Hardware compatible with alternative test specification A0.docx

Table of Contents

1. Product description and scope of application6

2 Implement standard 6

3. Test items and stress requirements 7

3.1Test item 7

3.2 The number of DUTs is required to be 10

3.3Test output 10

4 Noun Explanation 10

5Test configuration 11

5.1Test equipment and instruments11

6Compatible with alternative test item 11

6.1 shell mould 11

6.1.1 Structural testing of all items11

6.1.2 Temperature rise test11

6.2 Housing material11

6.2.1Shock test11

6.2.2 Drop test11

6.2.3Ball Batting Test12

6.2.4EMC testing12

6.2.5 Temperature rise test12

6.3 Heat sink 12

6.3.1Shock test12

6.3.2 Drop test12

6.3.3RE Testing12

6.3.4 Temperature rise test13

6.3.5Radiation sensitivity13

6.4Antennas13

6.4.1 S11 13

6.4.2Wireless throughput13

6.4.3Indoor coverage13

6.4.4RE Test 13

6.4.5 ESD 14

6.5 PCB 14

6.5.1Wireless TX indicators14

6.5.2Radiation sensitivity14

6.5.3RE Test 14

6.5.4CE test14

6.5.5 Temperature cycling14

6.6 Adapter/switching power strip 15

6.6.1AC Pull Bias, Voltage Accuracy, and Voltage Ripple15

6.6.2 Inrush current at the DC end15

6.6.3 Switch on and off15

6.6.4 Power consumption of the whole machine15

6.6.5Connection rate test15

6.6.6 Dying gasp测试 16

6.6.7 Load capacity test16

6.6.8Safety input test16

6.6.9 Leakage current test16

6.6.10Hipot test16

6.6.11ERP Test 16

6.6.12 EMC 17

6.6.13 Temperature cycling17

6.6.14 High and low temperature deviation start17

6.7Power supply devices17

6.7.1Power-on timing and overshoot17

6.7.2 Voltage accuracy and ripple18

6.7.3 Power supply working stability18

6.7.4 Repeated power on/off 18

6.7.5 Chip temperature rise 18

6.7.6EMC testing18

6.7.7 High and low temperature cycles18

6.7.8High and low temperature start-up19

6.8Passive components19

6.8.1Capacitance testing19

6.8.1.1 Voltage accuracy and ripple19

6.8.1.2Ripple current and capacitance lifetime19

6.8.1.3Capacitor temperature rise19

6.8.1.4 crystal oscillator index 19

6.8.1.5 Lightning Strike Test 20

6.8.1.6RE CE Test 20

6.8.1.7 Eye diagrams and indicators for various interfaces20

6.8.1.8 Serial data eye diagram test 20

6.8.1.9WIFI INDICATOR 20

6.8.2Resistance test20

6.8.2.1 Voltage accuracy and ripple20

6.8.2.2RE CE test 21

6.8.2.3Eye diagrams and indicators for various interfaces21

6.8.2.4 Serial data eye diagram test 21

6.8.2.5WIFI INDICATOR 21

6.8.3Inductance and bead testing21

6.8.3.1 Voltage accuracy and ripple21

6.8.3.2 Inrush current test21

6.8.3.3RE CE Test 21

6.8.3.4Self-loop curves and connection rate tests22

6.8.3.5 Cable modem PHY测试 22

6.8.3.6WIFI INDICATOR 22

6.9Transistors and diodes22

6.9.1 Electrical stress index22

6.9.2 Temperature rise test22

6.9.3CE indicator 22

6.9.4LED color aberration 23

6.10Crystal oscillators23

6.10.1Clock signal integrity23

6.10.2Wireless frequency offset23

6.10.3RE CE Test 23

6.10.4Temperature cycling23

6.10.5 High and low temperature start-up24

6.10.6 ESD 24

6.11 transformer 24

6.11.1Ethernet signal testing24

6.11.2DSL performance testing24

6.11.3Hipot test25

6.11.4 High and low temperature cycle test25

6.11.5 Surge test 25

6.11.6Conducted immunity test25

6.11.7 Conduction disturbance test25

6.11.8Radiation disturbance test26

6.11.9EFT test26

6.11.10 Vibration test 26

6.12Protection devices26

6.12.1EMC test immunity test 26

6.12.2Self-loop curve and connection rate test26

6.13Memory27

6.13.1 Voltage accuracy and ripple27

6.13.2Bus clock27

6.13.3Power-on timing and overshoot27

6.13.4Address and control signal timing27

6.13.5Read and write signal integrity27

6.13.6 Switch on and off28

6.13.7Wireless throughput28

6.13.8 chip temperature rise 28

6.13.9 Temperature cycling28

6.13.10 High and low temperature start-up 28

6.13.11RE,EC29

6.14 Complex IC29

6.14.1Signal integrity29

6.14.2 Switch on and off29

6.14.3RF Indicator 29

6.14.4 Chip temperature rise 29

6.14.5EMC testing30

6.14.6 Temperature cycling30

6.14.7 High and low temperature start-up30

6.14.8Spurious tests30

6.15 Simple IC30

6.15.1Functional verification30

6.15.2EMC testing31

6.15.3 Temperature cycling31

6.15.4 High and low temperature start-up31

6.16Optical interface devices31

6.16.1Transmitter average transmit optical power test31

6.16.2Transmitter shutdown optical power test32

6.16.3Transmitter center wavelength test32

6.16.4Transmitter RMS Spectrum Width Test32

6.16.5Sending eye diagram tests32

6.16.6 Transmitter extinction ratio test 33

6.16.7Receiver sensitivity test33

6.16.8Receiver overload optical power test33

6.16.9DDM escalation test 33

6.16.10BEN Time Test 34

6.16.11 High and low temperature cycles34

6.16.12 High and low temperature start-up34

6.16.13 RE 34

Product description and scope of application

This specification clearly defines the test items that should be considered for different device classes in the compatible substitution test, and describes the test content and passing criteria for each test item. This test item is the upper board system test, this specification only evaluates the hardware of the replaced system board as a whole, and the device-level test or the performance of the substitute material is guaranteed by the device engineering department.

Before performing compatibility replacement testing, verify that the manufacturer has provided materials such as device manuals, application notes, and device reports. R&D needs to evaluate the device packaging, electrical parameters, compatibility, timing compatibility, etc., and only after confirming that it can be compatible and replaced, the test department arranges the board verification test. For the replacement of switching power supply, it is necessary to ensure that the switching power supply is already a TR5 product.

This specification is used to guide hardware substitution testing, and A-B BOM evaluation testing. Prototype types include PON, WiFi, ADSL and other product forms. If for OEM projects, the customer has its own hardware compatible alternative test specifications, it will be implemented according to the customer's specifications.

Enforce the standard

Ethernet interface IEEE 802.3

USB接口 USB-Spec 2.0

WLAN性能 IEEE 802.11a/b/g/n/ac

Cryogenic storage GB/T 2423.1-2008/IEC60068-2-1:2007

High Temperature Storage GB/T 2423.2-2008/IEC60068-2-2:2007

Low temperature operation GB/T 2423.1-2008/IEC60068-2-1:2007

High temperature operation GB/T 2423.2-2008/IEC60068-2-2:2007

Temperature cycle GB/T 2423.22-2012/IEC60068-2-14:2009

Constant damp heat GB/T 2423.3-2006/IEC60068-2-78:2012

Alternating damp heat GB/T 2423.4-2008/IEC60068-2-30:2005

Thermal Testing Specification for Thermal Testing of End Products_YL-WI-RD-010 Specification for Thermal Testing of Products_A3

Free Fall GB/T 2423.8-1995/ IEC60068-2-31:2008, YL-WI-RD product structure test specification _A0

Vibration test GB/T 2423.10-2008/IEC60068-2-6:2007, YL-WI-RD product structure test specification _A0

Mechanical Shock Test GB/T 2423.5-1995/IEC60068-2-27:2008, YL-WI-RD product structure test specification _A0

Radiated Disturbance Test GB 9254 / CISPR 22

Conducted harassment test GB 9254 / CISPR 22

Electrostatic immunity IEC 61000-4-2 / ITU-T K.21

Surge immunity IEC 61000-4-5 / ITU-T K.21

Conducted immunity IEC 61000-4-6

Radiated immunity IEC 61000-4-3

Fast transient pulse immunity IEC61000-4-4

AC power port voltage sag and short-term interruption IEC61000-4-11

Safety test GB 4943.1-2011 / IEC 60950-1:2005 /EN60950-1:2006 / T-PD- 452, IEC60950 safety test and design specifications

Spurious EN 300328 V1.8.1, No 353 Notice from the Ministry of Information Technology, EN 301893 V1.7.1

Test items and stress requirements

Test items

The hardware compatibility substitution test items are as follows:

Table 1 A summary of hardware compatible alternative test items

Test Scope		Test items	Level of importance	Test Category	Testing requirements	remark
Enclosure molds		Structural testing in full	高	Performance testing	Required
Enclosure molds				Temperature rise test	高	Limit tested	Required
Housing material		Vibration test	高	Performance testing	Optional
				Drop test	高	Performance testing	Required
				Ball Hit Test	高	Performance testing	Optional	There is no high pressure inside the product, and TNV-2 and TNV-3 can be unpredictable
				EMC testing	高	Performance testing	Optional	Material: Plastic/Metal Switching Changed to Required
				Temperature rise test	高	Performance testing	Required
Heat sinks		Vibration test	高	Performance testing	Optional	It is possible to expect that there is no change in the fixation method and weight
				Drop test	高	Performance testing	Optional	It is possible to expect that there is no change in the fixation method and weight
				RE test	高	Performance testing	Optional	The material and size of the radiator have not changed
				Temperature rise test	高	Performance testing	Required
				Radiation sensitivity	高	Limit tested	Optional	The heat sink is ceramic
antenna		S11	中	Performance testing	Optional	External antennas are unpredictable
antenna				OTA RvR	高	Performance testing	Required
PCB		Wireless TX indicator	高	Performance testing	Optional	Products with wireless capabilities
				RE	高	Performance testing	Required
				Temperature cycling	高	Limit tested	Optional	Test only for brand new vendors
Adapter/switching power strip		Inrush current at the DC side	高	Anomaly testing	Optional	Tested for DSL products
				Power on and off	高	Anomaly testing	Required	AC side switch
				Dying gasp	高	Performance testing	Optional	DSL product testing
				Load capacity test	高	Limit tested	Required	Refers to the ability of DC output
				ERP testing	高	Performance testing	Optional	out of European power
				EMC	高	Limit tested	Required	Only power-related items can be tested
				High and low temperature start	高	Limit tested	Required
Power supply devices		Power-up timing and overshoot	高	Anomaly testing	Optional	DC-DC and power modules need to be tested, and LDOs can be left without testing
				Voltage accuracy vs. ripple	高	Anomaly testing	Required
				Power supply working stability	高	Anomaly testing	Optional	DC-DC and power module testing
				Turn the machine on and off repeatedly	高	Anomaly testing	Required
				Chip temperature rise	高	Limit tested	Required
				EMC	高	Limit tested	Optional	DC-DC and power module testing
				Temperature cycling	高	Limit tested	Optional	The DC-DC and power modules must be tested
Passive components	Aluminum electrolytic capacitor test	Ripple current vs. capacitance life	高	Anomaly testing	Optional	Electrolytic capacitance test
				Capacitor temperature rise	高	Limit tested	Optional	Electrolytic capacitance test
				Lightning Strike Test	高	Anomaly testing	Optional	High voltage capacitance test
				RE	高	Anomaly testing	Optional	Capacitance change test at the port, capacitance change test on the signal line and CLK line
				CE	高	Anomaly testing	Optional	Capacitance change test at the port, capacitance change test on the signal line and CLK line
				WIFI metrics	高	Performance testing	Optional	ONLY FOR REPLACEMENT WIFI TX OR RX LOOP CAPACITORS
		MLCC（高Q）	Crystal oscillator indicators	中	Anomaly testing	Optional	Capacitors are used for oscillation control circuits and resonance testing
				Lightning Strike Test	高	Anomaly testing	Optional	High voltage capacitance test
				Various interface eye diagrams and indicators	高	Performance testing	Optional	Capacitance testing of interface circuits such as DSL, FXS, HDMI, ETH, etc
				Serial data eye diagram test	高	Performance testing	Optional	Capacitors are used for testing serial data when AC coupled circuits
				WIFI metrics	高	Performance testing	Optional	ONLY FOR REPLACEMENT WIFI TX OR RX LOOP CAPACITORS
		Resistance test	WIFI metrics	高	Performance testing	Optional	ONLY FOR REPLACEMENT WIFI TX OR RX LOOP RESISTORS
		Inductance and bead testing	Voltage accuracy vs. ripple	高	Anomaly testing	Optional	Inductors/beads need to be tested when filtering for power supplies
				Inrush current test	中	Anomaly testing	Optional	Inductors/beads need to be tested when filtering for power supplies
				RE	高	Anomaly testing	Optional	DC interface, power supply circuit test
				CE	高	Anomaly testing	Optional	DC interface, power supply circuit test
				Self-loop curve and connection rate test	高	Performance testing	Optional	It is suitable for testing the inductance of DSL signal loops
				Cable modem PHY测试	高	Performance testing	Optional	Suitable for cable loop inductance or bead testing
				WIFI metrics	高	Performance testing	Optional	ONLY SUITABLE FOR REPLACEMENT WIFI TX OR RX LOOP INDUCTORS
Transistors and diodes		Electrical stress indicators	高	Limit tested	Required
				Temperature rise test	高	Limit tested	Optional	Less than 50mW is not tested
				LED color aberration	中	Anomaly testing	Optional	Only available for LEDs
Crystal oscillator		Clock signal integrity	高	Anomaly testing	Required
				Wireless frequency offset	高	Anomaly testing	Optional	It is suitable for crystal oscillator testing of wireless modules
				Temperature cycling	高	Limit tested	Required
				High and low temperature start	高	Limit tested	Required
				ESD	高	Anomaly testing	Optional	Only ordinary two-pin plug-in crystal oscillators need to be tested
transformer		Ethernet signal testing	高	Performance testing	Optional	Suitable for Ethernet transformer testing
				DSL performance testing	高	Performance testing	Optional	Suitable for DSL transformer testing
				Hipot test	高	Safety testing	Optional	The network transformer must be tested, and the power transformer and signal transformer can not be tested
				High and low temperature cycle test	高	Limit tested	Optional	The signal transformer can be left untested
				Surge test	高	Anomaly testing	Required
				Conducted immunity test	高	Anomaly testing	Optional	The network transformer must be tested, and the power transformer and signal transformer can not be tested
				Conduction harassment test	高	Anomaly testing	Optional	The network transformer must be tested, and the power transformer and signal transformer can not be tested
				Radiation disturbance test	高	Anomaly testing	Optional	The network transformer must be tested, and the power transformer and signal transformer can not be tested
				EFT test	高	Anomaly testing	Optional	The network transformer must be tested, and the power transformer and signal transformer can not be tested
				Vibration test	高	Anomaly testing	Required	Verify the transformer robustness process
Protect the device		Lightning Strike Test	高	Anomaly testing	Required
				Power line testing	高	Anomaly testing	Required
				ESD testing	高	Anomaly testing	Optional	ESD devices must be tested
				Self-loop curve and connection rate test	高	Performance testing	Optional	Gas discharge tube replacement can not be tested (small parasitic capacitance)
memorizer		Voltage accuracy vs. ripple	中	Anomaly testing	Optional	DDR needs to be tested, and FLASH is not tested.
				Bus clock	高	Anomaly testing	Required
				Power-up timing and overshoot	中	Anomaly testing	Optional	Overshoot is tested only, power-up timing can be left untested (device timing only).
				Address and control signal timing	中	Anomaly testing	Required
				Read and write signal integrity	高	Anomaly testing	Required
				Power on and off	高	Anomaly testing	Optional	DDR must be tested
				Wireless throughput	高	Performance testing	Optional	When replacing RAM, products with wireless need to be tested.
				Spurious	高	Anomaly testing	Optional	DDR needs to be tested, and FLASH is not tested.
				Chip temperature rise	高	Limit tested	Optional	ROM can not be tested, RAM if the specifications are large differences, the test will be tested.
				Temperature cycling	高	Limit tested	Optional	Test when replacing RAM.
				High and low temperature start	高	Limit tested	Required
				RE	高	Anomaly testing	Optional	NAND FALSH is unpredictable
				CE	高	Anomaly testing	Optional	NAND FALSH is unpredictable
Complex ICs		Signal integrity	高	Anomaly testing	Required
				Power on and off	高	Anomaly testing	Required
				RF metrics	高	Performance testing	Optional	Wireless IC substitution needs to be tested
				Chip temperature rise	高	Limit tested	Required
				EMC testing	高	Anomaly testing	Required
				Temperature cycling	高	Limit tested	Required
				High and low temperature start	高	Limit tested	Required
				Spurious	高	Anomaly testing	Optional	Wireless IC substitution needs to be tested
Simple IC		Functional validation	高	Anomaly testing	Required
				EMC testing	高	Anomaly testing	Optional	Signals between boards or external signals to the system need to be tested
				Temperature cycling	高	Limit tested	Required
				High and low temperature start	高	Limit tested	Required
Optical interface devices		Average light power sent	高	Performance testing	Required
				Turn off the optical power	高	Performance testing	Required
				Transmit center wavelength test	高	Performance testing	Required
				RMS spectral width test	高	Performance testing	Required
		存储器		Eye diagram test	中	Performance testing	Required
				Extinction ratio test	高	Performance testing	Required
				Receive sensitivity test	中	Performance testing	Required
				Overload optical power test	中	Performance testing	Required
				DDM reports the test	高	Performance testing	Required
				BEN time test	高	Performance testing	Optional	Applicable to optical transceivers
				High and low temperature cycles	高	Limit tested	Required
				High and low temperature start	高	Limit tested	Optional	The inductance of the VCC power supply circuit of the optical module (or BOSA) must be tested in series, such as magnetic beads or jumpers.
				RE	高	Anomaly testing	Required

DUT quantity requirements

R&D needs to provide 2 sets of test prototypes, one of which is a substitute prototype and the other is an unreplaced prototype.

Test output

The test methods and test data of each test are output in the form of test reports.

Explanation of terms

EMC (Electromagnetic Compatibility)：电磁兼容

CE (Conducted Emissions)：传导骚扰

RE (Radiated Emissions)：辐射骚扰

S11: Input reflection coefficient, i.e. input return loss

ESD(Electro-Static discharge)：静电释放

ERP (Energy-related Products): The energy efficiency certification part of CE certification

Test the configuration

Test equipment and instruments

In the test, in addition to the test prototype, supporting power supply, shell, supporting software, some auxiliary tester tables are also needed, such as PC, switch, oscilloscope, power meter, voltage regulator, data acquisition instrument, electronic load, data analyzer, IQ, shielding box, environmental test chamber, etc.

Compatible with alternative test items

Enclosure molds

Structural testing in full

Cropping principle: no cropping

Test description: Refer to the _A0 of YL-WI-RD product structure test specification.

Expected results: Refer to the _A0 of the YL-WI-RD product structure test specification.

Temperature rise test

Cropping principle: no cropping

Test description: Select the test point, use the thermocouple channel of the data acquisition instrument to arrange the points, run the board under the specified ambient temperature and full load conditions in the windless environment, and record the temperature of each test point after stabilization.

Expected Results: Meet product requirements specifications and device temperature ramp requirements.

Housing material

Vibration test

Cropping principle: no cropping

Test description: Refer to the _A0 of YL-WI-RD product structure test specification.

Expected results: Refer to the _A0 of the YL-WI-RD product structure test specification.

Drop test

Cropping principle: no cropping

Test description: Refer to the _A0 of YL-WI-RD product structure test specification.

Expected results: Refer to the _A0 of the YL-WI-RD product structure test specification.

Ball Hit Test

Cutting principle: If there is no high pressure inside the product, TNV-2 and TNV-3 can be unpredictable

Test description: Refer to the _A0 of YL-WI-RD product structure test specification.

Expected results: Refer to the _A0 of the YL-WI-RD product structure test specification.

EMC testing

Cropping principle: can be cropped.

Test description: The shell material must be tested when switching between plastic and metal

Expected Result: Meets the requirements of GB 9254 / CISPR 22,24.

Temperature rise test

Cropping principle: no cropping

Expected Results: Meet product requirements specifications and device temperature ramp requirements.

Heat sinks

Vibration test

Cropping principle: can be cropped

Test description: When there is no change in fixation method and weight, it can be measured, refer to W-PD-464 product structure test specification.

Expected results: Refer to the _A0 of the YL-WI-RD product structure test specification.

Drop test

Cropping principle: can be cropped

Test description: When there is no change in fixation method and weight, it can be measured, refer to W-PD-464 product structure test specification.

Expected results: Refer to the _A0 of the YL-WI-RD product structure test specification.

RE test

Cropping principle: can be cropped.

Test description: place the test sample in the position specified in the standard on the test table in the anechoic room, power on the test sample, verify whether it can be started normally, whether the service configuration is normal, whether the two-way service is normal, the same kind of network port needs to have more than two work, the other is replaced by a network load, allowing two FXS interfaces to call each other, if there is only one FXS interface, you can use a PC analog telephone to dial;

Expected results: Meet the limit requirements of "Home Gateway Product Reliability Test Specification" and "Power Product Reliability Test Specification".

Temperature rise test

Cropping principle: no cropping

Expected Results: Meet product requirements specifications and device temperature ramp requirements.

Radiation sensitivity

Cutting principle: can be cut, if the heat sink is ceramic

Test description: In wireless 11b/11a mode, the radiation sensitivity value of the lowest rate mode of wireless all-channel is tested.

Expected Result: Meet product design requirements.

antenna

S11

Cropping principle: the external antenna can be unpredictable

Test description: Test the S11 parameters in the WLAN operating frequency band.

Expected results: <-10dB.

Wireless throughput

Cropping principle: no cropping

Test description: Verify that the low, medium and high channels meet the design requirements for wireless throughput in the highest rate mode.

Expected Result: Meet product design requirements.

Indoor coverage

Cropping principle: no cropping

Test description: Comparison of indoor coverage tests before and after substitution.

Expected Result: Coverage performance does not degrade after override.

RE test

Cropping principle: can be cropped, test when the antenna form changes.

Expected results: Meet the limit requirements of "Home Gateway Product Reliability Test Specification" and "Power Product Reliability Test Specification".

ESD

Cropping principle: it can be cropped, and the antenna material is tested when it is changed.

Test description: Perform ESD test according to the requirements of EMC test specifications.

Expected Result: Meets EMC Test Specification limits.

PCB

Wireless TX indicator

Cutting principle: can be cut, with wireless products need to be tested

Test description: In the wireless maximum rate mode, test the wireless all-channel TX indicators (transmit power, EVM, frequency offset, MASK, and flatness).

Expected Result: Meet product design requirements.

Radiation sensitivity

Cutting principle: can be cut, with wireless products need to be tested

Test description: In wireless 11b/11a mode, the radiation sensitivity value of the lowest rate mode of wireless all-channel is tested.

Expected Result: Meet product design requirements.

RE test

Cropping principle: no cropping.

Expected results: Meet the limit requirements of "Home Gateway Product Reliability Test Specification" and "Power Product Reliability Test Specification".

CE test

Cropping principle: no cropping.

Expected results: Meet the limit requirements of "Home Gateway Product Reliability Test Specification" and "Power Product Reliability Test Specification".

Temperature cycling

Cropping principle: no cropping.

Test description: The board can work normally under full load conditions and at room temperature. Set the temperature of the test chamber to -10°C~+55°C (refer to the product specification definition, at least 10°C), keep it for 3 hours, cycle twice, and record the link indicators during the entire board operation.

Expected results: meet the requirements of the "End Product Environmental (Climate) Test Specification", and there can be no abnormal phenomena in the test; The wireless throughput is stable and there is no abnormal sudden drop; DSL uplink and downlink, WAN-LAN, LAN-LAN uplink and downlink packet loss meet the requirements.

Adapter/switching power strip

AC Pull Bias, Voltage Accuracy, and Voltage Ripple

Cropping principle: no cropping

Test description: Under the condition of full load of the board, use the AC voltage regulator to adjust the output voltage to ±10% of the limit value or rated value specified in the product (such as AC90V, AC264V), so that the board can run for at least half an hour, and use an oscilloscope to test the maximum and minimum output voltage of the output terminal of the adapter and each power chip or module in this state.

Expected result: After the deviation is pulled to the required value, the output voltage of each power supply meets the requirements of each chip without depression.

Inrush current at the DC side

Cropping principle: no cropping.

Test description: When the board is fully loaded, use an oscilloscope current probe (the probe needs to be zeroed when the probe is powered off) to test the peak-to-peak value of the power-on impulse current at the input of the board.

Expected results: The power-on impulse current meets the requirements of the power chip Datasheet and the adapter (for example, the adapter input is 100~120V, the peak-to-peak value is not more than 30A, and the adapter input is 200~240V, and the peak-to-peak value is not more than 60A).

Power on and off

Cropping principle: no cropping.

Test description: Under the condition of full load of the board, the power switch button (switch button of the board, power socket button, plugging and unplugging the input of the adapter, and plugging and unplugging the output of the adapter) is used to power on and off the board, and each mode is tested 5 times. Perform a fast on/off test on the switch button of the single board (turn on the machine immediately after powering off, if the PLC product does not have a switch button, it is necessary to quickly turn on and off the plug bar in), and test it 5 times.

Expected result: The service of the board is normal every time the machine is turned on and on.

Power consumption of the whole machine

Cropping principle: no cropping.

Test description: Use an oscilloscope to test the power consumption of the AC side of the board under no-load and full-load conditions, and use a power meter or AC source to read the power consumption value of the AC side of the board. At the same time, the relevant power consumption is tested according to the product delivery region, such as COC, CQC, Energy Star, etc.

Expected results: meet the power consumption requirements of the product requirements specification, and related regulatory requirements;

Connection rate test

Cropping principle: It can be cropped, only applicable to DSL products.

Test Description: Test the DSL connection rate.

Expected results: The self-loop curve meets the noise floor requirements, and the DSL loop test meets the relevant standards.

Dying gasp测试

Cropping principle: It can be cropped, only applicable to DSL and PON products.

Test description: Power off from the adapter to test the dying gasp function of the DSL port.

Expected result: Power off more than 3 times, and the abnormal power-off information of DUT can be read on the DSLAM and OLT terminals each time.

Load capacity test

Cropping principle: no cropping

Test description: DUT various full-load limit conditions, such as off-hook when VOIP ringing, wireless long hair pack mode, etc.

Expected results: DUT can be loaded normally under various full load limits.

Safety input test

Cropping principle: no cropping.

Test description: Refer to IEC 60950-1/GB 4943-1:2011 input test requirements

Expected results: Input test judgment with reference to IEC 60950-1/GB 4943-1:2011

Leakage current test

Cropping principle: no cropping.

Test description: Refer to IEC 60950-1/GB 4943-1:2011 leakage current test requirements

Expected results: Determined by reference to IEC 60950-1/GB 4943-1:2011 leakage current test

Hipot test

Cropping principle: no cropping.

Test description: Refer to IEC 60950-1/GB 4943-1:2011 hipot test requirements

Expected results: Determined by reference to IEC 60950-1/GB 4943-1:2011 withstand voltage test

ERP testing

Cutting principle: can be cut, out of Europe products need to be evaluated.

Test Description:

Shutdown or standby mode:

First of all, confirm the laboratory test environment, the wind speed should be less than or equal to 0.5m/s, and the temperature should be 23±5°C;

Selected test voltage and frequency: 230V/50Hz;

Take a product, input and connect the above voltage, so that the product enters shutdown or automatically enters standby mode, heats up for half an hour, and records the input power in this state after half an hour;

Set the power meter to the integration function to test the loss W1 (mwh) in half an hour;

Repeat step 4 to test the loss of W2 (mwh) in half an hour;

The stability of the loss is calculated: (—W1-W2—) MWH /1H2

Network Standby Mode:

First of all, confirm the laboratory test environment, the wind speed should be less than or equal to 0.5m/s, and the temperature should be 23±5°C;

Selected test voltage and frequency: 230V/50Hz;

Take a product, the input is connected to the above voltage, so that all the functional interfaces are connected, but there is no need to simulate the data transmission between the functions (up and downstream), and the input power in this state is recorded after half an hour of heating up and half an hour. If the power exceeds 12W, it is allowed to measure the loss of each function or each port (choose one uplink and downlink, and no analog data transmission is required);

Set the power meter to the integration function to test the loss W1 (mwh) in half an hour;

Repeat step 4 to test the loss W2 (mwh) within half an hour;

The stability of the loss is calculated: (—W1-W2—) MWH /1H2

Expected Results:

The input power of the product cannot exceed 0.5W in shutdown or standby mode

The input power cannot exceed 12W in network standby mode (between January 1, 2015 and January 1, 2017)

The input power cannot exceed 8W in network standby mode (after January 1, 2017)

2. Loss stability should not exceed 10 MW/h.

EMC

Cropping principle: no cropping.

Test description: Place the test sample in the standard position on the test table in the anechoic room, power on the test sample, and verify whether it can be started normally, whether the service configuration is normal, and whether the two-way service is normal

Expected Result: Meets the requirements of GB 9254 / CISPR 22,24.

Temperature cycling

Cropping principle: no cropping.

High and low temperature deviation starting

Cropping principle: no cropping.

Test description: Under the condition of full load of the board, set the temperature of the test chamber to -10°C/55°C (at least 10°C should be tightened according to the product specification definition), use the AC voltage regulator to set the input voltage of the board to 90Vac, 220Vac and 264Vac, and maintain the temperature of each voltage for more than 2 hours before powering on, and then start at least 5 times respectively (each start requires 10 minutes before turning on the machine).

Expected results: Meet the requirements of the T-PD-029 Environmental (Climate) Test Specification for Terminal Products, and the board can be restored to the state before power-down every time it is started.

Power supply devices

Power devices include LDO, DC-DC and power modules.

Power-up timing and overshoot

Tailoring principle: For DC-DC and power modules that need to be tested, LDO can be exempted from testing.

Test description: Select the test point, use an oscilloscope to measure each chip on the board, test the voltage sequence during the power-up process, save the waveform, and pay attention to the maximum and minimum values of the voltage (overshoot) during the power-up process.

Expected result: Meet the requirements of the power-on sequence and overshoot of the chip datasheet.

Voltage accuracy vs. ripple

Cropping principle: no cropping.

Test description: Under the condition that the board is fully loaded, select the test point, set the oscilloscope to 20M bandwidth, and test the maximum, minimum, average, peak-to-peak (ripple) output of the chip pin or module.

Expected result: The voltage range meets the requirements of the chip datasheet, and the ripple is less than or equal to 5% of the voltage value.

Power supply working stability

Cutting principle: can be cut, DC-DC and power modules need to be tested.

Test description: Use an oscilloscope to test the switching waveform and output current output of the power chip under the condition that the board is fully loaded.

Expected results: meet the requirements of the chip Datasheet, no drastic changes in the current pulse width, and no large burrs in the driving voltage.

Turn the machine on and off repeatedly

Cropping principle: no cropping.

Test description: Repeatedly turn on and off the machine 10 times, the shutdown time is 1 second, and the boot time is about 3 minutes.

Passing Criteria: During the test, the board works properly.

Chip temperature rise

Cropping principle: no cropping

Expected Result: Meet the requirements of the product requirements specification and chip datasheet.

EMC testing

Clipping principle: For DC-DC and power modules, switching noise may affect the radiated and conducted emissions of the board, and it is necessary to test them.

Test description: In the EMC laboratory, the board is in normal working condition, and the corresponding EMC indicators are tested.

Passing criteria: Compare with the results of the mapping test before substitution, and the indicators should meet the design requirements.

High and low temperature cycles

Cropping principle: can be cropped.

Test description: The board can work normally under full load conditions and at room temperature. Set the temperature of the test chamber to -10°C~+55°C, keep it for 3 hours, cycle 2 times, and record the link indicators during the entire board operation.

Expected results: meet the requirements of the "End Product Environmental (Climate) Test Specification", and there can be no abnormal phenomena in the test; The wireless throughput is greater than 80% of the operating throughput at room temperature; There is no packet loss in the uplink and downlink from WAN to LAN and LAN to LAN.

High and low temperature start

Cropping principle: no cropping.

Expected results: Meet the requirements of the "Environmental (Climate) Test Specifications for End Products", and the board can be restored to the state before power failure every time it is started.

Passive components

Passive components include resistors, capacitors, inductors, beads, etc

Capacitance test

Voltage accuracy vs. ripple

Clipping principle: It can be cropped, and this item needs to be tested only when it is used for power filtering and decoupling.

Expected result: The voltage range meets the requirements of the chip datasheet, and the ripple is less than or equal to 5% of the voltage value.

Ripple current vs. capacitance life

Cutting principle: can be cut, electrolytic capacitors must be tested.

Test description: Under full load conditions, the board uses an oscilloscope current probe to test the ripple current of the electrolytic capacitor, and then calculates the capacitance specifications such as capacitor thermal test data, ripple current, and voltage.

Expected results: The ripple current meets the requirements of capacitance derating, and the capacitor life meets the product design specifications.

Capacitor temperature rise

Cutting principle: can be cut, electrolytic capacitors must be tested.

Expected result: Meets the capacitor temperature rise requirements.

Crystal oscillator indicators

Cropping principle: It can be cropped, and it is only used when the capacitor is used in the oscillation control circuit and resonance, and this item needs to be tested. For RF circuits, RF wireless offset indicators need to be tested.

Test description: Select the test point, use the oscilloscope to test the crystal (crystal oscillator) output clock signal, and record the clock frequency, period, amplitude, rise and fall time, positive and negative pulse width, duty cycle, etc.

Expected Result: Meet the chip datasheet clock output requirements.

Lightning Strike Test

Cutting principle: It can be cut and is suitable for high-voltage capacitance testing

Test description: Test K21 lightning protection indicators

Expected result: meet the requirements of product lightning protection technical indicators

RE CE test

Cutting principle: can be cut, capacitance change at the port, capacitance change test on the signal line and CLK line.

Expected results: Meet the limit requirements of "Home Gateway Product Reliability Test Specification" and "Power Product Reliability Test Specification".

Various interface eye diagrams and indicators

Cutting principle: It can be trimmed, and it is suitable for capacitance testing of interface circuits such as DSL, FXS, HDMI, ETH, etc

Test description: Test indicators such as eye diagram or connection rate of various interfaces.

Expected results: Meet the relevant indicators of various interfaces.

Serial data eye diagram test

Clipping principle: It can be trimmed, only when the capacitor is used in serial data AC coupling circuit, this project needs to be tested, the application circuit is mainly AC coupling circuit of high-speed serial differential signal, such as Serdes, PCIE interface circuit and CML and LVPECL level conversion circuit.

Test Description: Measurement of signal eye diagrams.

Expected Result: The eye diagram after coupling capacitance meets the interface data template requirements.

WIFI metrics

Cropping principle: It can be cropped, and it is only suitable for replacing the capacitance on the WIFI TX or RX circuit.

Test Description: TX or RX indicator

Expected Result: Meets the requirements of the specification or IEEE protocol after substitution.

Resistance test

Voltage accuracy vs. ripple

Cropping principle: can be cropped, the resistor is used for DC-DC feedback resistor.

Expected result: The voltage range meets the requirements of the chip datasheet, and the ripple is less than or equal to 5% of the voltage value.

RE CE test

Cutting principle: It can be cut, the resistance of the power module circuit is changed, and the resistance change of the signal line and CLK line needs to be tested.

Expected results: Meet the limit requirements of "Home Gateway Product Reliability Test Specification" and "Power Product Reliability Test Specification".

Various interface eye diagrams and indicators

Cutting principle: It can be trimmed, and it is suitable for resistance testing of interface circuits such as DSL, FXS, HDMI, ETH, etc

Test description: Test indicators such as eye diagram or connection rate of various interfaces.

Expected results: Meet the relevant indicators of various interfaces.

Serial data eye diagram test

Cropping principle: It can be trimmed, and it needs to be tested when the resistor is used for serial data such as USB and PCIE.

Test Description: Measurement of signal eye diagrams.

Expected Result: The eye diagram indicator after matching the resistor meets the requirements of the interface data template.

WIFI metrics

Cropping principle: It can be cropped, and it is only suitable for replacing the resistor on the WIFI TX or RX circuit.

Test Description: TX or RX indicator

Expected Result: Meets the requirements of the specification or IEEE protocol after substitution.

Inductance and bead testing

Voltage accuracy vs. ripple

Cropping principle: It can be cropped, and it is only suitable for testing when the inductor/bead is used as a power supply filter.

Expected result: The voltage range meets the requirements of the chip datasheet, and the ripple is less than or equal to 5% of the voltage value.

Inrush current test

Cropping principle: It can be cropped, and it is only suitable for testing when the inductor/bead is used as a power supply filter.

Test description: When the board is fully loaded, use an oscilloscope current probe (the probe needs to be zeroed when the probe is powered off) to test the peak value of the power-on impulse current at the inductor output of the board.

Expected Result: The power-up impulse current meets the requirements of the power chip Datasheet and inductor derating.

RE CE test

Cutting principle: can be cut, DC interface, power supply circuit needs to be tested.

Expected results: Meet the limit requirements of "Home Gateway Product Reliability Test Specification" and "Power Product Reliability Test Specification".

Self-loop curve and connection rate test

Cropping principle: It can be cropped, and only the inductance of the DSL signal loop is applicable.

Test Description: Test the self-loop curve and DSL connection rate.

Expected results: The self-loop curve meets the noise floor requirements, and the DSL loop test meets the relevant standards. After substitution, the indicator cannot be lowered.

Cable modem PHY测试

Cutting principle: It can be cut, and only the inductors and magnetic beads of the cable branch are applicable.

Test Description: Test all PHY parameters of the cable.

Expected Result: Meets the PHY standard requirements for cable.

WIFI metrics

Cropping principle: It can be cropped, and it is only suitable for replacing the inductance on the WIFI TX or RX circuit.

Test Description: TX or RX indicator

Expected Result: Meets the requirements of the specification or IEEE protocol after substitution.

Transistors and diodes

It mainly includes field effect transistors, transistors, diodes, and MOS transistors

Electrical stress indicators

Cropping principle: no cropping

Test description: Test the electrical stress index of each transistor and diode under the condition of full load of the board.

Expected Result: The electrical stress will meet the device specifications.

Temperature rise test

Clipping principle: Cropping can be done when the computing power consumption is less than 50mW

Expected Results: Meet product requirements specifications and device temperature ramp requirements.

CE indicator

Cropping principle: It can be trimmed when the peak current is less than 10mA

Test description: Under the condition of full load of the board, the conducted emission index is tested.

Expected results: Meet the limit requirements of "Home Gateway Product Reliability Test Specification" and "Power Product Reliability Test Specification".

LED color aberration

It is not recommended to substitute when the customer has strict requirements for color difference, and different manufacturers and different Bin code materials cannot be mixed when they must be replaced.

Cropping principle: can be cropped, only for LEDs.

Test description: Compare and test the working current, color difference and consistency at room temperature, at least 20pcs.

Passing criteria: There is no obvious difference in working current, color difference and consistency before and after substitution.

Crystal oscillator

Crystal oscillators include temperature-compensated crystal oscillators, ordinary crystal oscillators, voltage-controlled crystal oscillators, etc

Clock signal integrity

Cropping principle: no cropping

Test description: Select the test point, use the oscilloscope to test the crystal (crystal oscillator) output clock signal, record the clock frequency, cycle, minimum voltage, maximum voltage, amplitude, rise and fall time, positive and negative pulse width, duty cycle, monotonicity, jitter, and the differential clock needs to test the crosspoint voltage.

Expected Result: Meet the chip datasheet clock output requirements.

Wireless frequency offset

Tailoring principle: It can be cropped, which is only suitable for the crystal oscillator test of wireless modules.

Test description: test the frequency offset index of each mode of wireless (when testing the frequency of the crystal, use the spectrum analyzer and coil probe to test the test error caused by the capacitance of the oscilloscope probe).

Expected results: Meets the requirements of IEEE802.11b/g/a/n/ac protocol.

RE CE test

Cutting principle: no cropping (usually whether it is a crystal or a crystal oscillator, the working current is not large, and CE can be cut off).

Expected results: Meet the limit requirements of "Home Gateway Product Reliability Test Specification" and "Power Product Reliability Test Specification".

Temperature cycling

Cropping principle: can be cropped.

Test description: The board can work normally under full load conditions and at room temperature. Set the temperature of the test chamber to -10°C~+55°C (refer to the product specification definition, at least 10°C), keep it for 3 hours, cycle once, and record the link indicators during the entire board operation.

High and low temperature start

Cropping principle: no cropping.

ESD

Cutting principle: can be cut, ordinary two-PIN plug-in crystal must be tested.

Test description: Perform ESD test according to the requirements of EMC test specifications.

Expected Result: Meets EMC Test Specification limits.

transformer

It is divided into two kinds, the first is the power transformer, the second is the signal transformer, mainly Ethernet transformer and DSL transformer, etc., the test here is mainly for the signal transformer.

Ethernet signal testing

Cropping principle: can be cropped, only suitable for Ethernet transformer testing.

Test description: In gigabit mode, use the preset Ethernet interface test template of the oscilloscope to test mode 1, mode 2, mode 3 and mode 4 of four channels (CH1~CH4). In 100 Gigabit mode, use the oscilloscope's preset Ethernet interface test template to test eye diagrams, duty cycles, jitter, rise/fall times, and amplitude.

Expected Results: Meets the IEEE 802.3 specification for Ethernet.

DSL performance testing

Cropping principle: can be cropped, only suitable for DSL transformer test.

Test Description:

Self-loop curve test (for scenarios with test tools):

The test results of the self-loop curve meet the requirements.

The data of the main material and the substitute material are compared, and the index cannot be reduced.

DSL Loop Performance Test (TR100)

DSL loop test meets TR67/TR100/WT114 (VDSL) requirements

Compared with the data of the main material and the substitute material, the index cannot be reduced.

DSL-to-LAN throughput test

The stability of throughput is tested under high and low temperature (-10°C~55°C) cycling conditions

Expected Results: All of the above tests meet the requirements.

Hipot test

Cutting principle: DSL transformers can be trimmed, power transformers and network transformers cannot be cut.

Test description: Refer to IEC 60950-1/GB 4943-1:2011 hipot test requirements

Expected results: Determined by reference to IEC 60950-1/GB 4943-1:2011 withstand voltage test

High and low temperature cycle test

Cropping principle: can be cropped. The influence of high and low temperature on the signal transformer is small, and the following test content is for the signal transformer, so it can be trimmed.

Expected results: meet the requirements of the "End Product Environmental (Climate) Test Specification", and there can be no abnormal phenomena in the test; The wireless throughput is greater than 80% of the operating throughput at room temperature; There is no packet loss in the uplink and downlink from WAN to LAN and LAN to LAN.

Surge test

Cropping principle: no cropping.

Test description: The test sample is placed on the surge test table, and the test sample is powered on to verify whether the device can be started normally, whether the service configuration is normal, and whether the two-way service is normal. The equipment is powered on, and each port is tested for anti-surge interference;

Expected Result: Signal port (LAN\WAN\FXS\FXO\DSL): The service on the non-test port is running normally, and the performance is allowed to be degraded and not interrupted.

Conducted immunity test

Cropping principle: can be cropped, only applicable to Ethernet transformers.

Test description: The test sample is placed at the specified position on the test table, the test sample is powered on, and the test sample is verified to be able to start normally, whether the service configuration is normal, and whether the two-way service is normal, and the corresponding two-way traffic is configured for the port of the device through the sending device, which shall not be less than 80% of the maximum flow ； The equipment is powered on, and the AC power port and signal port (LAN\WAN\FXS\FXO\DSL) of the equipment are tested for conduction immunity.

Expected results: Meet the limit requirements of the "Home Gateway Product Reliability Test Specification" and "Power Supply Product Reliability Test Specification", no packet loss is allowed, and no performance degradation is allowed.

Conduction harassment test

Cropping principle: can be cropped, only applicable to Ethernet transformers.

Test description: The test platform is built in accordance with the requirements of GB 9254, the whole business of the tested equipment is running normally, and the network port runs the traffic;

Test the conducted nuisance value of the AC power supply\LAN\WAN\FXS\FXO\DSL ports.

Expected results: Meet the limit requirements of "Home Gateway Product Reliability Test Specification" and "Power Product Reliability Test Specification".

Radiation disturbance test

Cropping principle: can be cropped, only applicable to Ethernet transformers.

Test description: place the test sample in the position specified in the standard on the test table in the anechoic room, power on the test sample, verify whether it can be started normally, whether the service configuration is normal, whether the two-way service is normal, each of the same kind of network port only needs to run a single, allowing two FXS interfaces to call each other, if there is only one FXS interface, you can use the PC analog telephone to dial;

Expected results: Meet the limit requirements of "Home Gateway Product Reliability Test Specification" and "Power Product Reliability Test Specification".

EFT test

Cropping principle: can be cropped, only applicable to Ethernet transformers.

Test description: The test sample is placed in the position specified in the standard on the test table; Power on the sample to verify whether the device can be started normally, whether the service configuration is normal, and whether the bidirectional service is normal. The over-current device configures the corresponding two-way traffic for the port of the device, which shall not be less than 80% of the maximum traffic; The equipment is powered on, and the AC power supply port and signal port are tested for anti-electric fast transient pulse group interference.

Expected results: Meet the limits of the Home Gateway Product Reliability Test Specification and the Power Supply Product Reliability Test Specification, tolerate packet loss, allow service performance degradation, and do not allow service interruption.

Vibration test

Cropping principle: can be cropped. (Device cell testing needs to include vibration).

Test description: In accordance with GB/T 2423.10-2008/IEC60068-2-6:2007, W-PD-464 product structure test specification

Vibration test of the device, no less than 10 samples.

Passing criteria: no deformation or damage to the appearance after the test, no loosening, no broken wire and other abnormal phenomena of the coil.

Note: Due to the pressure of costdown, in order to save costs, some manufacturers use coils that are not fixed without glue, or the fixation is not sufficient and stable, resulting in the disconnection of the transformer after transportation.

Protect the device

It is roughly divided into two types, the first is the air discharge tube used in the 48V power supply and the Ethernet signal line, and the second is the anti-static TVS tube on the signal interface, because it is difficult to inject static electricity into the signal line, so it cannot be verified by experiments.

EMC test immunity test

Cropping principle: no cropping.

Test Description: Reliability Test Specification Lightning, Power Line, ESD Immunity Test.

Expected results: Meet the limit requirements of "Home Gateway Product Reliability Test Specification" and "Power Product Reliability Test Specification".

Self-loop curve and connection rate test

Cropping principle: It can be cropped, and it is suitable for DSL loop application circuit, DSL loop TVS tube or anti-detonator test.

Test Description: Test the self-loop curve and DSL connection rate.

Expected results: The self-loop curve meets the noise floor requirements, and the DSL loop test meets the relevant standards. After substitution, the indicator cannot be lowered.

memorizer

Memory includes ROM, RAM, FLASH, EEPROM and other devices

Voltage accuracy vs. ripple

Cropping principle: can be cropped.

Expected result: The voltage range meets the requirements of the chip datasheet, and the ripple is less than or equal to 5% of the voltage value.

Bus clock

Cropping principle: no cropping.

Test description: Select the test point, use the oscilloscope to test the bus clock signal, record the clock frequency, period, amplitude, rise and fall time, minimum and maximum voltage, positive and negative pulse width, duty cycle, monotonicity, jitter, etc.

Expected Result: Meet the chip datasheet clock output requirements.

Power-up timing and overshoot

Cropping principle: can be cropped. Only overshoot is tested, and the power-on timing can not be measured.

Added: Environmental test, DDR replacement needs to add low temperature start-up and high and low temperature cycle test.

Expected result: Meet the requirements of the power-on sequence and overshoot of the chip datasheet.

Address and control signal timing

Cropping principle: no cropping.

Test description: Select a test point, and test the address and timing of the control signal, including the settling time and holding time, when the board is powered on and running normally.

Expected Result: Meets the requirements of the chip datasheet.

Read and write signal integrity

Cropping principle: no cropping.

Test description: Select a test point and test the integrity of the read/write signal and the read/write timing, including at least amplitude, overshoot, slope, high and low levels, and set-up hold time when the board is powered on and runs normally after the board is powered on.

Expected Result: Meets the requirements of the chip datasheet.

Power on and off

Cropping principle: no cropping.

Expected result: The service of the board is normal every time the machine is turned on and on.

Wireless throughput

Cutting principle: It can be cut, and when replacing RAM, it needs to be tested with wireless products.

Test description: The board is configured in unencrypted, auto-channel, and maximum rate mode, and uses a wireless network card and a PC to test the Chariot throughput of WLAN-LAN in a shielded box or shielded room.

Expected Result: The substitution indicator does not fall.

Chip temperature rise

Cropping principle: can be cropped, ROM can not be measured, RAM if the specifications are large differences, then test.

Expected Result: Meet the requirements of the product requirements specification and chip datasheet.

Temperature cycling

Cropping principle: It can be cropped, and it needs to be tested when replacing RAM.

Expected results: meet the requirements of the "T-PD-029 Environmental (Climate) Test Specification for Terminal Products", and no abnormal phenomena can occur during the test; The wireless throughput is stable and there is no abnormal sudden drop; DSL uplink and downlink, WAN-LAN, LAN-LAN uplink and downlink packet loss meet the requirements.

High and low temperature start

Cropping principle: no cropping.

RE,CE

Cropping principle: can be cropped, NAND FLASH can be unpredictable.

Test description: place the test sample in the position specified in the standard on the test table in the anechoic room, power on the test sample, verify whether it can be started normally, whether the service configuration is normal, whether the two-way service is normal, each of the same kind of network port only needs to run a single, allowing two FXS interfaces to call each other, if there is only one FXS interface, you can use the PC analog telephone to dial;

Expected results: Meet the limit requirements of "Home Gateway Product Reliability Test Specification" and "Power Product Reliability Test Specification".

Complex ICs

Complex IC mainly refers to chips with complex functions, some also need to load programs, such as PHY chips, wireless chips, special DSP chips, etc., such chips usually have a larger package, larger heat dissipation, and a higher signal speed for processing, and some also need to load programs before running.

Signal integrity

Cropping principle: no cropping.

Test description: Test the signal integrity according to the chip datasheet, including power-on timing and overshoot, level size, read/write timing, monotonicity and other indicators.

Expected results: meet the requirements of the datasheet, and if there is a signal connection with other chips, also meet the interface requirements of the docking chip.

Power on and off

Cropping principle: no cropping.

Expected result: The service of the board is normal every time the machine is turned on and on.

RF metrics

Cropping principle: can be cropped, only suitable for wireless chip substitution test.

Test description: Test wireless TX and RX indicators and wireless throughput.

Expected Result: Meet the product design specifications and meet the requirements of IEEE802.11b/g/a/n/ac.

Chip temperature rise

Cropping principle: no cropping

Expected Result: Meet the requirements of the product requirements specification and chip datasheet.

EMC testing

Cropping principle: no cropping.

Test description: Do anti-disturbance test according to EMC test requirements.

Expected results: Meet the limit requirements of "Home Gateway Product Reliability Test Specification" and "Power Product Reliability Test Specification".

Temperature cycling

Cropping principle: no cropping.

High and low temperature start

Cropping principle: no cropping.

Spurious test

Cropping principle: can be cropped, only suitable for wireless chip substitution test.

Test description: Do anti-disturbance test according to RF test requirements.

Expected results: Meet the limit requirements of "Home Gateway Product Reliability Test Specification" and "Power Product Reliability Test Specification".

Simple IC

Simple IC mainly refers to chips with relatively simple functions, such as filters, serial port chips, FEM, USB HUB chips, and reset chips, which are usually packaged in smaller packages, dissipate less heat, and do not need to load programs before running.

Functional validation

Cropping principle: no cropping.

Test description: According to the simple IC in the functional module selection test, such as serial port chip, then choose to test whether the serial port is effective, such as FEM, you need to test the wireless module RX index, reset chip, you need to test whether the reset timing and level meet the requirements of the datasheet.

Expected result: Meet the performance indicators of each functional module.

EMC testing

Cropping principle: It can be trimmed, and the circuits related to the chip are all inside the board, and there is no signal between the boards, or the external signal of the system, it can be cropped.

Test description: Do the test according to the EMC test requirements.

Expected results: Meet the limit requirements of "Home Gateway Product Reliability Test Specification" and "Power Product Reliability Test Specification".

Temperature cycling

Cropping principle: can be cropped.

Note: Simple IC substitutions that have little temperature correlation can be trimmed, such as shift registers, logic ICs, etc.

High and low temperature start

Cropping principle: can be cropped.

Note: Simple IC substitutions that do not affect the power on and off can be cropped, such as: shift registers, logic ICs, etc.

Optical interface devices

Transmitter average transmit optical power test

Cropping principle: no cropping.

Test description: 1. Correctly establish the test environment (need to test at low temperature, normal temperature and high temperature);

2. Confirm that the ONU registration is successful;

3. Directly measure the burst power of ONU with an optical power meter with burst pulse power test function;

4. Read out the average transmitted optical power value of ONU at the working wavelength (1310nm) from the optical power meter.

Expected results: 1, -1dBm ≤ AOP≤ +4dBm;

2. 0dBm ≤ AOP≤ +4dBm (this requirement is for products using PX20+ optical modules)

Transmitter shutdown optical power test

Cropping principle: no cropping.

Test description: 1. Correctly establish the test environment (need to test at low temperature, normal temperature and high temperature);

2. When the output power of the ONU is stable, the optical power transmitted at the working wavelength (1310nm) when there is no signal input is read from the optical power meter.

Expected results: Poff (optical power off) <-60dBm

Transmitter center wavelength test

Cropping principle: no cropping.

Test description: 1. Establish the corresponding test environment (need to test at low temperature, normal temperature and high temperature); Connect the optical interface of the ONU to the optical spectrum analyzer through a beam splitter;

2. Connect the OLT to a branch of the splitter to confirm whether the registration is successful; Adjust the optical spectrum analyzer to find and read out the wavelength of the center of the main mode.

Expected results: CW=1260nm~1360nm

Transmitter RMS spectral width test

Cropping principle: no cropping.

2. Connect the OLT to a branch of the splitter to confirm whether the registration is successful; Adjust the optical spectrum analyzer to find and read out the SLM laser with a -20dB spectral width

Expected results: CW=1260nm~1360nm

Send an eye diagram test

Cropping principle: no cropping.

Test description: 1. Establish the corresponding test environment (need to test at low temperature, normal temperature and high temperature); Connect the optical signal of the ONU to the LeCroy SDA 6000A via a splitter;

2. Click Mask Test, and the eye diagram will appear.

Measurement parameters: rise time, fall time, rms jitter, PK-PK jitter, rise time and fall time of cross-point test and filter removal, eye margin: 30% at room temperature; High and low temperature 20%.

Expected Result: The optical interface sends an eye diagram without pressing the eye diagram template

Transmitter extinction ratio test

Cropping principle: no cropping.

2. Click Mask Test, and the eye diagram will appear.

Measurement parameter: extinction ratio.

Expected results: ER>9dB

Receiver sensitivity test

Cropping principle: no cropping.

Test description: 1. Correctly establish the test environment (need to test at low temperature, normal temperature and high temperature);

2. Connect the optical signal of the OLT to the input end of the optical variable attenuator;

3. Connect the output end of the optical variable attenuator to the OLT end of the optical power meter;

4. Terminate the ONT of the optical power meter to ONU;

5. Adjust the optical variable attenuator to 0 first, and then gradually increase the attenuation value until the packet is lost for 20s, and the adjustment process is as smooth and slow as possible;

6. Configure it to work at 1490nm, and measure the downlink optical power value as the receiving sensitivity of the ONU.

Expected results: SEN <-28dBm

Receiver overload optical power test

Cropping principle: no cropping.

Test description: 1. Correctly establish the test environment (need to test at low temperature, normal temperature and high temperature);

2. Connect the optical signal of the OLT to the input end of the optical variable attenuator;

3. Connect the output end of the optical variable attenuator to the OLT end of the optical power meter;

4. Terminate the ONT of the optical power meter to ONU;

5. Adjust the optical variable attenuator to 0 first, and then gradually reduce the attenuation value until the packet is lost for 20s, and the adjustment process is as smooth and slow as possible;

6. Configure it to work at 1490nm, and measure the downlink optical power value as the overload optical power of the ONU.

Expected Result: Overload Optical Power > -3dBm

DDM reports the test

Cropping principle: no cropping.

Test description: 1. Correctly establish the test environment (need to test at low temperature, normal temperature and high temperature);

2. In the state of ONU registration, then record the average optical power value with an optical power meter; The incident light connected to the ONU optical interface of the OLT was measured by the optical power meter in the 1490nm band, and the four groups of incident optical power values of -7dBm, -10dBm, -20dBm and -30dBm were selected and recorded.

3. Test the module temperature at that time with a spot thermometer and record the temperature value.

4. Finally, read the DDM value of four groups of incident light with different power through OLT or page or serial port command through OLT or page or serial port command.

Expected result: meet the voltage deviation within 100mV; The deviation of the transmitted optical power is within 0.5dBm, and the deviation of the temperature value is within 3 degrees

BEN time test

Cropping principle: can be cropped.

Test description: 1. Correctly establish the test environment (test at room temperature);

2. Enter the Constant Light command

3. The oscilloscope selects two channels, CH1 tests the TX-EN signal, and CH2 tests the optical signal.

4. After entering the normal light command, test the interval from the high level of TX-EN to the output of the optical signal.

5. After turning off the normal luminescence, test the interval between the TX-EN becoming low level and the optical signal having no output.

Expected result: burst on time<12.5ns

High and low temperature cycles

Cropping principle: no cropping.

Test description: The board can work normally under full load conditions and at room temperature. Set the temperature of the test chamber to -10°C~+50°C, keep it for 3 hours, cycle it twice, and record the link indicators during the whole board operation.

Expected result: No packet loss is recorded

High and low temperature start

Cropping principle: can be cropped. The inductance of the VCC power supply circuit of the optical module (or BOSA) must be tested in series, such as magnetic beads or jumpers.

Cropping principle: no cropping.

Test description: place the test sample in the position specified in the standard on the test table in the anechoic room, power on the test sample, verify whether it can be started normally, whether the service configuration is normal, whether the two-way service is normal, each of the same kind of network port only needs to run a single, allowing two FXS interfaces to call each other, if there is only one FXS interface, you can use the PC analog telephone to dial;

Expected results: Meet the limit requirements of "Home Gateway Product Reliability Test Specification" and "Power Product Reliability Test Specification".

Preparation:	Chen Fei	Date:	2021/5/18
Audit:	Chen Yuanchang	Date:	2021/5/18
Approve:	Wang Xizhu	Date:	2021/5/18

date	content	author	version
2021/5/18	first edition	Chen Fei	A0