然后将盖子倒置安装晶体

8. Refit the spring insulator assembly to the cap
8. 将弹簧绝缘体组件重新安装到盖子上
.

9. Screw the cap assembly back on to the crystal holder body
9. 将瓶盖组件拧回晶体支架主体上
.

10. Refit the glass chamber assembly
10. 重新安装玻璃室组件
.

11. Close the top cover assembly and press down firmly to secure the latch
11. 合上顶盖组件并用力按下以固定闩锁
.

12. Check that the FTM is working in the System > FTM menu ( see page48)
12. 在 System > FTM 菜单中检查 FTM 是否正常工作(参见第 48 页)
.

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Q150T S/E/ES plus

7.11 Extended Height Cylinder
7.11 加长高度 Cylinder

1. Check the machine is not operating
1. 检查机器是否未运转
.

2. Press down firmly on the top cover to release the latch
2. 用力按下顶盖以松开闩锁
.

3. Lift the top cover and rest it against its stop
3. 提起顶盖并将其靠在挡块上
.

4. Remove the standard glass cylinder assembly (10068).
4. 拆下标准玻璃圆筒组件 (10068)。

5. Remove the M6 Cap head screw from the front of the pillar, slide the whole top cover and inner pillar assembly upwards until you see the fourth hole line up and replace the M6 cap head screw
5. 从立柱前部卸下 M6 帽头螺钉,向上滑动整个顶盖和内柱组件,直到看到第四个孔对齐并更换 M6 帽头螺钉
.

6. Place the extended glass cylinder assembly 10429 in place and close the top cover.
6. 加长玻璃圆柱组件 10429关闭盖。

The vent times will need to be extended to approx 200 seconds in recipes using the extended height cylinder.
在使用加长高度气缸配方中, 通风时间需要延长200

M6 cap head screw
M6螺钉

Figure 7-16. The extended height cylinder in position
图 7-16.加长高度圆柱体就位

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7.12 Full Range Vacuum Gauge Assembly
7.12 全范围 Vacuum 真空计组件

The instrument must be returned to the factory for fitting this option as the covers need to be removed
由于需要取下盖子,因此必须将仪器退回工厂以安装此选项
.

As standard, the Q150T is fitted with a Pirani gauge with a measurement range of
作为标准配置,Q150T 配备了皮拉尼测厚仪 测量范围

1000 5x10-4 mbar. The typical ultimate vacuum of the pumping system in a clean instrument after pre-pumping with dry nitrogen gas is 5 x10-5mbar. When the vacuum is better than 5x10-4 mbar the instrument simply displays“HiVac”. For users who need an accurate value for the vacuum achieved before and during the coating process (for example, when evaporating carbon it is desirable to achieve as good a vacuum as possible), the Full Range Vacuum Gauge Assembly option (10428) extends the accurate measurement range to 1000 5x10-9 mbar
1000 – 5x10-4 mbar 用干燥氮气预抽气后,洁净仪器中泵送系统的典型极限真空为 5 x10-5 mbar。当真空度优于 5x10-4 mbar 时,仪器仅显示“HiVac”。对于需要为镀膜过程之前和期间达到的真空提供准确值的用户(例如,在蒸发碳时希望达到尽可能好的真空),全范围真空计组件选件 (10428) 将精确测量范围扩展到 1000 – 5x10-9 mbar
.

Contact Quorum for further information.
请联系 Quorum 了解更多信息

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Q150T S/E/ES plus

7.13 Rotating Vacuum Spigot
7.13 旋转真空龙头

The vacuum spigot (10422) allows more convenient connection of a vacuum hose to the rear of the Q150T when the instrument is located close to a wall, bench upstand or other obstruction (seeFigure 7-17)
当仪器靠近墙壁、工作台支架或其他障碍物时,真空龙头 (10422) 允许更方便地将真空软管连接到 Q150T 的后部(见图 7-17)
.

Figure 7-17. Rotating vacuum spigot
7-17. 旋转真空龙头

To install the spigot:
安装水龙头:

1. Shutdown the instrument
1. 关闭仪器
.

2. Remove the lower screw below the protruding vacuum spigot
2. 拆下突出的真空龙头下方的下部螺丝
.

3. Apply a little vacuum grease to the spigot protruding from the rear of the instrument.
3. 从仪器后部突出龙头上涂抹真空润滑脂

4. Take the Rotating Vacuum Spigot assembly and check there is an‘O’ring in the bore
4. 拿起旋转真空龙头组件,检查孔中是否有 O“ 形圈 ”
.

5. Push the Rotating Vacuum Spigot assembly over the protruding spigot until it is completely home against the chassis (a slight twisting motion helps).
5. 旋转真空龙头组件推到突出的龙头,直到完全机箱 轻微的扭转运动会有所帮助)。

6. Screw the assembly home using an M4 x 20 pan headed screw underneath the assembly.
6. 使用组件下方M4 x20螺钉组件回家

7. Rotate the spigot to a suitable orientation and attach the hose from the backing pump
7. 将龙头旋转到合适的方向,并从前级泵连接软管
.

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Q150T S/E/ES plus

7.14 Spares
7.14 备件

The following are available from Quorum, or your local distributor, and are featured in more detail on the Quorum website:www.quorumtech.com
以下内容可从 Quorum 或您的本地分销商处获得,并在 Quorum website:www.quorumtech.com 上有更详细的介绍。
.

Table 17 Spare Parts for the Q150T
表 17Q150T 备件

SPARES FOR Q150T
Q150T 备件

CATALOGUE NUMBER
目录编号

QUANTITY

Carbon rods 3.05mm
3.05 毫米

C5422

Pack of 10
10 件装

Carbon rods 6mm
6mm

Pack of 10
10 件装

Carbon Cord
帘线

C5421

1 Metre
1

Molybdenum Boats

B5228

1 x packet 10
1 x 数据包 10

Glass Cylinder 6"
玻璃圆柱体 6”

G6260

Each

'L' Gaskets to suit
适合的 'L' 垫片

Pair

Oil Mist Filter
过滤器

O7803

Each

10A ceramic fuse
10A 陶瓷保险丝

16030015

Each

Supergrade 'A' Rotary Pump Oil
Supergrade'A' 旋转

O7802

1 Litre
1

Tungsten wire baskets
钨丝

B5230

Pack of 10
10 件装

Table 18 Replacement targets for Q150T S and Q150T ES
表 18 Q150T S 和 Q150T ES 的替代目标

REPLACEMENT TARGETS
替换目标

CATALOGUE NUMBER
目录编号

57mm x 0.3mm Chromium Target
57mmx0.3mm靶材

TK8845

57mm x 0.5mm Tungsten Target*
57mm x 0.5mm 靶*

TK8846

57mm Dia x 0.1mm Gold Target
57mm 直径 x0.1mm靶材

SC502-314A

57mm Dia x 0.1mm Au/Pd Target
57mm 直径 x0.1mmAu/Pd 靶材

SC502-314B

57mm Dia x 0.1mm Platinum Target
57mm 直径 x0.1mm 铂金靶材

SC502-314C

57mm x 1.5mm Chromium Target*
57mm x 1.5mm 靶材 *

TK8862

57mm x 0.2mm Tungsten Target
57mmx 0.2mm靶材

TK8867

57mm x 1.5mm Carbon Target*
57mm x 1.5mm 靶*

TK8869

57mm Dia x 0.1mm Copper Target
57mm 直径 x0.1mm靶材

SC502-314H

57mm Dia x 0.1mm Silver Target
57mm 直径 x0.1mm靶材

SC502-314E

57mm Dia x 0.1mm Nickel Target
57mm 直径 x0.1mm靶材

SC502-314D

57mm Dia x 1.0mm Aluminium Target
57mm 直径 x1.0mm

TK8875

57mm Dia x 0.1mm Palladium Target
57mm 直径 x0.1mm 钯金靶材

SC502-314G

57mm Dia x 0.1mm Pt/Pd (80/20%) Target
57mm 直径 x0.1mmPt/Pd(80/20%) 靶材

TK8878

57mm Dia x 1.5mm Titanium Target
57mm 直径 x1.5mm靶材

TK8879

57mm Dia x 0.3mm Pt/Pd (80/20%) Target
57mm 直径 x0.3mmPt/Pd(80/20%) 靶材

TK8887

57mm Dia x 0.3mm Gold Target
57mm 直径 x0.3mm靶材

TK8889

57mm Dia x 0.3mm Au/Pd (60/40%) Target
57mm 直径 x0.3mmAu/Pd(60/40%) 靶材

TK8891

57mm Dia x 0.3mm Platinum Target
57mm 直径 x0.3mm 铂金靶材

TK8893

57mm Dia x 0.5mm Titanium Target*
57mm 直径 x 0.5mm 靶*

TK8895

57mm Dia x 0.1mm Iron Target
57mm 直径 x0.1mm

TK8897

57mm Dia x 0.2mm Iridium Target
57mm 直径 x0.2mm 铱靶

TK8899

57mm Dia x 0.1mm Cobalt Target
57mm 直径 x0.1mm靶材

TK8900

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REPLACEMENT TARGETS
替换目标

CATALOGUE NUMBER
目录编号

57mm Dia x 0.1mm Tin Target
57mm 直径 x0.1mm靶材

TK8902

57mm Dia x 0.1mm Molybdenum Target
57mm 直径 x0.1mm靶材

TK8903

57mm Dia x 0.3mm Magnesium Target
57mm 直径 x0.3mm靶材

TK8905

57mm Dia x 0.1mm Tantalum Target
57mm 直径 x 0.1mm靶材

TK8906

57mm Dia x 0.3mm ITO Target
57mm 直径 x0.3mmITO 靶材

TK8907

* Requires spacer A4117193 under shield (see page57andFigure 7-2).
* 需要在防护罩下 A4117193 垫片(参见第 57 页和图 7-2)

Quorum can supply a wider range of target materials and thickness’. Please enquire for details.
Quorum 可以提供更广泛范围的目标材料和厚度。 详情请咨询

7.15 Other Accessories
7.15 其他配件

The following are available from Quorum or your local distributor.
以下可从 Quorum 或您当地的分销商处获得

Table 19 Accessories for the Q150T
表 19 Q150T 的附件

USEFUL ACCESSORIES FOR Q150T
Q150T 的有用附件

CATALOGUE NUMBER
目录编号

QUANTITY

Wenol Polish
Wenol 波兰

C5424

100ml. Tube
100 毫升

Amberclens Foam Cleaner
Amberclens 泡沫清洁剂

C5427

Each

Carbon Rod Shaper For 3mm Rods
用于 3mm 棒材的碳棒成型器

S8651

Each

Carbon Rod Shaper For 6mm Rods
用于 6 毫米杆的碳棒整形器

S8650

Each

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Q150T S/E/ES plus

8 Service and Maintenance
8 服务与维护

For technical and applications advice plus our on-line shop for spares and consumable parts visitwww.quorumtech.com
有关技术和应用建议以及我们的备件和易损件在线商店,请访问 www.quorumtech.com

CAUTION!
谨慎!

Ensure mains electrical power is off during any maintenance and service activities.
确保在任何维护和维修活动期间关闭电源

8.1 Maintenance
8.1 维护 ce

Table 20 Maintenance Tasks
表 20 维护任务

PROCEDURE

FREQUENCY

Inspect electrical power cords and plugs for general condition.
检查电源线插头的一般状况。

Regularly
定期

FTM users: Check the status of the FTM (see page48) and replace when necessary (see page72)
FTM 用户:检查 FTM 的状态(参见第 48 页)并在必要时更换(参见第 72 页)
.

Regularly
定期

Check and clean the glass chamber and the 'L' gaskets as
检查清洁玻璃“L”垫圈

required, using a lint-free tissue and foam cleanser, or similar.
需要, 使用不起毛的纸巾和泡沫清洁剂或类似产品

Do not use vacuum grease on 'L' gaskets.
不要在 “L”垫圈上使用真空润滑脂

Monthly
每月

Q150T S and Q150T ES only: Check the condition of the target material. The wear will depend on use. This is mainly over an outer annulus, accounting for some 70% of the surface area
仅限 Q150T S 和 Q150T ES:检查目标材料的状况。磨损会根据使用情况而定。这主要是在外环上,约占表面积的 70%
.

Monthly
每月

Check vacuum pump oil level
检查真空

Monthly
每月

Change oil using 1 litre of supergrade 'A'.
使用 1超级 “A”

6 Monthly
6 个月

Check oil mist filter for saturation. This is a disposable plastic filter and cannot be reactivated.
检查雾过滤器是否饱和。这是一次性塑料过滤器 无法重新激活。

6 Monthly or
6 个月或

more regularly as required.
根据需要频繁地进行。

Turbomolecular pump
涡轮分子

Service annually (see below)
每年服务一次( 见下文

Obtain consumable items from Quorum or an approved distributor only. Use only Quorum recommended items. For technical assistance and advice
从 Quorum经批准的分销商处获取易耗 仅使用 Quorum 推荐的项目。寻求技术帮助建议

- contact Quorum.
- 联系 Quorum。

8.2 Service
8.2 服务

It is recommended that the system should be serviced annually by a Quorum engineer or approved distributor.
建议每年Quorum 工程师经批准的经销商对系统进行维护

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Q150T S/E/ES plus

8.3 Troubleshooting
8.3 故障排除

Please note service and maintenance should be carried out annually by a Quorum engineer or approved distributor. In the event of non-operation, carry out the following checks:
请注意 维修和维护每年Quorum 工程师经批准的经销商进行 未运行的情况下, 请进行以下检查:

CAUTION! Disconnect activities.
谨慎! 断开活动。

the

power
权力

cord
绳子

BEFORE

carrying
承载

out

any
任何

servicing
服务

Check power to Instrument
● 检查仪器的电源
.

Check fuse.
检查保险丝。

Check vacuum pump local switch should be in 'on' position
● 检查真空泵本地开关是否就位
.

Check chamber seating for vacuum leaks
● 检查腔室固定是否真空泄漏
.

Check operating conditions of Instrument controls
● 检查仪器控制器的运行条件
.

Check target and connections
● 检查目标和连接
.

Check correct conditions for sputtering have been set
● 检查溅射条件是否设置正确
.

Check all connections.
检查所有连接。

8.4 Error Messages
8.4 错误消息

Table 21 Error Messages
表 21 错误消息

Error messages
错误消息

Description of fault
故障描述

Invalid group name
名称无效

The name entered is ether to long or the same as a existing group
输入的名称ether tolong 或 same 作为现有组

Maximum groups Reached
已到达的最大组数

Up to 20 groups allowed
最多允许 20 个组

Selected material not found in material list cannot continue with coating?
材料列表中找不到选定的材料 ,无法继续涂装

The specified material in the recipe has been removed from the material list
配方中指定的材料材料列表中删除

Name already exists
名称存在

The name entered is the same as an existing recipe/material
输入的名称作为现有配方/材料的 same

Name is too long
名称太长

The name entered is longer than 19 characters
输入的名称长度超过 19 个字符

Cannot run process
无法运行进程

An unrecoverable undefined error has occurred in starting a process.
启动进程发生不可恢复加密错误

This instrument does not support this process
本工具不支持此过程

The process run is not able to be run on this instrument
仪器上的进程运行无法run

Evaporation PSU not found
未找到蒸发 PSU

A Evaporation process has been run but the PSU is not present or not communicating
蒸发过程运行 ,但 PSU 不存在未通信

Sputter PSU not found
找到溅射 PSU

A sputtering process has been run but the PSU is not present or not communicating
工艺运行 PSU 不存在未通信

FTM crystal not oscillating. Please check or replace
FTM 晶体不振荡。 请检查或替换

FTM crystal failed and needs to be replaced
FTM 晶振故障, 需要更换

FTM Tooling Factor less than 0.1
FTM 工具系数小于 0.1

The product of the material tooling factor and the recipe tooling factor to less than 0.1
材料工具因子和配方工具因子的乘积小于 0.1

FTM Tooling Factor greater than 20
FTM 工具系数大于 20

The product of the material tooling factor and the recipe tooling factor to greater than 20
材料加工因子和配方加工因子的乘积大于 20

Vacuum interlock not
真空联锁

The operational vacuum as indicated by the gauge has
gauge 指示的工作真空度具有

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Error messages
错误消息

Description of fault
故障描述

operated. Can not proceed
操作。无法执行

been achieved but vacuum interlock switch has not operated.
已实现 ,但真空 InterLOCK 开关运行。

Current less than expected.
电流小于 expeced。

Check cord Process terminated
检查线 进程端接

The measured current is less than 20% of the requested value. Check that the cord is fitted correctly.
得的电流小于请求值的 20%。 检查电源线是否正确安装

Cord voltage less expected. Check insert for shorts
电源线电压不太预期。 检查短裤的插入件

The voltage is less than 20% of the expected voltage.
电压小于预期电压20%。

(expected voltage= measured current/0.16). Check that the correct type of cord is being used and there are no shorts between the source terminals and the insert base.
(预期电压 = 实测电流/0.16)。 检查是否使用了正确的电源线类型,并且源端插入底座之间没有阴影

Process stopped due to FTM crystal failure
由于 F TM 晶体故障 ,工艺停止

The FTM has stopped oscillating during the coating.
FTM涂层过程中已停止

Interlock has been activated process stopped
联锁激活 ,进程已停止

This is most likely caused by the top cover being opened during a cycle
很可能是由于循环过程中打开造成的

Unable to strike plasma
无法打击等离子体

The required sputter voltage has been applied for 10 second and the plasma has not struck. Check target is connected and that the Argon to turned on
所需的溅射电压施加 10 秒,但等离子体撞击。 检查目标 t 是否已连接,并且氩气是否打开

Short on Sputter output. Please check target
溅射输出短路。Pleasecheck target

The target shield needs cleaning. As required output current is seen but the target voltage is less than 80V.
目标防护罩需要清洁。根据需要 、可以看到输出电流 、但目标电压小于 80V。

System failed to achieve operational Vacuum
系统无法达到运行真空

The system has been pumping for the Max pump down time and has not achieved the operation vacuum
系统一直在抽真空至最大抽真空时间, 但未达到运行真空

Please fit Carbon Rod insert
安装碳杆插件

A recipe has been run that uses the Carbon Rod insert and it is not fitted in the chamber lid.
已经运行了一个配方 使用了插件, 但它没有安装在琥珀色的盖子中。

Please fit Carbon String insert
安装碳丝绳插件

A recipe has been run that uses the Carbon String insert and it is not fitted in the chamber lid.
已经运行了一个使用插件配方 但它没有安装在 ch 琥珀色盖子中。

Please fit Evaporation insert
安装蒸发插件

A recipe has been run that uses the Evaporation insert and it is not fitted in the chamber lid.
已运行使用蒸发插件配方 但未安装在 ch 琥珀色盖子中。

Please fit Glow Discharge insert
请将 Glow Discharge 安装在 sert

A recipe has been run that uses the Glow Discharge insert and it is not fitted in the chamber lid.
已运行一个配方 该配方使用了 GlowDischarge 插件 但它安装在琥珀色盖子

Please contact your supplier a problem has been found with the safety interlock.
请联系您的供应商 发现安全联锁装置有问题

Continue with coating?
继续涂装?

For safety the interlock operates in two ways and it has
为了安全起见,联装置以两种方式工作,

been detected that one has failed. Turn the system off and back on after 10 seconds to clear. If message is repeated, please contact your supplier.
检测到一个失败。关闭系统,然后在 10重新打开清除。 如果 message 重复出现, 请联系您的供应商

System PSU overtemperature Pleaes turn off system and
系统 PSU 过热请关闭系统和

alow to cool down
冷却下来

The power supply is over heating: coating will be disabled until the system has cooled sufficiently.
电源过热 涂层将被禁用 ,直到系统充分冷却

Current less than expected. Process terminated
电流低于预期。 进程已终止

Seen in evaporation processes when the current through the source is lower than expected or zero. Indicates that the source is open circuit/broken.
蒸发过程中,当通过的电流低于预期 ed 或零时 ,可见于此。 指示/断开。

Rod voltage less than 4V. Process terminated
杆电压小于 4V。 进程已终止

Seen in rod evaporation processes when the voltage
蒸发过程中可见 ,当电压

between the evaporation source terminals is less than 4V. Indicates that the rods have been incorrectly set up or
蒸发源端子之间小于 4V。 表示设置不正确

there is a conduction path between the terminals of the insert. Check rods and clean the insert.
插入物端子之间有一条传导路径 检查杆并清洁嵌件。

Interlock Present PSU not powered
联锁存在 PSU 未通电

The PSU interlock has been activated but power has not
PSU 联锁已启动 ,但电源尚未启动

been switched on to the selected coating module at this
此时打开选定的涂层模块

point. This could be the result of high evaporation power being taken on the previous run. To rectify this, switch the instrument off, wait 10 seconds for the internal current
点。这可能是由于上一次运行采用了蒸发功率的结果 。要解决此问题, 请关闭仪器,等待 10 秒以获得内部电流

limit to reset, and then switch the instrument on again.
limit 重置,然后再次打开仪器

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Table 22 Warning Messages
表 22 警告消息

Warning messages
警告消息

Description
描述

Please close top cover. Press OK when done
请合上顶盖。 完成后按 OK

The top cover above the chamber has not been closed on to the chamber lid
腔室上方的尚未关闭到腔室

Please fit sputter head and close the Top cover.
装上溅射头并关闭顶盖。

Press Ok when done
完成后按 Ok

The sputter head needs to be fitted
需要安装溅射

Maximum output power
最大输出功率

exceeded. Please check cord type.
超过。请检查电线类型。

The output power has exceeded 700W on the last pulse.
最后一个脉冲输出功率已超过 700W

Possible cord fuse detected on pulse
脉搏检测到可能的电线熔断器

It has been detected that the next pulse is likely to fuse the cord. Also, fusing the cord is likely take the
已经检测到下一个脉冲可能会熔断脊髓。此外,熔断电源线可能需要

deposition excessively above the required thickness.
沉积物超过所需的厚度。

Table 23 Information Messages
表 23 信息消息

Information messages
信息消息

Description
描述

Change in this Recipe Only
仅更改此配方

This can occur when editing a system level property with in a process recipe.
流程配方编辑系统属性时, 可能会发生这种情况

Yes: will set the value in this recipe.
Yes:将设置配方中的值。

No: will change the value of the system parameter thus changing all process.
:将更改系统参数的值, 从而更改所有进程。

Use Materials Defaults
使用材质默认值

This occurs when the material is changed in a recipe.
配方中的材料发生变化时,会发生这种情况

Yes: will copy the relevant properties i.e. oxidizing from the material list to the recipe.
:将相关属性 氧化)从材料列表复制到配方中。

No: will just change the material. This may prevent the clean property being set unless at admin user level.
:只会更改材质。这可能会阻止设置 clean 属性 除非在 admin 用户级别。

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9 Appendices
9 附录

9.1 Recipe Parameters
9.1 配方参数

Operation of the Q150T is controlled by a process recipe. There are several types of recipe as listed inTable 24. Each recipe contains a number of adjustable parameters. The following tables list the parameters available in each type of recipe, showing their default values and allowed ranges.
Q150T 的作工艺配方控制 24 中列出了几种类型的配方 每个配方 c 都包含许多可调参数。 下表列出了每种配方类型中可用的参数 显示了它们的默认值允许的范围。

Table 24 FTM/Timed Sputter Coating parameters
表 24FTM/定时溅射镀膜参数

Name
名字

Default Value
默认值

Minimum Value
最小值

Maximum Value
最大值

Comment
评论

Sputter Current (mA)
溅射电流 (mA)

20

1

50

Coating current
涂布电流

Updated from material list
材料 list 更新

Material
材料

Gold

Target Material required for this process
此过程所需的目标材料

Sputter Time (s)
溅射时间 (s)

10

1

3600

Timed Sputter only
仅定时溅射

Stops sputtering at set time.
在设定的时间停止溅射

Terminate
终止

Thickness (nm)
厚度 (nm)

5

1

2000

FTM Terminated Sputter only
仅限 FTM 端接溅射

Stops sputtering when the FTM reads this thickness
FTM 读取此厚度停止溅射

Tooling Factor
工具系数

2.3

0.1

10

Tooling factor for this process This is multiplied by that in the material list.
流程的刀具系数这是乘以材料列表中的 系数

Maximum
最大

Sputter Time (min)
溅射时间 (min)

4.0

0

60.0

FTM Terminated Sputter only
仅限 FTM 端接溅射

Sets upper limit to sputtering if FTM thickness has not been
如果 FTM 厚度尚未达到

achieved
实现

Clean target*
清洁目标*

No

No

Yes
是的

Clean target before coating
涂布清洁目标

Pump Hold*
泵滞留*

No

Wait time before process begins
进程开始的等待时间

Flush chamber*
冲洗室*

No

No

Yes
是的

Flush chamber with nitrogen before pumping down.
抽气氮气冲洗腔室

* Admin group level required to edit this property
* 编辑此属性需要管理员组级别

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Table 25 Carbon Pulse/Rod Evaporation recipe parameters
表 25 碳脉冲/棒蒸发配方参数

Name
名字

Default Value
默认值

Minimum Value
最小值

Maximum Value
最大值

Comment
评论

Material
材料

Carbon

Fixed; read only parameter
Fixed;只读参数

Pulses Length (s)
脉冲长度 (s)

1

0.02

10

Time pulse is applied for
应用时间脉冲

Pulse interval (s)
脉冲间隔 (s)

10

1

30

The time between the start of consecutive pulse cycles. Must exceed pulse length.
连续脉冲周期的间隔时间。 必须超过脉冲长度。

Pulse Count
脉冲计数

5

1

5

Number of consecutive pulse cycles
连续脉冲周期

Max outgas
最大排气量

recovery time*
恢复时间*

1

1

5

Outgas Current (A)
排气电流 (A)

30 (cord)
30(编码)

20 (rod)
20(棒材)

0

40

Current applied at the start of outgas step.
在除气步骤开始时施加的电流

Pulse Current (A)
脉冲电流 (A)

60 (cord)
60(编码)

75 (rod)
75(棒)

0

120

Current applied to cord during the evaporation pulse
蒸发脉冲期间施加到帘线电流

Pulse Voltage**
脉冲电压**

10V

Tooling Factor
工具系数

5

0.1

10

Tooling factor for this process
流程的工具系数

Outgas time*
放气时间*

10

2

60

Time cord or rod is outgassed before pulse cycle(s).
时间线脉冲循环之前

Outgas source*
排气源*

Yes
是的

No

Yes
是的

Include or exclude outgassing step
包括排除脱气步骤

Max Outgas
最大排气量

current (A)**
电流 (A)**

40

0

50

Maximum current permitted during outgas.
放气期间允许的最大电流

Max Outgas
最大排气量

voltage (V)**
电压 (V)**

10

0

20

Maximum voltage permitted during outgas
放气期间允许的最大电压

Pump hold*
泵保持*

No

No

Yes
是的

Wait time before process begins
进程开始的等待时间

Reduced
减少

Pumping

Conductance*
电导*

No

* Admin group level required to edit this property
* 编辑属性需要 管理员级别

** Engineer level required to edit this property
** 编辑属性所需的 工程师级别

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Table 26 Controlled Pulse cord
表 26 受控脉冲线

Name
名字

Default Value
默认值

Minimum Value
最小值

Maximum Value
最大值

Comment
评论

Terminate
终止

thickness
厚度

5

0.5

30

Terminate the coating when the FTM measured thickness reaches this
FTM 测量的厚度再次疼痛终止涂层

value
价值

Pulse
脉冲

Resolution
分辨率

0.4

0.2

2

Requested deposition on FTM for
请求FTM作证

each pulse. Note this should be
每个脉冲。 请注意,这应该是

multiplied by the tooling factor to
工具系数

find the expected stage thickness for each pulse.
找到每个脉冲的预期阶段厚度

Current Step Rate
当前步长速率

0.4

4

2

Set the amount the pulse current is
设置电流

changed by if the deposited thickness on the last pulse is not with in 0.2nm of the pulse Resolution
如果最后一个脉冲上的沉积厚度不是 0.2nm脉冲分辨率 则改变

Pulse Current

54

0

70

Sets the starting pulse current
设置启动电流

Max Pulse Voltage
最大脉冲电压

11

9

16

Maximum voltage during the pulse
脉冲期间的最大电压

Pulse Length (s)
脉冲长度 (s)

1

0.02

10

Set the Pulse length in seconds
设置 Pulselength 以秒为单位)

Maximum Pulses
最大脉冲数

25

1

50

Set the maximum number of pulses to apply if the terminate thickness is not being achieved
设置实现 Terminate thickness 时要应用的最大脉冲

Pulse Interval

10

5

30

Set the length of time between the
设置

pulses in seconds. Note reducing this time will reduce the time the FTM has to settle and reduce accuracy
脉冲 (以秒为单位 )。 注意 减少此时间将减少 FTM 建立的时间降低准确性

Out Gas Time
用完 GasTime

30

2

60

Time the cord is outgassed
电源线的时间

Out Gas
出气

current
当前

30

0

50

The current applied to the cord during the outgas time
在放气期间施加到电源线的电流

Max outgas recovery
最大废气回收率

time*
时间*

60

0

300

The maximum time the system will wait for the vacuum to return to the vacuum level it was at prior to
系统等待真空恢复到之前的真空的最长时间

outgassing
除气

Flush
冲洗

chamber*
室*

No

Set to yes to flush the chamber with the vent (N2) gas before pumping
设置为 yes 以在泵送排气口 (N2) 气体冲洗腔室

down for the process
过程而降

Pump hold
泵保持

Yes
是的

No

Yes
是的

Wait time before process begins
进程开始的等待时间

Tooling
工具

factor
因素

2.25

0.1

10

The deposition on the FTM crystal is multiplied by this value before it is
FTMcrystal 上的沉积乘以该值 ,然后

displayed. Thus allowing it to be used to compensated the FTM for a
显示。因此允许它用于补偿 FTM f 或 a

different rate of deposition between the FTM and the stage
FTM 和阶段之间的沉积不同

*Admin group level required to edit this property
* 编辑此属性需要管理员组级别

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Table 27 Ramped recipe parameters
表 27 斜坡 recipe 参数

Name
名字

Default Value
默认值

Minimum Value
最小值

Maximum Value
最大值

Comment
评论

Material
材料

Carbon

Fixed; read only parameter
Fixed;只读参数

Evaporation Current
蒸发电流

52

5

65

Maximum evaporation current.
最大蒸发电流

Evaporation time (s)
蒸发时间 (s)

90

6

240

The time the current is applied. Starts when the evaporation
施加电流的时间 在蒸发时启动

Current exceeds Pre Evap end current.
电流超过 PreEvap 结束电流

Max.
麦克斯。

Evaporation
蒸发

time (min)*
时间 (分钟)*

6

3

10

Tooling Factor
工具系数

1.0

0.1

10

Tooling factor for this process.
process 的工具因子

Pre Evap Rate* (A/S)
蒸发前速率*(A/S)

1

0.5

20

Rate at which the current is
电流

increase after the outgas time.
放气时间后增加

Pre Evap End current (A)
预蒸发结束电流 (A)

32

0

60

The output current at which
输出电流

the above ramp rate is
上述斜坡速率

stopped. The evaporation time is started at this point.
停止。 蒸发从此时开始

Current Ramp Rate (A/s)*
当前斜坡速率 (A/s)*

0.20

0.01

20

Rate at which the current is
电流

increase until the value of
increase 直到

Evaporation current property is reached.
达到蒸发电流特性

Outgas Current
放气电流

20

0

50

Time cord or rod is outgassed before pulse cycle(s).
时间线脉冲循环之前

Out Gas Time (s)
Out Gas 时间 (s)

10

2

120

Time cord or rod is outgassed.
时间线过时

Max
麦克斯

Evaporation Current**
蒸发电流**

60

Max
麦克斯

Evaporation Voltage**
蒸发电压**

8

Max Outgas
最大排气量

current (A)**
电流 (A)**

50

Maximum current permitted during outgas.
放气期间允许的最大电流

Max Outgas
最大排气量

voltage (V)**
电压 (V)**

6

Maximum voltage permitted during outgas
放气期间允许的最大电压

Flush chamber*
冲洗室*

No

No

Yes
是的

Set to Yes to flush chamber
设置为 Yes (是 ) 以冲洗腔室

with nitrogen before pumping down.
抽气之前用氮气

Pump hold*
泵保持*

Yes
是的

No

Yes
是的

Wait time before process begins
进程开始的等待时间

* Admin group level required to edit this property
* 编辑属性需要 管理员级别

** Engineer level required to edit this property
** 编辑属性所需的 工程师级别

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Table 28 Metal Evaporation recipe parameters
表 28 金属蒸发配方参数

Name
名字

Default Value
默认值

Minimum Value
最小值

Maximum Value
最大值

Comment
评论

Material
材料

Gold

Material to be evaporated in this process
在此过程中蒸发的材料

Evaporation
蒸发

Current (A)
电流 (A)

46

5

60

Current applied during the evaporation pulse
蒸发脉冲期间施加的电流

Evaporation
蒸发

time (min)
时间 (min)

0

0.1

4

Duration of evaporation pulse
蒸发持续时间 n 脉冲

Tooling Factor
工具系数

1

0.1

10

Tooling factor for this process
流程的工具系数

Outgas Current (A)
排气电流 (A)

10

0

50

Time cord or rod is outgassed before pulse cycle(s).
时间线脉冲循环之前

Out Gas Time (s)
Out Gas 时间 (s)

10

2

120

Time source is outgassed before evaporation pulse.
时间源蒸发脉冲之前

Outgas source*
排气源*

No

No

Yes
是的

Include or exclude outgassing step
包括排除脱气步骤

Max
麦克斯

Evaporation Current**
蒸发电流**

50

Max
麦克斯

Evaporation Voltage*
蒸发电压*

20

Max Out Gas
最大气体

Current** (A)
电流** (A)

50

0

50

Maximum current that can be set during outgas
放气期间设置的最大电流

Max OutGas Voltage*
最大气体输出电压*

(V)
(五)

20

1

20

The voltage across the rod is limited to this value during Outgas
排气期间,两端的电压限制在该值

Flush chamber*
冲洗室*

No

No

Yes
是的

Set to Yes to flush chamber
设置为 Yes (是 ) 以冲洗腔室

with nitrogen before pumping down.
抽气之前用氮气

Pump hold*
泵保持*

No

No

Yes
是的

Wait time before process begins
进程开始的等待时间

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10473 - 8 期 86 www.quorumtech.com

Table 29 Aperture Cleaning recipe parameters
表 29 孔径清洁配方参数

Name
名字

Default Value
默认值

Minimum Value
最小值

Maximum
最大

Value
价值

Comment
评论

Clean Current (A)
清洁电流 (A)

10

0

120

Current applied to evaporation source during the evaporation.
蒸发 n 期间施加到蒸发的电流。

Max Clean
最大清洁

Current (A) **
当前 (A) **

50

Max Clean
最大清洁

Voltage(V)*
电压 (V)*

20

1

20

Set the maximum voltage that can be driven on to the source.
设置可以驱动到源的最大电压

Clean time
清洁时间

(Minutes)
(分钟)

1

0

10

Duration of evaporation pulse.
蒸发脉冲持续时间

Flush chamber*
冲洗室*

No

No

Yes
是的

Set to Yes to flush chamber
设置为 Yes (是 ) 以冲洗腔室

with nitrogen before pumping down.
抽气之前用氮气

Pump hold (hrs)*
泵滞留时间(小时)*

24

0

72

Wait time before process begins
进程开始的等待时间

* Admin group level required to edit this property
* 编辑属性需要 管理员级别

** Engineer level required to edit this property
** 编辑属性所需的 工程师级别

Table 30 Vacuum shutdown properties
表 30 真空关机属性

Name
名字

Default Value
默认值

Minimum Value
最小值

Maximum Value
最大值

Comment
评论

Shut down
关闭

Vacuum (mbar)
真空 (mbar)

1

1x10-2

1x10+2

Set the Vacuum that the

system will pump down to.
系统将抽真空到。

Note the final vacuum may be different.
请注意,最终的真空可能会有所不同

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9.2 Overriding System Parameters in a Recipe
9.2 覆盖配方中的系统参数

If you have Admin group privileges, you can override some of the parameters for a selected recipe (see page24)
如果您拥有 Admin 组权限,则可以覆盖所选配方的某些参数(参见第 24 页)
.

Table 31 System override properties
表 31 系统覆盖属性

Name
名字

Normal system property
Normal 系统属性

Description
描述

Gas Bleed Time*
气体排放时间*

15 s
15

Bleed Vacuum*
排放真空*

1.0 x 10-1 mbar
1.0 x10-1 毫巴

Stage Rotate
舞台旋转

Yes
是的

Allow the stage to be turned off for just this cycle
让舞台在这个周期中被关闭

Stage Rotate Speed
载物台旋转速度

70

Set the speed of the stage for this process
设置此过程阶段速度

Pump Hold Time*
泵保持时间*

24.0 hrs
24.0 小时

Time before process is started after initial pumpdown
初始抽空后工艺开始前的时间

Operational Vacuum*
真空*

1.0 x 10-1 mbar
1.0 x10-1 毫巴

Pressure at which the chamber is maintained at while the plasma is present
等离子体存在时, 腔室保持的压力

Vent Time*
通风时间*

70 s
70

Bleed Gas Flush Cycles*
排放气体冲洗循环*

0

Extra Pump Time*
额外的泵送时间*

60 s
60

* Admin group level required to edit this property
* 编辑属性需要 管理员级别

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9.3 Technical Specification
9.3 技术规格

Table 1 lists the technical specification of the Q150T.
1 列出了 Q150T 的技术规格

Table 32 Technical Specification
表 32 技术规格

All instruments
所有乐器

Instrument Case
仪表箱

590mm (width) x 420mm (height) x 535mm (depth)
590mm (宽) x 420mm (高) x535mm (深)

Work Chamber
工作

Borosilicate glass: 127mm (height) x 165mm (diameter)
硼硅酸盐玻璃:127mm (高) x165mm (直径)

Safety Shield
安全防护罩

PET

Ultimate vacuum
极限真空

< 1x10-6 mbar
<1x10-6 毫巴

Turbomolecular Pump
涡轮分子

60 l/s
60 升/秒

Vacuum Gauge Range
真空范围

1000 to < 5x10-4 mbar
1000 至 <5x10-4 mbar

Fuse
保险丝

T 10A ceramic (5x20mm); fuse standard IEC60127-2
T10A 陶瓷 (5x20mm);保险丝 标准 IEC60127-2

Weight
重量

36 kg
36 千克

Display
显示

115.5mm x 86.4mm (active area)
115.5mm x 86.4mm (有效区域)

640 x 480 RGB (display format)
640 x 480RGB(显示格式)

Sputter Coater (Q150T S and Q150T ES)
溅射镀膜机(Q150T S 和 Q150T ES)

Target
目标

54 mm (diameter) x 0.2 mm (thickness) (chromium fitted as standard)
54mm (直径) x 0.2mm (厚度) (标准镀铬

Specimen Stage
样品

60mm (diameter) rotating stage
60mm(直径) 旋转平台

Deposition Current
沉积电流

0-150 mA
0-150 毫安

Deposition Rate
沉积速率

0-20 nm/min
0-20 纳米/分钟

Sputter Timer
溅射计时器

0-10 min
0-10 分钟

Evaporation (Q150T E and Q150T ES)
蒸发(Q150T E 和 Q150T ES)

Evaporation current (rod)
蒸发电流(棒)

0-90 A
0-90 安培

Outgas current
放气电流

0-50 A
0-50 安培

Carbon source
碳源

3.2mm rods or carbon cord
3.2 毫米

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Q150T S/E/ES plus

9.4 Sputtering Deposition Rate
9.4 溅射沉积速率

These graphs are provided for guidance only and are not to be taken for absolute reference.
这些图表仅供参考,不应作为绝对参考。

Deposit ion Rate (nm/min)
沉积离子速率 (nm/min)

90.0

80.0

70.0

60.0

50.0

40.0

30.0

20.0

10.0

0.0

7 x 10-3 mbar
7 x10-3 毫巴

1 x 10-2 mbar
1 x10-2 毫巴

10 20 30 40 50 60 70 80
票价:10 20 30 40 50607080

Deposition Current (mA)
沉积电流 (mA)

Figure 9-1. Sputtering deposition rate using gold at bleed pressures of 7 x 10-3 mbar and 1 x 10-2 mbar
图 9-1.在 7 x 10-3 mbar 和 1x 10-2 mbar 的排放压力下使用黄金的溅射沉积速率

Gold tooling factor = 2.7
黄金工具系数 = 2.7

10473 - Issue 8 90 www.quorumtech.com
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Q150T S/E/ES plus

Deposit ion Rate (nm/min)
沉积离子速率 (nm/min)

40.0

35.0

30.0

25.0

20.0

15.0

10.0

5.0

0.0

7 x 10-3 mbar
7 x10-3 毫巴

1 x 10-2 mbar
1 x10-2 毫巴

60 70 80 90 100 110 120 130 140 150
票价 60 708090100 110 120 130 140 150

Deposition Current (mA)
沉积电流 (mA)

Figure 9-2. Sputtering deposition rate using chromium at bleed pressures of 7 x 10-3 mbar and 1 x 10-2 mbar
图 9-2.使用 铬的溅射沉积速率,排放压力为 7 x 10-3 mbar 和 1x 10-2 mbar

Chromium tooling factor = 2.28
铬模具系数 = 2.28

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Deposit ion Rate (nm/min)
沉积离子速率 (nm/min)

200.0

180.0

160.0

140.0

120.0

100.0

80.0

60.0

40.0

20.0

0.0

7 x 10-3 mbar
7 x10-3 毫巴

1 x 10-2 mbar
1 x10-2 毫巴

20 30 40 50 60 70 80 90 100 110 120 130 140 150
票价:20、30、40、5060、70、80、90、100、110、120、130、140、150

Deposition Current (mA)
沉积电流 (mA)

Figure 9-3. Sputtering deposition rate using silver at bleed pressures of 7 x 10-3 mbar and 1 x 10-2 mbar
图 9-3。在 7 x 10-3 mbar 和 1x 10-2 mbar 的 b LEED 压力下使用银进行溅射沉积速率

Silver tooling factor = 2.5
白银工具系数 = 2.5

10473 - Issue 8 92 www.quorumtech.com
10473 - 8 期 92 www.quorumtech.com

9.5 Return of Goods
9.5 退货

This section contains important safety information regarding the return of Preparation Equipment and Accessories.
本节包含有关退回 PreparationEquipment and Accessessies 的重要安全信息

9.5.1 General Introduction
9.5.1 一般介绍

The employer (user) is responsible for the health and safety of his employees. This also applies to all those persons who come into contact with the Preparation Equipment and Accessories either at the user’s or manufacturer’s premises during repair of service. The contamination of Preparation Equipment and Accessories has to be declared and the Health and Safety Declaration form completed. (Appendix - 9.5.5for the form)
雇主 (用户) 对其雇员 健康和 安全负责 也适用于 所有 接触制备设备和 附件的人 维修服务期间 用户或制造商的场所 必须 申报制备设备和 配件污染 ,以及健康和 安全 填写声明 (表格的附录 - 9.5.5

9.5.2 Health and Safety Declaration
9.5.2 健康与安全声明

Those persons carrying out repair or service have to be informed of the condition of the components. This is the purpose of the 1DecIaration of Contamination of Preparation Equipment and Accessories’.
必须将部件的状况告知进行维修或服务的人员 这就是 1DecIarationofPollution of PreparationEquipmentand Accessories' 的目的

9.5.3 Despatch
9.5.3 发送

When returning equipment the procedures set out in the Operating Instructions must be followed. For example:
退回设备时, 必须遵循说明中规定的程序 例如

- Drain the vacuum pumps.
- 排空真空泵。

- Neutralise the flushing with gas.
- 气体中和冲洗

- Remove filter elements.
- 移除过滤元件。

- Seal all outlets.
- 密封所有出口

- Pack glass components safely.
- 安全地包装玻璃组件

- Pack loose attachments securely for example stages.
- 安全地包装松散附件 ,例如 舞台。

- Seal in heavy duty polythene or a bag,
- 密封重型 聚乙烯袋子

- Despatch in suitable transport container.
- 使用合适的运输容器发货

9.5.4 Return Address:
9.5.4 退货地址:

F.A.O.: The Service Manager
F.A.O.: 服务管理器

Quorum Technologies,
Quorum Technologies、

Judges House
法官之家

Lewes Road
刘易斯

Laughton
劳顿

East Sussex
萨塞克斯郡

BN8 6BN
BN860 亿

www.quorumtech.com 93 10473 - Issue 8
www.quorumtech.com 93 10473 -8

Q150T S/E/ES plus

9.5.5 Declaration of Contamination Form
9.5.5 污染申报表

Table 33 Declaration of Contamination Form
表 33 污染申报表

Declaration of Contamination of Preparation Equipment and Accessories.
制备设备和附件污染声明

The repair and/or service of Preparation Equipment and Accessories can only be carried out if a correctly completed declaration has been submitted. Non-completion will result in delay. The manufacturer reserves the right to refuse acceptance of consignments submitted for repair or maintenance work where the declaration has been omitted.
只有在正确填写声明的情况下, 才能进行 Pr 分离设备和附件的维修和/或服务 。未完成将导致延迟。 制造商保留拒绝接受提交维修或保养工作的货物的权利 ,如果声明被遗漏。

This declaration may only be completed and signed by authorised and qualified staff.
本声明只能由获得授权的合格员工填写和签署。

1. Description of component 2. Reason for return:
1. 组件描述 2.退货原因:

- Equipment type/model: _________________
- 设备类型/型号:_________________

- Code No:. _________________________
- 代码:._________________________

________________________________

- Serial No.: _________________________
- 序列号 : _________________________

- Invoice No. (if known) _________________
- 发票编号(如果知道)_________________

- Delivery Date.: (if known)__________ _______
- 交货日期:(如果知道 )__________ _______

3. Equipment condition
3. 设备条件

- Has the equipment been used? Yes/No
- 设备是否已使用过? 是/否

- What type of operating medium was used?
- 使用什么类型的工作介质

- Is the equipment free from potentially harmful
- 设备是否无潜在危害

substances? Yes/No
物质? 是/否

(If Yes go to Section 5)
(如果 请转到第 5 部分)

(If No go to Section 4)
(如果为否 ,则转到第 4 部分

4. Process related contamination of Equipment/Accessories.
4. 设备/附件的工艺相关污染

- Toxic
- 有毒

- Corrosive
-腐蚀

- Explosive*
-爆炸物*

- Microbiological*
-微生物*

- Radioactive*
-放射性*

- Other harmful substances
- 其他有害物质

Yes/No
是/否

Yes/No
是/否

Yes/No
是/否

Yes/No
是/否

Yes/No
是/否

Yes/No
是/否

* We will not accept any Equipment/Accessories which have been radioactively, explosively, or microbiologically contaminated without written evidence that such Equipment/Accessories have been decontaminated in the prescribed manner.
* 如果没有书面证据证明此类设备/附件按照规定的方式进行净化 我们将不接受任何受到放射性、爆炸性微生物污染的设备 /配件

Please list all harmful substances, gases and dangerous by-products, which have come into contact with the Preparation Equipment and Accessories.
请列出与制备设备和附件接触的所有有害物质 、气体和危险副产品

Trade name
商品名

Product name
产品名称

Manufacturer
制造者

Chemical name and symbol
化学名称和符号

Danger class
危险等级

Precautions
预防 措施

associated with substance
substance 相关

First aid measures in the event of an
发生

accident
事故

1.

2.

3.

4.

5.

5. Legally Binding Declaration.
5. 具有法律约束力的声明。

I hereby declare that the information supplied on this form is complete and accurate. The despatch will be in accordance with the appropriate regulations covering Packaging, Transportation and Labelling of Dangerous Substances.
本人谨此声明,本表格上提供的信息是完整和准确的。 发货将符合有关危险物质包装 、运输标签的相关规定。

Name of Organisation: _________________________________________
组织名称 _________________________________________

Address:
地址:

___________________________________________________

_________________ Post Code: ______________
_________________ 邮政编码: ______________

Tel.: _________________ Fax.: ______________
电话: _________________ 传真: ______________

Name: _________________ Job Title: ______________
姓名: _________________ 职位名称: ______________

Date: _________________ Company Stamp: _____________
日期:_________________ 公司邮票:_____________

10473 - Issue 8 94 www.quorumtech.com
10473 - 8 期 94 www.quorumtech.com

Q150T S/E/ES plus

10 Index
10 指数

www.quorumtech.com 95 10473 - Issue 8
www.quorumtech.com 95 10473 -8

A

About screen 47
关于 screen47

accessories 12, 57, 77
配件 12,57,77

102mm stage70
102mm 载物台 70

carbon fibre insert 62
碳纤维嵌件 62

carbon rod insert 59
嵌件 59

extended height cylinder 73
加长高度气缸 73

FTM 72

glow discharge insert 66
发光排放插件 66

rotacota stage 68
罗塔科塔 68 期

rotating vacuum spigot 75
旋转真空龙头 75

slide stage 69
滑台 69

sputter insert 57
溅射插件 57

tilt stage71
倾斜舞台 71

vacuum gauge 74
真空计 74

aluminium thin film 29
铝薄膜 29

aperture cleaning 10
孔径清洁 10

Appendices 82
附录 82

Argon 11
氩气 11

B

backup 47
备份 47

C

carbon coating 9
涂层 9

carbon fibre insert 62
碳纤维嵌件 62

carbon rod insert 59
嵌件 59

carbon rods

shaping61
塑形 61

Choose Process Type 23
选择 Process Type23 (进程类型 23)

conductive carbon layer
导电

SEM 41
扫描屏 41

TEM 40
TEM40 系列

confirm password 49
确认密码 49

Conformity 7
一致性 7

connections 13
连接 13

aux network16
AUX 网络 16

earth 15
地球 15

electrical 15
电气 15

gas 14
气体 14

pump output 15
输出 15

standard stage 17
标准阶段 17

USB 16
USB 16 端口

vacuum 16
真空 16

COSHH 7
COSHH7 餐厅

creating a new material 26
创建新材质 26

D

date 47
日期 47

Declaration of Contamination form 94
污染声明 94

despatch 93
93 号邮票

E

earth connection 15
接地连接 15

Edit Users 49, 50, 51
编辑用户 49,50,51

electrical connections 15
电气连接 15

error messages 79
错误消息 79

evaporation 10
蒸发 10

events log 56
事件记录 56

extended height cylinder 73
加长高度气缸 73

F

Fail Safe 7
故障安全 7

file manager 47
文件管理器 47

film thickness monitor 48
膜厚监测仪 48

filter 14
筛选 14

front view 8
前视图 8

FTM

installing 72
安装 72

relocating for upwards evaporation 64
重新定位以向上蒸发 64

replacing the crystal 72
更换 Crystal72

status 48
状态 48

full name 49
姓名 49

full range vacuum gauge 74
量程真空计 74

G

gas connections 14
燃气连接 14

GloCube 43
GloCube43 立方体

glow discharge 10, 43
辉光放电 10,43

glow discharge insert 66
发光排放插件 66

H

hardware properties 54
硬件特性 54

Hazard Signal Words 7
危险信号词 7

Health and Safety 7
健康安全 7

Health and Safety declaration 93
健康安全宣言 93

height of stage 17
第 17 赛段的高度

history 56
历史 56

Home screen 19
主屏幕 19

hydrophilisation 43
亲水 43

I

information messages 81
信息消息 81

inserts 57
刀片 57

carbon fibre 62
碳纤维 62

carbon rod 59
59

glow discharge 66
辉光放电 66

metal evaporation 63
金属蒸发 63

metal evaporation (upwards) 64
金属蒸发(向上)64

sputter 57
溅射 57

installation 11
安装 11

Intended Use 7
有可能的使用 7

M

maintenance 78
维护 78

Maintenance screen 48
维护屏幕 48

materials 26
材料 26

creating 27
创建 27

creating new 26
创建新的 26

deleting 28
删除 28

10473 - Issue 8 96 www.quorumtech.com
10473 - 8 期 96 www.quorumtech.com

Materials Editor 26
材质编辑器 26

menus 46
菜单 46

messages
消息

error 79
错误 79

information81
信息 81

warning 81
警告 81

metal evaporation 10
金属蒸发 10

metal evaporation insert 63
金属蒸发插件 63

molybdenum boat 10, 64
10,64

N

Name screen 23
名称屏幕 23

network connection 16
网络连接 16

Nitrogen 11
氮气 11

O

Operation 19
19

outgas source 35
排气35

outgassing 35
除气 35

overriding system settings 88
覆盖系统设置 88

P

password 49
密码 49

pre-installation 11
安装前 11

pump output 15
输出 15

purging 11
清除 11

Q

Quality 7
品质 7

R

ramped recipe 38
斜坡食谱 38

range 8
范围 8

rear view 13
后视图 13

recipes 22
食谱 22

creating 23
创建 23

default 22
普通 22

editing parameters 24
编辑参数 24

parameters 82
参数 82

ramped38
坡面 38

running20
运行 20

screen23
屏幕 23

regulators 11
稳压器 11

restore 47
恢复 47

return address 93
退货地址 93

return of goods 93
退货 93

running a recipe 20
运行配方 20

S

screens
屏幕

About 47
47

Choose Process Type23
选择 Process Type23 (进程类型 23)

Edit Users 49, 50, 51
编辑用户 49,50,51

FTM Status 48
FTM 状态 48

Maintenance48
维护 48

Name 23
姓名 23

New Material 27
材料 27

Select Material26
选择材料 26

security 49
安全 49

Select Material screen 26
选择材质屏幕 26

SEM 29

service 78
服务 78

services 11
服务 11

shaping carbon rods 61
成型61

spares 76
备件 76

specification 89
规格 89

sputter coating 9
溅射镀膜 9

sputter insert 57
溅射插件 57

sputter parameters 52
溅射参数 52

sputtering 11
溅射 11

sputtering deposition rate 90
溅射沉积速率 90

stages 57
阶段 57

102mm 70
102 毫米 70

gearbox 70
变速箱 70

rotacota 68
罗塔科塔 68

slide 69
幻灯片 69

standard 17
标准 17

tilting 71
倾斜 71

standard stage 17
标准阶段 17

status indicator 18
状态指示灯 18

surface cleaning 43
表面清洁 43

system 49
系统 49

system properties 46
系统属性 46

system settings 88
系统设置 88

T

targets 76
目标 76

Thickness ramped carbon 42
斜走厚度 42

time 47
时间 47

tooling factor 17
工具系数 17

troubleshooting 79
疑难解答 79

tungsten 29
29

U

unpacking 12
开箱 12

update 47
更新 47

USB 16
USB16 端口

Use 7
使用 7

user level 49
用户等级 49

username 49
用户名 49

users 49
用户 49

creating 50
创建 50

V

vacuum connections 16
真空连接 16

vacuum gauge 74
真空计 74

vacuum parameters 53
真空参数 53

W

warning messages 81
警告消息 81

WEEE Compliance 7
WEEE 合规性 7

wire basket 64
64

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www.quorumtech.com 97 10473 -8

Quorum Technologies Ltd.
Quorum TechnologiesLtd. 公司

Judges House Lewes Road
JudgesHouse 刘易斯

Laughton
劳顿

East Sussex BN8 6BN
萨塞克斯BN860 亿

Tel: +44(0) 1323 810981
电话:+44(0)1323810981

Email:sales@quorumtech.com
邮箱:sales@quorumtech.com

Web : http://www.quorumtech.com
网站 http://www.quorumtech.com